FDMF3035-F135 - 5x5 mm Smart Power Stage | onsemi
料号： FDMF3035-F135 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.1055 | $2.11 |
| 10 | $2.1055 | $21.06 |
| 100 | $2.1055 | $210.55 |
| 500 | $2.1055 | $1,052.75 |
| 1,000 | $2.1055 | $2,105.50 |
FDMF3035-F135 概述
A smart power stage combines gate-drive electronics and switching transistors into one power-conversion building block. In a synchronous buck converter, the high-side and low-side MOSFETs alternately connect the switch node to the input rail and ground. Integrating those devices with the driver reduces the number of discrete components and can improve switching performance by minimizing parasitic inductance in the power path. The module also includes a bootstrap Schottky diode for high-side gate-drive support.
The FDMF3035 supports a three-state 5 V PWM input, allowing it to interface with a broad range of PWM controllers. Its FCCM pin supports diode-emulation operation intended to improve light-load efficiency. The reduced dead time and propagation delays of the integrated driver are specifically highlighted by onsemi as benefits for dynamic converter performance. These characteristics make the module relevant to compact, high-frequency synchronous buck designs where layout area, switching behavior, and controller compatibility are important.
Typical applications include notebook and computing power supplies, communications equipment, industrial DC-DC converters, and other compact systems using a controller with compatible PWM signaling. The integrated package is especially useful when the converter designer wants to reduce the number of external power-stage components while maintaining a defined driver and MOSFET arrangement. The source data does not provide complete electrical ratings, pin names, thermal resistance, or detailed timing curves, so those values must be confirmed in the manufacturer datasheet before a design is released.
When designing around the FDMF3035-F135, prioritize the power-loop layout and thermal path. Place the module close to the controller output, high-frequency capacitors, and inductor to reduce the commutation-loop area. Verify the controller voltage levels, PWM polarity, dead-time behavior, bootstrap requirements, and local input/output capacitance against the FDMF3035 datasheet. Because the module combines switching devices and driver circuitry, its package rating and thermal performance should be evaluated as a system rather than as an isolated driver IC.
直接替换替代料： FDMF3035-F135 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
FDMF3035
✅ 直接替换📋 参考替代料（不在目录中）
FDMF3035-F135 最大额定值与电气特性
| Product Type | Smart Power Stage (SPS) module |
| 拓扑 | Half-bridge synchronous buck power stage |
| Integrated Devices | Driver IC, two power MOSFETs, and bootstrap Schottky diode |
| 封装 | 31-PQFN, 5 mm x 5 mm |
| PWM Input | Three-state 5 V PWM input |
| Light-Load Feature | Diode emulation supported through FCCM pin |
| Driver Feature | Reduced dead times and propagation delays |
| Power Stage Integration | Driver IC and two power MOSFETs integrated in one package |
| High-Side Support | Bootstrap Schottky diode integrated |
| Application | Synchronous buck converters |
| Manufacturer | onsemi |
FDMF3035-F135 31-pqfn, 5 mm x 5 mm 引脚配置指南
FDMF3035-F135（31-pqfn, 5 mm x 5 mm 封装）的引脚配置。 该功率器件具有栅极、漏极和源极端子。对于无极性封装，请参阅制造商数据手册以了解确切的引脚 1 方向和封装尺寸细节。常见应用包括电源设计、电机驱动和负载开关。
暂无详细引脚数据： FDMF3035-F135.
请参阅 数据手册 以查看完整引脚配置。
典型应用
FDMF3035-F135 适用于 6 应用s: Compact Synchronous Buck Converter, High-Density Power Supply Module, Communications Equipment Power Rail, Industrial DC-DC Power Conversion, Notebook and Computing Power, External Power-Device Integration.
Compact Synchronous Buck Converter
The FDMF3035-F135 is suitable for the switching stage of a compact synchronous buck converter because it integrates a driver IC, two power MOSFETs, and a bootstrap Schottky diode in one 5 mm x 5 mm 31-PQFN package. Its three-state 5 V PWM input is intended to work with compatible controllers, while the integrated half-bridge can reduce external component count and help minimize power-path inductance. The design must still verify current, voltage, switching-frequency, dead-time, and thermal limits from the datasheet. In practice, place the module close to the controller and high-frequency capacitor loop so the high-di/dt switching path remains compact.
推荐
High-Density Power Supply Module
For high-density power-supply modules, the FDMF3035-F135 combines the gate driver, high-side and low-side power MOSFETs, and bootstrap Schottky diode in a thermally enhanced 5 mm x 5 mm package. That integration can reduce board area and simplify the power-stage assembly compared with separately placed switching devices. The module's suitability depends on the converter's voltage and current envelope, which are not specified in the supplied data. Thermal design should use the manufacturer package recommendations and verify junction temperature, copper spreading, and exposed-pad connection under worst-case load.
