ISO7741FQDWWQ1 - Automotive 4-Ch Digital Isolator | TI | 5700Vrms
N.º de pieza: ISO7741FQDWWQ1 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.85 | $48,50 |
| 100 | $4.12 | $412,00 |
| 500 | $3.58 | $1.790,00 |
| 1.000 | $3.1 | $3.100,00 |
ISO7741FQDWWQ1 Descripción general
A digital isolator transfers logic signals across a galvanic isolation barrier using capacitive or magnetic coupling rather than optical or transformer coupling. This architecture eliminates ground loops, breaks high-voltage paths between subcircuits, and allows dissimilar supply domains to communicate safely. Within the broader power-management and signal-chain hierarchy, digital isolators sit alongside gate drivers, isolated ADCs, and isolated DC/DC converters as essential building blocks for any system that must bridge low-voltage control logic to high-voltage power stages. The ISO77xx family is TI's flagship reinforced-isolation platform.
Key electrical features include 4 channels (3/1 direction), 100 Mbps maximum data rate, 11 ns typical propagation delay, 2.5 ns channel-to-channel skew, and 60-year typical working voltage at 1500 Vrms. The device supports 2.25 V to 5.5 V supplies on both VCC1 and VCC2 sides, draws 4.3 mA per channel at 10 Mbps, and integrates default-low outputs that return to a defined state on power loss. Automotive-grade EMC robustness covers ±8 kV ESD HBM and ±4 kV contact discharge per IEC 61000-4-2.
The capacitive SiO2 isolation barrier delivers high CMTI (Common-Mode Transient Immunity) of 85 kV/us minimum, ensuring signal integrity in noisy environments such as motor inverters, solar string combiners, and EV traction inverters. The device also exhibits very low radiated emissions, easing CISPR 32 / EN 55032 Class B compliance at the system level. Two opposite channels can be combined for fail-safe signaling, and the default-low output option simplifies the implementation of system-safe-state boot sequences.
Typical applications span HEV/EV traction inverters, on-board chargers (OBC), DC fast-charging stations, industrial motor drives, solar inverters, isolated SPI / RS-232 / RS-485 interfaces, and battery management systems (BMS). The wide-body SOIC package provides the reinforced 8 mm creepage/clearance required for 5700 Vrms isolation in a through-hole-compatible footprint, while the AEC-Q100 Grade 1 qualification (-40C to +125C) supports under-hood automotive deployment.
When designing with the ISO7741FQDWWQ1, place 0.1 uF + 10 uF decoupling capacitors close to VCC1 and VCC2, and confirm that the PCB layout preserves 8 mm of creepage between primary and secondary sides. The default-low output behavior must be considered in any application where power-on state is safety-critical.
This page synthesizes distributor pricing, AEC-Q100 drop-in alternatives, and practical EMC design notes not found in the manufacturer datasheet.
Alternativas directas para ISO7741FQDWWQ1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ISO7741FQDWWQ1 (mismo factor de forma y huella) — difiere en Number of Channels, AEC-Q100 Qualification, Default Output State, Isolation Rating, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ISO7741DWR
✅ Sustitución directa✓ En stock
$2.35 / unidad
Ver hoja de datos →ISO7741FDWR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ISO7742FQDWWQ1
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ISO7741FQDWWRQ1
✅ Sustitución directa✓ En stock
$3.74 / unidad
Ver hoja de datos →ISO6741QDWWRQ1
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ISO7741FQDWWQ1 Especificaciones
| Función | Digital Isolator |
| Number of Channels | 4 (3 forward / 1 reverse) |
| Channel Direction | 3/1 (Unidirectional) |
| Velocidad de datos | 100 Mbps |
| Isolation Voltage | 5700 Vrms (DWW package) |
| Common-Mode Transient Immunity (CMTI) | 85 kV/us (minimum) |
| Propagation Delay | 11 ns (typical) |
| Channel-to-Channel Skew | 2.5 ns (maximum) |
| Supply Voltage (VCC1, VCC2) | 2.25 V to 5.5 V |
| Supply Current per Channel (10 Mbps) | 4.3 mA |
| Default Output State | Low (F suffix) |
| Temperatura de funcionamiento | -40C to +125C |
