FDMF3035-F135 - 5x5 mm Smart Power Stage | onsemi
N.º de pieza: FDMF3035-F135 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.1055 | $2,11 |
| 10 | $2.1055 | $21,06 |
| 100 | $2.1055 | $210,55 |
| 500 | $2.1055 | $1.052,75 |
| 1.000 | $2.1055 | $2.105,50 |
FDMF3035-F135 Descripción general
A smart power stage combines gate-drive electronics and switching transistors into one power-conversion building block. In a synchronous buck converter, the high-side and low-side MOSFETs alternately connect the switch node to the input rail and ground. Integrating those devices with the driver reduces the number of discrete components and can improve switching performance by minimizing parasitic inductance in the power path. The module also includes a bootstrap Schottky diode for high-side gate-drive support.
The FDMF3035 supports a three-state 5 V PWM input, allowing it to interface with a broad range of PWM controllers. Its FCCM pin supports diode-emulation operation intended to improve light-load efficiency. The reduced dead time and propagation delays of the integrated driver are specifically highlighted by onsemi as benefits for dynamic converter performance. These characteristics make the module relevant to compact, high-frequency synchronous buck designs where layout area, switching behavior, and controller compatibility are important.
Typical applications include notebook and computing power supplies, communications equipment, industrial DC-DC converters, and other compact systems using a controller with compatible PWM signaling. The integrated package is especially useful when the converter designer wants to reduce the number of external power-stage components while maintaining a defined driver and MOSFET arrangement. The source data does not provide complete electrical ratings, pin names, thermal resistance, or detailed timing curves, so those values must be confirmed in the manufacturer datasheet before a design is released.
When designing around the FDMF3035-F135, prioritize the power-loop layout and thermal path. Place the module close to the controller output, high-frequency capacitors, and inductor to reduce the commutation-loop area. Verify the controller voltage levels, PWM polarity, dead-time behavior, bootstrap requirements, and local input/output capacitance against the FDMF3035 datasheet. Because the module combines switching devices and driver circuitry, its package rating and thermal performance should be evaluated as a system rather than as an isolated driver IC.
Alternativas directas para FDMF3035-F135 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
FDMF3035
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FDMF3035-F135 Valores máximos y características eléctricas
| Product Type | Smart Power Stage (SPS) module |
| Topología | Half-bridge synchronous buck power stage |
| Integrated Devices | Driver IC, two power MOSFETs, and bootstrap Schottky diode |
| Encapsulado | 31-PQFN, 5 mm x 5 mm |
| PWM Input | Three-state 5 V PWM input |
| Light-Load Feature | Diode emulation supported through FCCM pin |
| Driver Feature | Reduced dead times and propagation delays |
| Power Stage Integration | Driver IC and two power MOSFETs integrated in one package |
| High-Side Support | Bootstrap Schottky diode integrated |
| Application | Synchronous buck converters |
| Manufacturer | onsemi |
Guía de configuración de pines de FDMF3035-F135 31-pqfn, 5 mm x 5 mm
Configuración de pines para FDMF3035-F135 (encapsulado 31-pqfn, 5 mm x 5 mm). Este dispositivo de potencia presenta terminales de puerta, drenador y fuente. Para encapsulados no polarizados, consulte la hoja de datos del fabricante para conocer la orientación exacta del pin 1 y los detalles del footprint. Las aplicaciones habituales incluyen el diseño de fuentes de alimentación, el accionamiento de motores y la conmutación de cargas.
No hay datos detallados de patillaje disponibles para FDMF3035-F135.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
FDMF3035-F135 es adecuado para 6 aplicacións: Compact Synchronous Buck Converter, High-Density Power Supply Module, Communications Equipment Power Rail, Industrial DC-DC Power Conversion, Notebook and Computing Power, External Power-Device Integration.
Compact Synchronous Buck Converter
The FDMF3035-F135 is suitable for the switching stage of a compact synchronous buck converter because it integrates a driver IC, two power MOSFETs, and a bootstrap Schottky diode in one 5 mm x 5 mm 31-PQFN package. Its three-state 5 V PWM input is intended to work with compatible controllers, while the integrated half-bridge can reduce external component count and help minimize power-path inductance. The design must still verify current, voltage, switching-frequency, dead-time, and thermal limits from the datasheet. In practice, place the module close to the controller and high-frequency capacitor loop so the high-di/dt switching path remains compact.
Recomendado
High-Density Power Supply Module
For high-density power-supply modules, the FDMF3035-F135 combines the gate driver, high-side and low-side power MOSFETs, and bootstrap Schottky diode in a thermally enhanced 5 mm x 5 mm package. That integration can reduce board area and simplify the power-stage assembly compared with separately placed switching devices. The module's suitability depends on the converter's voltage and current envelope, which are not specified in the supplied data. Thermal design should use the manufacturer package recommendations and verify junction temperature, copper spreading, and exposed-pad connection under worst-case load.