推荐
Communications Equipment Power Rail
The FDMF3035-F135 can serve in communications equipment that uses a synchronous buck converter for an intermediate DC rail. Its integrated half-bridge provides a compact switching stage, and the three-state 5 V PWM interface allows pairing with a compatible controller. Reduced dead time and propagation delays are specifically identified by onsemi as useful for dynamic performance. The exact rail voltage, load current, switching rate, and thermal conditions must be checked against the full datasheet before deployment, because those specifications are not present in the retrieved source excerpts.
推荐
Industrial DC-DC Power Conversion
The FDMF3035-F135 is applicable to industrial DC-DC power conversion when the converter benefits from an integrated MOSFET half-bridge and a compact package. The module can reduce the number of discrete driver and power-stage components, while diode-emulation support through the FCCM pin may improve light-load efficiency. Industrial use requires independent verification of ambient temperature, electrical stress, transient response, isolation or grounding requirements, and reliability expectations. Because no industrial or automotive qualification claim was supplied, qualification should rely on the exact manufacturer documentation and application testing rather than on the distributor category label.
推荐
Notebook and Computing Power
The integrated Smart Power Stage architecture of the FDMF3035-F135 is relevant to notebook and computing power designs where converter area, switching performance, and component count matter. A 5 mm x 5 mm 31-PQFN package can support compact synchronous buck layouts, and the three-state 5 V PWM input provides a defined interface to suitable controllers. The design must confirm the converter's load transients, switching frequency, input range, output current, thermal limits, and controller timing. In high-performance systems, package placement and local high-frequency capacitance are as important as the nominal component specifications.
推荐
External Power-Device Integration
The FDMF3035-F135 can be considered when a power-conversion design wants to replace a separately optimized driver and discrete MOSFET half-bridge with an integrated module. The driver, two power MOSFETs, and bootstrap Schottky diode are packaged together, which may simplify component sourcing and reduce the number of external power devices. That benefit does not remove the need for external inductors, high-frequency capacitors, current sensing, and controller-specific circuitry. Confirm the exact pin functions and land pattern from the official datasheet before converting an existing design.
推荐
推荐产品汇总
工程参考数据： FDMF3035-F135 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | FDMF3035 |
|---|---|---|
| Package | 31-PQFN (5x5) | 31-PQFN (5x5) |
| Brand | onsemi | onsemi |
| Product Type | Smart Power Stage (SPS) module | Smart Power Stage (SPS) module |
| Topology | Half-bridge synchronous buck power stage | Half-bridge synchronous buck power stage |
| Integrated Devices | Driver IC, two power MOSFETs, and bootstrap Schottky diode | Driver IC, two power MOSFETs, and bootstrap Schottky diode |
| PWM Input | Three-state 5 V PWM input | Three-state 5 V PWM input |
| Diode Emulation | Supported through FCCM pin | Supported through FCCM pin |
| Switching Stage | Integrated high-side and low-side power stage | Integrated high-side and low-side power stage |
| Reference Price | $2.1055 listed for FDMF3035 as of 2026-10-20 | $2.1055 listed for FDMF3035 as of 2026-10-20 |
关键差异点
- Integrated half-bridge power-stage construction （对比 FDMF3035)
- Controller interface （对比 FDMF3035)
- Light-load control feature （对比 FDMF3035)
设计说明
Use the manufacturer FDMF3035 land pattern and exposed-pad recommendations as the starting point for PCB layout. Place the module beside the controller's PWM outputs and the high-frequency input capacitors so the high-di/dt loop is as small as practical. Keep the switch-node copper compact and route high-current paths with sufficient width or copper area. Avoid sensitive signal routing beneath or immediately beside the switching node.
Treat the 5 mm x 5 mm package as a thermal system, not only an electrical footprint. Verify the exposed-pad connection, copper spreading, via arrangement, and maximum junction-temperature rise using the manufacturer data and the actual PCB stackup. Estimated: thermal performance depends on package dissipation and board copper, so no numerical junction-temperature claim should be made without verified electrical limits, ambient conditions, and thermal resistance.
The module accepts a three-state 5 V PWM input, so the controller interface must be checked for voltage levels, propagation timing, dead-time behavior, and shutdown states. Use the datasheet's recommended gate-drive and power-loop arrangement, and keep the controller ground connection short to the module power ground. Validate the switching node with an appropriate probe and ground spring to avoid adding measurement error to a high-dV/dt waveform.
Do not substitute a similarly named or similarly packaged power module without checking the complete pinout and ratings. The supplied data confirms the 31-PQFN 5 x 5 mm package and integrated Smart Power Stage architecture, but it does not provide complete voltage, current, timing, thermal, or pin-function data for FDMF3035-F135. Confirm those details in the official datasheet before layout, firmware integration, or production sourcing.
合规信息
The supplied verified data does not explicitly state compliance or qualification status for FDMF3035-F135. Obtain current onsemi documentation for the exact ordering variant.