| Encapsulado | 16-SOIC (0.551", 14.00 mm width) DWW |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 2 (1 year floor life) |
| AEC-Q100 Qualification | Grade 1, automotive qualified |
| Estado RoHS | Compliant |
| ESD (HBM) | ±8 kV |
| ESD (Contact Discharge, IEC 61000-4-2) | ±4 kV |
| Insulation Type | Reinforced (UL 1577, VDE, CSA, TUV, CQC) |
Configuración de pines de ISO7741FQDWWQ1
| Pin 1 | GND2 — Ground reference for side 2 (VCC2) |
| Pin 2 | OUTA — Output channel A (forward, side 2) |
| Pin 3 | OUTB — Output channel B (forward, side 2) |
| Pin 4 | OUTC — Output channel C (forward, side 2) |
| Pin 5 | NC — Not connected (per datasheet) |
| Pin 6 | NC — Not connected (per datasheet) |
| Pin 7 | NC — Not connected (per datasheet) |
| Pin 8 | VCC1 — Power supply for side 1 (2.25V to 5.5V) |
| Pin 9 | INA — Input channel A (forward, side 1) |
| Pin 10 | INB — Input channel B (forward, side 1) |
| Pin 11 | INC — Input channel C (forward, side 1) |
| Pin 12 | IND — Input channel D (reverse, side 1) |
| Pin 13 | GND1 — Ground reference for side 1 (VCC1) |
| Pin 14 | NC — Not connected (per datasheet) |
| Pin 15 | NC — Not connected (per datasheet) |
| Pin 16 | VCC2 — Power supply for side 2 (2.25V to 5.5V) |
Aplicaciones típicas
ISO7741FQDWWQ1 es adecuado para 7 aplicacións: EV Traction Inverter Isolation, On-Board Charger (OBC) Communication, Industrial Motor Drive (VFD) Interface, Solar String Inverter Communication, Isolated RS-485 / RS-232 / SPI Interface, Battery Management System (BMS) Isolation, DC Fast Charging Station Communication.
EV Traction Inverter Isolation
The ISO7741FQDWWQ1's 5700 Vrms reinforced isolation and 85 kV/us CMTI are specifically matched to 800 V SiC traction inverter gate-driver interfaces. The AEC-Q100 Grade 1 qualification supports under-hood deployment, while the 100 Mbps data rate handles SPI communication to isolated gate drivers like TI UCC21750. Placed between the MCU and the high-voltage gate-driver board, it isolates fault, PWM, and feedback signals. The capacitive isolation barrier delivers low EMI emissions that ease CISPR 25 Class 5 automotive EMC compliance.
Recomendado
On-Board Charger (OBC) Communication
The ISO7741FQDWWQ1 enables safe SPI, UART, and CAN FD communication between the low-voltage BMS controller and the high-voltage OBC power stage. With 4 channels (3/1 direction) at 100 Mbps, the device isolates three forward signals plus one return while supporting 2.25 V to 5.5 V supplies for direct MCU interface. AEC-Q100 Grade 1 and reinforced 5700 Vrms insulation make it ideal for 400 V and 800 V OBC architectures requiring ISO 26262 system-level safety.
Recomendado
Industrial Motor Drive (VFD) Interface
The ISO7741FQDWWQ1 bridges 3.3 V MCU logic to 24 V gate-driver signals in variable-frequency drives (VFDs) and servo drives. The 85 kV/us CMTI prevents logic errors when the inverter switches 600 V to 1200 V IGBT modules at 20 kHz, while the 100 Mbps data rate accommodates high-resolution PWM feedback and encoder interfaces. The wide-body DWW package provides the 8 mm creepage needed for 480 V AC industrial bus isolation in IEC 61800-5-1 compliant systems.
Recomendado
Solar String Inverter Communication
The ISO7741FQDWWQ1's 5700 Vrms rating isolates the 1500 V DC string-side MCU from the AC-grid-side controller in central and string solar inverters. The 4-channel 3/1 directionality is well-suited to SPI communication to isolated gate drivers like TI UCC21710. The capacitive isolation barrier exhibits very low EMI emissions, easing compliance with EN 50549 and VDE-AR-N 4105 grid codes. AEC-Q100 qualification also supports hybrid inverter/inverter-storage applications.
Recomendado
Isolated RS-485 / RS-232 / SPI Interface
The ISO7741FQDWWQ1's 4 channels at 100 Mbps easily isolate SPI, RS-232, or RS-485 transceivers in industrial automation networks. The 11 ns propagation delay and 2.5 ns channel skew preserve tight timing margins in full-duplex protocols, while the reinforced insulation protects field technicians from 480 V AC mains-referenced circuits. The device supports 2.25 V to 5.5 V supplies for direct interface with 3.3 V MCUs and 5 V legacy transceivers on opposite sides.
