NTS0304EUKZ - 4-Bit Dual-Supply Level Translator | NXP
N.º de pieza: NTS0304EUKZ ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1.45 | $1,45 |
| 10 | $1.35 | $13,50 |
| 100 | $1.18 | $118,00 |
| 500 | $1.05 | $525,00 |
| 1.000 | $0.92 | $920,00 |
NTS0304EUKZ Descripción general
A dual-supply level translator is a type of voltage-level conversion IC, part of the broader logic family of buffers, drivers and transceivers within the signal-integration hierarchy of semiconductor components. Its role is to safely connect digital devices operating at different supply rails, such as a 1.8 V microcontroller and a 3.3 V peripheral, preventing overvoltage damage and logic-level misreads that would occur with direct connection.
Key features include four independent bidirectional channels with automatic direction sensing, which eliminates the need for a DIR pin and simplifies bus designs; open-drain outputs supporting open-drain buses such as I2C-style topologies; and a single output enable (OE) input that places all I/O in a high-impedance state when deasserted.
Architecturally, the device features eight 1-bit input-output ports (A and B ports), one OE input, and two supply pins (VCC(A) and VCC(B)). Because outputs are open-drain, external pull-up resistors set the logic-high level on each side, allowing rail levels to be chosen almost independently of the supply voltages. According to the NXP NTS0304E product data sheet Rev. 1.3 (9 October 2023), this makes the family well suited to mixed-voltage bidirectional signaling.
Typical applications include I2C and SMBus level shifting between controllers and peripherals, bidirectional GPIO translation between MCUs of different voltage classes, and mixed-voltage board-to-board communication. The WLCSP package suits space-constrained portable and wearable designs.
Design consideration: because the outputs are open drain, always provide appropriate pull-up resistors sized for the bus capacitance and desired rise time; the auto-direction sensing requires the bus to default high.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and application guidance not found in the manufacturer datasheet.
Alternativas directas para NTS0304EUKZ — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
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NTS0304EUK
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NTS0304EUKZ Valores máximos y características eléctricas
| Función | 4-bit dual-supply translating transceiver, open drain, auto direction sensing |
| Number of Channels | 4 bidirectional (8 I/O ports A and B) |
| VCC(A) Supply Range | 0.95 V to 3.6 V |
| Tipo de salida | Open drain |
| Direction Control | Auto-direction sensing (no DIR pin) |
| Output Enable | Yes (OE input, high-impedance when disabled) |
| Encapsulado | 12-WLCSP (1.42 x 1.97 mm) |
| Tipo de montaje | Surface Mount |
| Applications | Voltage level translation, I2C-style buses, mixed-voltage interfaces |
| Family | NTS0302 / NTS0304E translating transceivers |
| Data Sheet Revision | Rev. 1.3 - 9 October 2023 |
| Estado RoHS | Compliant (Z suffix = lead-free/RoHS version) |
Guía de configuración de pines de NTS0304EUKZ 12-wlcsp (1.42 x 1.97 mm)
Configuración de pines para NTS0304EUKZ (encapsulado 12-wlcsp (1.42 x 1.97 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para NTS0304EUKZ.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
NTS0304EUKZ es adecuado para 6 aplicacións: I2C / SMBus Level Shifting, Mixed-Voltage GPIO Translation, Portable and Wearable Devices, Board-to-Board Communication, Automotive Body and Comfort Electronics, Industrial Control and Sensor Hubs.
I2C / SMBus Level Shifting
The NTS0304EUKZ is a natural fit for I2C and SMBus level shifting because its open-drain outputs mirror the open-drain nature of SDA and SCL lines, and its auto-direction sensing handles the bus's bidirectional traffic with no DIR pin to manage. With VCC(A) supported down to 0.95 V, it can bridge a sub-1V-class controller to a 3.3 V peripheral domain; pull-up resistors on each side independently set the logic-high level of each domain per the NXP data sheet. In a typical circuit, the four channels carry SDA/SCL pairs of two independent I2C buses, with 2.2k-10k ohm pull-ups sized for bus capacitance and target rise time. The OE input can tri-state the bus during power sequencing or fault conditions, and the 1.42 x 1.97 mm WLCSP keeps translator overhead minimal in dense sensor hubs and wearable designs.
Recomendado
Mixed-Voltage GPIO Translation
General-purpose IO signals between a low-voltage MCU (for example a 1.2 V or 1.8 V core-domain port) and 3.3 V board-level logic can be translated bidirectionally with the NTS0304EUKZ. Its auto direction sensing means a single 4-bit translator handles signals whose direction changes dynamically, avoiding firmware-driven DIR toggling and the race conditions that come with it. Because outputs are open drain, each signal's high level is set by its own pull-up to the receiving domain's rail, so a mix of 1.8 V and 3.3 V signals can share one device. VCC(A) operating from 0.95 V to 3.6 V per the NXP data sheet covers all common low-voltage rails. Designers should account for the pull-up rise time on capacitive lines and deassert OE during reset to keep the port high-impedance while the MCU pins are still tristated.
