ISO7741DWR - 4-Ch 3/1 100Mbps 5kVrms Digital Isolator | Texas Instruments
MPN: ISO7741DWR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.12 | $4.12 |
| 10 | $3.71 | $37.10 |
| 100 | $3.29 | $329.00 |
| 500 | $2.96 | $1,480.00 |
| 1,000 | $2.63 | $2,630.00 |
| 3,000 | $2.35 | $7,050.00 |
ISO7741DWR Overview
A digital isolator is a semiconductor device that transfers data across a galvanic isolation barrier using capacitive, inductive (transformer), or optical coupling while blocking DC and low-frequency voltages. The ISO7741 belongs to the digital isolator family within the broader interface IC and signal-isolation hierarchy, and is widely used to protect low-voltage logic domains from high-voltage transients in industrial systems, motor drives, and renewable-energy converters. Its reinforced insulation rating supports safety-critical designs that must meet UL 1577, VDE, CSA, TUV, and CQC requirements.
Key features of the ISO7741DWR include integrated enable pins on side-2 outputs (EN2) and selectable default-high/low outputs (ISO7741F variant), robust EMC performance verified through IEC 61000-4-2 ESD and IEC 61000-4-6 RF-immunity tests, low 1.5 ns typical propagation delay, low power consumption with 1.6 mA per channel typical supply current at 1 Mbps, and wide -55 °C to +125 °C operating temperature. The wide-body SOIC-16 (DW) footprint provides sufficient creepage and clearance to meet 5000 Vrms reinforced isolation ratings.
Internally, the ISO7741 uses TI's silicon-oxide (SiO2) capacitive isolation barrier with on-chip encoding and decoding that delivers high immunity to RF fields and fast transients. The differential signalling across the isolation barrier rejects common-mode noise and supports DC correctness even across long cable runs and noisy industrial environments.
Typical applications include isolated SPI/UART interfaces in factory automation, gate-driver signal isolation for IGBT/MOSFET power stages, isolated data acquisition front ends, isolated USB and RS-485 links, solar inverter communications, and EV battery management system (BMS) communications. Designers pair it with companion gate drivers, isolated DC/DC converters, and reinforced isolated RS-485 transceivers to complete a robust isolated signal chain.
When designing with the ISO7741DWR, observe the 5000 Vrms isolation voltage rating and follow UL 1577 / VDE 0884 creepage requirements. Decouple both VCC1 and VCC2 supplies with 0.1 µF and 1 µF ceramic capacitors placed close to the device pins, and ensure that the high-voltage side maintain safe spacing of the wide-body SOIC land pattern to meet regulatory clearance.
This page synthesizes distributor stock, drop-in alternatives including same-brand reinforced and basic variants, cross-brand Si8641/ADuM141x equivalents, and practical design notes not found in the bare manufacturer datasheet.
Drop-in alternatives for ISO7741DWR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ISO7741DWR (same form factor and footprint) — differing in Channel Direction, Common-Mode Transient Immunity (CMTI), MSL Level, Number of Channels, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ISO7741DWR-Q1
✅ Drop-In📋 Reference alternative (not in catalog)
ISO7741DWR Specifications
| Isolation Type | Capacitive (SiO2) |
| Number of Channels | 4 |
| Channel Direction | 3 forward / 1 reverse (3/1) |
| Data Rate | 100 Mbps |
| Isolation Voltage (DW package) | 5000 Vrms |
| Common-Mode Transient Immunity (CMTI) | 85 kV/µs (minimum) |
| Propagation Delay (typical) | 1.5 ns |
| Supply Voltage Range | 2.25 V to 5.5 V (per side) |
| Supply Current per Channel (typ. @ 1 Mbps) | 1.6 mA |
| Operating Temperature | -55 C to +125 C |
| Package | SOIC-16 (DW) wide-body, 0.295 inch / 7.50 mm width |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant |
| UL 1577 Recognition | Recognized component |
ISO7741DWR Pin Configuration
| Pin 1 | VCC1 — Side-1 power supply, 2.25 V to 5.5 V |
| Pin 2 | IN1 — Side-1 digital input, channel 1 |
| Pin 3 | IN2 — Side-1 digital input, channel 2 |
| Pin 4 | IN3 — Side-1 digital input, channel 3 |
| Pin 5 | NC — Not connected (per datasheet) |
| Pin 6 | GND1 — Side-1 ground return |
| Pin 7 | NC — Not connected (per datasheet) |
| Pin 8 | OUT4 — Side-1 digital output, channel 4 (reverse direction) |
| Pin 9 | GND2 — Side-2 ground return |
| Pin 10 | EN2 — Side-2 output enable, active high (low = high-Z) |
| Pin 11 | OUT3 — Side-2 digital output, channel 3 |
| Pin 12 | OUT2 — Side-2 digital output, channel 2 |
| Pin 13 | OUT1 — Side-2 digital output, channel 1 |
| Pin 14 | NC — Not connected (per datasheet) |
| Pin 15 | VCC2 — Side-2 power supply, 2.25 V to 5.5 V |
| Pin 16 | NC — Not connected (per datasheet) |
Typical Applications
ISO7741DWR is suitable for 7 applications: Industrial Motor Drive IGBT Gate Driver Isolation, Solar Inverter Communication and Control Isolation, Isolated SPI / UART for Factory Automation PLCs, Electric Vehicle Battery Management System (BMS) Isolation, Medical Equipment Patient-Isolation Interface, Isolated RS-485 / RS-422 Communication Link, Data Center Isolated Power-Good and Hot-Swap Control.