Recomendado
Communications Equipment Power Rail
The FDMF3035-F135 can serve in communications equipment that uses a synchronous buck converter for an intermediate DC rail. Its integrated half-bridge provides a compact switching stage, and the three-state 5 V PWM interface allows pairing with a compatible controller. Reduced dead time and propagation delays are specifically identified by onsemi as useful for dynamic performance. The exact rail voltage, load current, switching rate, and thermal conditions must be checked against the full datasheet before deployment, because those specifications are not present in the retrieved source excerpts.
Recomendado
Industrial DC-DC Power Conversion
The FDMF3035-F135 is applicable to industrial DC-DC power conversion when the converter benefits from an integrated MOSFET half-bridge and a compact package. The module can reduce the number of discrete driver and power-stage components, while diode-emulation support through the FCCM pin may improve light-load efficiency. Industrial use requires independent verification of ambient temperature, electrical stress, transient response, isolation or grounding requirements, and reliability expectations. Because no industrial or automotive qualification claim was supplied, qualification should rely on the exact manufacturer documentation and application testing rather than on the distributor category label.
Recomendado
Notebook and Computing Power
The integrated Smart Power Stage architecture of the FDMF3035-F135 is relevant to notebook and computing power designs where converter area, switching performance, and component count matter. A 5 mm x 5 mm 31-PQFN package can support compact synchronous buck layouts, and the three-state 5 V PWM input provides a defined interface to suitable controllers. The design must confirm the converter's load transients, switching frequency, input range, output current, thermal limits, and controller timing. In high-performance systems, package placement and local high-frequency capacitance are as important as the nominal component specifications.
Recomendado
External Power-Device Integration
The FDMF3035-F135 can be considered when a power-conversion design wants to replace a separately optimized driver and discrete MOSFET half-bridge with an integrated module. The driver, two power MOSFETs, and bootstrap Schottky diode are packaged together, which may simplify component sourcing and reduce the number of external power devices. That benefit does not remove the need for external inductors, high-frequency capacitors, current sensing, and controller-specific circuitry. Confirm the exact pin functions and land pattern from the official datasheet before converting an existing design.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para FDMF3035-F135 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | FDMF3035 |
|---|---|---|
| Package | 31-PQFN (5x5) | 31-PQFN (5x5) |
| Brand | onsemi | onsemi |
| Product Type | Smart Power Stage (SPS) module | Smart Power Stage (SPS) module |
| Topology | Half-bridge synchronous buck power stage | Half-bridge synchronous buck power stage |
| Integrated Devices | Driver IC, two power MOSFETs, and bootstrap Schottky diode | Driver IC, two power MOSFETs, and bootstrap Schottky diode |
| PWM Input | Three-state 5 V PWM input | Three-state 5 V PWM input |
| Diode Emulation | Supported through FCCM pin | Supported through FCCM pin |
| Switching Stage | Integrated high-side and low-side power stage | Integrated high-side and low-side power stage |
| Reference Price | $2.1055 listed for FDMF3035 as of 2026-10-20 | $2.1055 listed for FDMF3035 as of 2026-10-20 |
Diferenciadores clave
- Integrated half-bridge power-stage construction (frente a FDMF3035)
- Controller interface (frente a FDMF3035)
- Light-load control feature (frente a FDMF3035)
Notas de diseño
Use the manufacturer FDMF3035 land pattern and exposed-pad recommendations as the starting point for PCB layout. Place the module beside the controller's PWM outputs and the high-frequency input capacitors so the high-di/dt loop is as small as practical. Keep the switch-node copper compact and route high-current paths with sufficient width or copper area. Avoid sensitive signal routing beneath or immediately beside the switching node.
Treat the 5 mm x 5 mm package as a thermal system, not only an electrical footprint. Verify the exposed-pad connection, copper spreading, via arrangement, and maximum junction-temperature rise using the manufacturer data and the actual PCB stackup. Estimated: thermal performance depends on package dissipation and board copper, so no numerical junction-temperature claim should be made without verified electrical limits, ambient conditions, and thermal resistance.
The module accepts a three-state 5 V PWM input, so the controller interface must be checked for voltage levels, propagation timing, dead-time behavior, and shutdown states. Use the datasheet's recommended gate-drive and power-loop arrangement, and keep the controller ground connection short to the module power ground. Validate the switching node with an appropriate probe and ground spring to avoid adding measurement error to a high-dV/dt waveform.
Do not substitute a similarly named or similarly packaged power module without checking the complete pinout and ratings. The supplied data confirms the 31-PQFN 5 x 5 mm package and integrated Smart Power Stage architecture, but it does not provide complete voltage, current, timing, thermal, or pin-function data for FDMF3035-F135. Confirm those details in the official datasheet before layout, firmware integration, or production sourcing.
Información de cumplimiento
The supplied verified data does not explicitly state compliance or qualification status for FDMF3035-F135. Obtain current onsemi documentation for the exact ordering variant.
