ISL33002IUZ-T - 2-Ch I2C Bus Buffer Hot-Swap | Renesas
N.º de pieza: ISL33002IUZ-T ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0.65 | $0,65 |
| 10 | $0.59 | $5,90 |
| 100 | $0.49 | $49,00 |
| 500 | $0.4 | $200,00 |
| 1.000 | $0.33 | $330,00 |
ISL33002IUZ-T Descripción general
An I2C bus buffer, also called a bus accelerator or signal repeater, is an interface IC that regenerates the SDA and SCL signals so the total bus capacitance can exceed the 400pF limit defined by the I2C specification. Within the signal-chain hierarchy (buffer -> interface IC -> signal buffer/repeater), bus buffers isolate capacitance on either side of the device, allowing long cables, large backplanes, and high fan-out systems to communicate reliably at standard I2C data rates.
Key features include bus capacitance buffering beyond the 400pF I2C maximum, rise-time accelerator circuitry that reduces power consumption otherwise wasted in passive pull-up resistors while improving data-rate performance, hot-swap circuitry that prevents bus corruption during live card insertion, and robust ESD protection of ±6kV Class 3 HBM on all pins, with ±12kV HBM on the SDA/SCL pins.
The device supports logic level translation between voltage domains, includes an accelerator disable pin for flexible system control, and provides low quiescent current. Operation over an industrial -40C to +85C temperature range makes the -T (tape-and-reel, industrial temperature grade) variant suitable for factory and telecom equipment. The 8 Ld MSOP occupies only 3mm x 3mm of board area.
Typical applications include I2C bus extension across backplanes and racks, hot-swappable line cards, level translation between 1.8V/3.3V/5V domains, and server or networking chassis management buses (such as IPMB-style monitoring). The buffer fits wherever capacitance, cable length, or card insertion would otherwise corrupt I2C signaling.
A key design consideration: enable the accelerator circuit only when bus rise times are marginal with the chosen pull-up resistors, since excessive acceleration can cause signal ringing on lightly loaded buses.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para ISL33002IUZ-T — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ISL33002IUZ-T (mismo factor de forma y huella) — difiere en Function, Packaging, Package, Number of Channels, Channels.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ISL33001IUZ-T
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$0.33 / unidad
Ver hoja de datos →ISL33003IUZ-T
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$0.33 / unidad
Ver hoja de datos →ISL33002IUZ
✅ Sustitución directa✓ En stock
$0.45 / unidad
Ver hoja de datos →ISL33002IUZ-T7
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ISL33001IUZ
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$0.43 / unidad
Ver hoja de datos →ISL33002IUZ-T Especificaciones
| Función | 2-channel I2C bus buffer with rise-time accelerators and hot-swap |
| Supply Voltage Range | +2.3 V to +5.5 V |
| Velocidad de datos | >400 kHz operation |
| Bus Capacitance Buffering | Extends beyond the 400 pF I2C specification maximum |
| ESD Protection (all pins) | ±6 kV HBM Class 3 |
| ESD Protection (SDA/SCL pins) | ±12 kV HBM |
| Level Translation | Yes |
| Accelerator Disable Pin | Yes |
| Hot-Swap Capability | Yes |
| Corriente en reposo | Low (value per manufacturer datasheet) |
| Canales | 2 |
| Encapsulado | 8 Ld MSOP |
| Tipo de montaje | Surface Mount |
| Temperature Grade | Industrial (-40C, per Mouser listing) |
| Estado RoHS | Pb-free / RoHS compliant |
| Packaging | Tape and Reel (-T suffix) |
Guía de configuración de pines de ISL33002IUZ-T 8 ld msop
Configuración de pines para ISL33002IUZ-T (encapsulado 8 ld msop). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para ISL33002IUZ-T.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ISL33002IUZ-T es adecuado para 6 aplicacións: Backplane I2C Bus Extension, Hot-Swap Line Cards and Modules, Logic Level Translation Between Voltage Domains, Server and Telecom Management Buses, Industrial Factory Automation, Consumer Electronics Display and Sensor Buses.
Backplane I2C Bus Extension
In chassis and rack systems, the shared management I2C bus spans multiple slots, connectors, and cable harnesses, easily exceeding the 400pF capacitance ceiling defined by the I2C specification. The ISL33002IUZ-T buffers both SDA and SCL so capacitance is partitioned per segment, allowing >400kHz signaling across long backplanes. Its rise-time accelerators restore fast edges without resorting to very low-value pull-up resistors, cutting static pull-up power on the rail. The 8-lead MSOP fits tightly into slot-level line card layouts, and the industrial -40C grade suits telecom and server environments where ambient temperatures vary widely across the chassis.
Recomendado
Hot-Swap Line Cards and Modules
When a card is inserted into a live backplane, the undriven connector pins and card-side capacitance transiently load the bus and can corrupt in-flight I2C data. The ISL33002IUZ-T includes dedicated hot-swap circuitry that keeps the card-side bus inactive during insertion, then engages cleanly, preventing bus stalls. Its ±6kV HBM Class 3 ESD protection on all pins - and ±12kV HBM on SDA/SCL - adds robustness against insertion-induced transients. Operating from +2.3V to +5.5V lets the card-side logic run at 3.3V while the backplane segment runs at 5V, with level translation handled by the same device.