Recomendado
Portable and Wearable Devices
The 12-ball WLCSP package measuring only 1.42 x 1.97 mm makes the NTS0304EUKZ attractive for smartphones, wearables, hearables, and other battery-powered products where board area is the scarcest resource. It provides four bidirectional translation channels in roughly the footprint of a 0402 passive component pair, interfacing between a low-voltage application processor IO bank and peripheral ICs on higher rails such as 1.8 V or 3.3 V sensors and codecs. VCC(A) down to 0.95 V supports modern sub-1V-class core rails, and the open-drain architecture is directly compatible with the I2C buses ubiquitous in these systems. Care is required in assembly since WLCSP ball pitch demands standard fine-pitch SMT processes; no special handling beyond typical MSL storage practice was specified in the verified data.
Recomendado
Board-to-Board Communication
When two PCBs in one system run different logic rails - for example a 1.8 V baseboard processor and a 3.3 V module - the NTS0304EUKZ placed on the baseboard safely bridges the four most critical control and data lines across the connector. Open-drain outputs make it tolerant of the shared, multidrop nature of many board-to-board buses (status lines, interrupts, configuration I2C), and auto direction sensing means one part serves lines whose direction changes per transaction. The NXP data sheet specifies VCC(A) from 0.95 V to 3.6 V, so either side of the connector can be the low rail. Designers should place pull-ups near the receiving side, keep the WLCSP traces short to limit stub effects, and use OE to isolate the interconnect during power-up sequencing of the two boards.
Recomendado
Automotive Body and Comfort Electronics
Mixed-voltage translation between a 3.3 V or 5 V-tolerant body controller domain and lower-voltage sensor or switch-monitoring circuitry is a common requirement in automotive body, door, and comfort modules. The NTS0304EUKZ's auto-direction open-drain channels suit bidirectional status and control lines such as switch busses and configuration interfaces, while its tiny WLCSP conserves PCB area in dense junction boxes. Note that AEC-Q100 qualification status for this part was not stated in the verified data, so automotive designers must confirm grade requirements with NXP before use in safety-relevant positions. VCC(A) operating down to 0.95 V supports modern low-voltage processor IO, and pull-up resistor choice sets each side's high level; add series resistors and local TVS protection at connectors per standard automotive EMC practice.
Recomendado
Industrial Control and Sensor Hubs
Industrial controllers frequently combine legacy 3.3 V or 5 V logic with newer low-voltage MCUs and sensors; the NTS0304EUKZ translates four bidirectional lines between these domains in one tiny package. Open-drain outputs are compatible with shared status and alert buses (for example open-drain interrupt or SMBus alert lines), and auto direction sensing removes direction control firmware entirely on multidrop lines. With VCC(A) from 0.95 V to 3.6 V per the NXP data sheet, the device bridges modern 1.2 V/1.8 V FPGA or MCU banks to 3.3 V sensor and actuator interfaces. In noisy environments, choose pull-up values that dominate line capacitance for sharp edges, keep OE deasserted until both rails are stable, and route the WLCSP short traces with solid ground reference for EMI robustness.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para NTS0304EUKZ — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | NTS0304EUK |
|---|---|---|
| Package | 12-WLCSP (1.42 x 1.97 mm) | 12-WLCSP (same UK ball map) |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Channels | 4 bidirectional (8 I/O) | 4 bidirectional (8 I/O) |
| VCC(A) Range | 0.95 V to 3.6 V | 0.95 V to 3.6 V |
| Output Type | Open drain | Open drain |
| Direction Control | Auto-direction sensing | Auto-direction sensing |
| Output Enable (OE) | Yes | Yes |
Diferenciadores clave
- Auto direction sensing eliminates DIR pin (frente a Push-pull DIR-controlled translators (e.g., standard 74LVC transceivers))
- Extreme board-space efficiency (frente a Same-function SOIC/QFN level translators)
- Per-side independent pull-up rail levels (frente a Fixed-ratio push-pull translators)
Notas de diseño
The NTS0304EUKZ uses a 12-ball WLCSP (1.42 x 1.97 mm) with a proprietary ball map. Follow the NXP NTS0304E data sheet (Rev. 1.3, October 2023) land-pattern recommendations exactly - WLCSP pads require the specified non-solder-mask-defined (NSMD) geometry for reliable ball joints. Route A-side and B-side traces short and direct, keep pull-up resistors close to their respective I/O balls, and pour a solid ground plane on the layer immediately beneath the device for signal return integrity.
Because the outputs are open drain, omitting pull-up resistors leaves the bus floating and the auto-direction sensing cannot resolve line state - the most common bring-up failure with this family. Size pull-ups (typically 2.2k-10k ohms) for total bus capacitance and required rise time on each domain. Also deassert OE until both VCC(A) and VCC(B) are stable to prevent partially-powered logic levels from propagating across voltage domains during power sequencing.
Supply VCC(A) within its 0.95 V to 3.6 V range and VCC(B) per the data sheet limits; a 100 nF ceramic decoupling capacitor at each supply ball is standard practice for WLCSP logic. Estimated: the translator's own supply current is small compared with the pull-up resistor current it must sink - for example, a 3.3 V rail with a 3.3k ohm pull-up draws about 1 mA per active-low channel, which is within the device's drive capability but should be summed across all four channels when budgeting the low-voltage rail.
Información de cumplimiento
Z suffix denotes NXP RoHS-compliant, lead-free packaging per standard NXP ordering-code convention. REACH, halogen-free, and conflict-minerals declarations were not present in the verified data - consult the NXP product page compliance portal.