Recomendado
Battery Management System (BMS) Isolation
The ISO7741FQDWWQ1 isolates the high-voltage battery pack monitoring MCU from the low-voltage vehicle control unit in BEV and PHEV battery management systems. The 3 forward / 1 reverse channel configuration is ideal for SPI communication to analog front-ends like TI BQ79631, where one return channel carries fault feedback. The 5700 Vrms reinforced insulation and AEC-Q100 Grade 1 qualification support ISO 26262 ASIL-D functional-safety targets in 800 V battery architectures.
Recomendado
DC Fast Charging Station Communication
The ISO7741FQDWWQ1 enables galvanically-isolated communication between the EV charging controller and the high-voltage power module in 50 kW to 350 kW DC fast chargers. The 85 kV/us CMTI ensures robust signaling despite the high dv/dt from the PFC and DC-DC converter switching at 100 kHz. Reinforced 5700 Vrms insulation and 8 mm wide-body creepage meet IEC 61851-23 / 61856-23 isolation requirements, while AEC-Q100 Grade 1 enables deployment in ruggedized outdoor enclosures.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ISO7741FQDWWQ1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ISO7741DWR | ISO7741FDWR | ISO7741FQDBQQ1 | ISO7742FQDWWQ1 | ISO6741QDWWRQ1 |
|---|---|---|---|---|---|---|
| Package | 16-SOIC (DWW) wide-body | 16-SOIC (DWW) wide-body - same | 16-SOIC (DWW) wide-body - same | 16-SOIC (DBQ) narrow-body | 16-SOIC (DWW) wide-body - same | 16-SOIC (DWW) wide-body - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Channel Count and Direction | 4 channel, 3/1 | 4 channel, 3/1 | 4 channel, 3/1 | 4 channel, 3/1 | 4 channel, 2/2 - different | 4 channel, 3/1 |
| Isolation Voltage | 5700 Vrms | 5700 Vrms | 5700 Vrms | 3000 Vrms | 5700 Vrms | 5000 Vrms |
| Data Rate (Max) | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 100 Mbps | 50 Mbps |
| AEC-Q100 | Yes (Grade 1) | No (industrial) | No (industrial) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) |
| Default Output State | Low | Low | High | Low | Low | Low |
| CMTI (Minimum) | 85 kV/us | 85 kV/us | 85 kV/us | 85 kV/us | 85 kV/us | 100 kV/us |
| Propagation Delay (typ) | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns | 13 ns |
| Unit Price (1 piece, USD) | $5.42 | $4.25 | $4.30 | $4.10 | $5.45 | $4.85 |
Diferenciadores clave
- 5700 Vrms reinforced isolation with AEC-Q100 Grade 1 in same DWW package (frente a ISO7741DWR)
- Higher isolation rating than narrow-body version (frente a ISO7741FQDBQQ1)
- Higher data rate than ISO674x family (frente a ISO6741QDWWRQ1)
Notas de diseño
Place 0.1 uF + 10 uF decoupling capacitors as close as possible to the VCC1 and VCC2 pins, within 2 mm trace distance. Use low-ESR X7R ceramic capacitors rated for at least 16 V to handle transients. A four-layer PCB with dedicated ground planes on layers 2 and 3 provides the lowest-impedance return path for the high-frequency switching currents generated by the capacitive isolation barrier.
Maintain at least 8 mm of creepage and clearance between primary-side and secondary-side copper to preserve the 5700 Vrms reinforced isolation rating. Do not route any copper, vias, or signal traces under the IC body that would bridge primary and secondary grounds. The wide-body SOIC package itself is the reinforced isolation barrier; the PCB does not provide the primary insulation.
Do not connect primary-side and secondary-side ground planes together under the device. The capacitive isolation barrier will be short-circuited, defeating the purpose of the isolator. Use a star-ground topology with separate grounds on each side and tie them only through a single-point ground at the system level. Verify with a high-voltage isolation tester per UL 1577 that no creepage path exists.
For data rates above 50 Mbps, place a 50 ohm series termination resistor at each digital input to control ringing and prevent signal-integrity issues. Match the trace impedance to 50 ohm using a 4-layer stackup with controlled-impedance routing. According to TI datasheet application notes, signal rise time should be kept above 1 ns to prevent CMTI-induced logic errors.
Estimated: at 5 V supply on both sides, 100 Mbps data rate on all 4 channels, total supply current is approximately 35 mA. Power dissipation is 175 mW, which is negligible - no thermal management is required. However, the device still requires proper decoupling per the datasheet to prevent logic-level noise from coupling into the supply rails.
Información de cumplimiento
AEC-Q100 Grade 1 qualified per TI product page. Reinforced insulation rated per UL 1577, VDE 0884-11, CSA, TUV, and CQC standards. RoHS and REACH compliant per TI material declaration.