Recomendado
Logic Level Translation Between Voltage Domains
Mixed-voltage systems frequently need to join a 1.8V or 2.5V sensor segment with a 3.3V or 5V controller segment on one I2C network. The ISL33002IUZ-T supports a +2.3V to +5.5V supply range and performs logic level translation as part of its buffering function, eliminating an additional translator stage. Because it actively drives both sides rather than relying on passive MOSFET switching, it maintains signal integrity where capacitance is high - precisely the condition where passive translators perform worst. Its accelerator disable pin lets the designer tune edge rates for EMI-sensitive or short-signal segments, and low quiescent current suits battery-backed management rails.
Recomendado
Server and Telecom Management Buses
Platform management buses (such as IPMB-style networks in ATCA/MicroTCA chassis) rely on I2C to reach dozens of FRU temperature, voltage, and EEPROM devices. Aggregate capacitance and cable length routinely exceed specification limits, producing NACK errors and bus hangs. Placing ISL33002IUZ-T buffers at segment boundaries regenerates the SDA/SCL drive and confines faults to one segment. The hot-swap function is essential because FRUs are inserted while the chassis is powered, and the ±12kV HBM rating on SDA/SCL provides margin against handling-induced ESD during board assembly and field servicing in telecom central offices.
Recomendado
Industrial Factory Automation
Factory automation controllers distribute I2C to sensor clusters, displays, and configuration EEPROMs across control cabinets where wiring adds hundreds of picofarads. The ISL33002IUZ-T extends bus reach beyond the 400pF limit while its >400kHz operation preserves fast polling cycles for real-time monitoring loops. The industrial -40C temperature grade accommodates unheated cabinets and cold-start conditions. Its ±6kV HBM protection across all pins helps survive harsh industrial EMI environments, and the accelerator disable pin lets engineers trade edge speed for reduced ringing on heavily shielded cable runs. Low quiescent current suits always-on supervision supplies in continuous-duty production equipment.
Recomendado
Consumer Electronics Display and Sensor Buses
Television panels, set-top boxes, and smart appliances route I2C between an SoC, EDID EEPROMs, tuning modules, and touch or ambient-light sensors spread across a large chassis; connector and flex-cable capacitance commonly pushes the bus past 400pF. The ISL33002IUZ-T buffers the bus locally, enabling reliable 100/400kHz communication across the distributed network, and its small 3mm x 3mm 8-MSOP footprint suits dense consumer board layouts. The wide +2.3V to +5.5V supply range matches typical consumer standby and main rails, and hot-swap protection prevents bus lockup when HDMI or module interfaces are plugged in during operation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ISL33002IUZ-T — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ISL33001IUZ-T | ISL33003IUZ-T | ISL33002IUZ |
|---|---|---|---|---|
| Package | 8-MSOP | 8-MSOP - same | 8-MSOP - same | 8-MSOP - same |
| Brand | Renesas Electronics (Intersil) | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Channels | 2 (SDA + SCL) | 2 | 2 | 2 |
| Supply Voltage | +2.3 V to +5.5 V | +2.3 V to +5.5 V | +2.3 V to +5.5 V | +2.3 V to +5.5 V |
| Data Rate | >400 kHz | >400 kHz | >400 kHz | >400 kHz |
| Packaging Format | Tape & Reel (-T) | Tape & Reel | Tape & Reel | Tray/Tube |
Diferenciadores clave
- Combined accelerator + hot-swap feature set (frente a ISL33001IUZ-T)
- ±12kV HBM ESD on SDA/SCL pins (frente a ISL33003IUZ-T)
- Trade-off: package size vs feature integration (frente a TCA9517DR)
Notas de diseño
Use the accelerator disable pin to tune edge rates: on lightly loaded bus segments, the rise-time accelerators can cause ringing or double-clocking due to over-acceleration. Enable them only on segments where measured rise times exceed the I2C rise-time budget (typically when bus capacitance approaches or exceeds 400pF). Measure with an oscilloscope at both ends of the longest bus segment; a rising edge that rings below the 0.3*VDD threshold will be read as a glitch.
When substituting within the ISL33001/33002/33003 family, do not assume feature parity: the three parts share the same 8-MSOP footprint and supply range but differ in the accelerator and hot-swap feature mix per the shared family datasheet. A design relying on hot-swap protection must not be populated with a family variant lacking it, even though the footprint is identical. Verify the feature table and pin function descriptions before any BOM swap.
Place the buffer as close as possible to the segment boundary (connector or card edge) so the capacitance partition actually falls at the buffer. Decouple VCC with a 0.1uF ceramic capacitor placed within 2mm of the supply pin. Route SDA/SCL on adjacent layers with a ground reference to control coupling on long backplane runs, and keep stub lengths on tapped devices short to limit reflected-capacitance loading on either segment.
Información de cumplimiento
Pb-free w/ anneal (RoHS compliant) per Mouser listing and Renesas product page. No REACH, halogen-free, AEC-Q100, or conflict-minerals statements found in the provided data.