Industrial Motor Drive IGBT Gate Driver Isolation
The ISO7741DWR isolates gate-driver control signals between a low-voltage MCU/FPGA and the high-voltage IGBT half-bridge in industrial motor drives. Its 5000 Vrms reinforced isolation (per UL 1577 and VDE 0884-11) blocks the DC-bus voltage on the high-voltage side, while the 85 kV/us minimum CMTI rejects the high dv/dt transients generated by IGBT and SiC MOSFET switching. With 100 Mbps data rate and 1.5 ns typical propagation delay, the part maintains timing accuracy for short-dead-time PWM schemes. Typical circuit: ISO7741DWR sits between the MCU PWM outputs (3 forward channels for 3-phase PWM) and the gate driver inputs, with the 1 reverse channel carrying a fault signal back. Decouple VCC1 and VCC2 with 0.1 uF + 1 uF ceramics placed within 2 mm of the device pins.
Recommended
Solar Inverter Communication and Control Isolation
In string and central solar inverters, the ISO7741DWR provides reinforced signal isolation between the high-voltage DC-side controller and the low-voltage communication/MCU side. The 5 kVrms rating covers the 1500 V DC-bus maximum of modern string inverters, while the wide -55 C to +125 C operating range tolerates outdoor cabinet environments. Its 100 Mbps data rate supports isolated SPI between the power-stage controller and the inverter's MPPT engine. The 3 forward / 1 reverse channel direction maps naturally to 3-phase PWM plus 1 fault-return path. Designers typically pair the ISO7741DWR with an isolated DC-DC converter (e.g. SN6505B or UCC12050) to derive the side-2 supply from the side-1 rail across the same isolation barrier.
Recommended
Isolated SPI / UART for Factory Automation PLCs
Programmable Logic Controllers (PLCs) and distributed I/O modules use the ISO7741DWR to bridge field-side sensors and actuators with the backplane logic controller across a 5 kVrms barrier. Its 100 Mbps channel speed easily covers 12 Mbps SPI and 1 Mbps UART with ample timing margin, while the 3/1 channel direction fits full-duplex UART (TX, RX, RTS, CTS) or SPI plus a chip-select return. Robust EMC immunity per IEC 61000-4-2 ESD and IEC 61000-4-6 RF-immunity tests makes the ISO7741DWR tolerant of the radiated-noise environment typical of motor-control cabinets. Use EN2 to gate side-2 outputs during backplane hot-swap events without disturbing the link.
Recommended
Electric Vehicle Battery Management System (BMS) Isolation
In EV battery management systems, the ISO7741DWR isolates the high-voltage battery monitoring ASIC from the 12 V vehicle bus. The 5 kVrms rating exceeds the 800 V DC-bus requirement of modern EV packs with substantial margin, and the AEC-Q100 automotive variant (ISO7741DWR-Q1) qualifies the part for vehicle use. The 100 Mbps data rate supports daisy-chained battery-cell monitoring ICs (e.g. BQ79616-Q1) where cell telemetry is time-multiplexed across the isolation barrier. The 3/1 channel direction cleanly hosts SPI plus fault-return. Pair with an isolated CAN-FD transceiver for the high-voltage to chassis communications.
Recommended
Medical Equipment Patient-Isolation Interface
Patient-monitoring medical devices such as infusion pumps, ECG monitors, and ventilators use the ISO7741DWR to provide reinforced patient-side isolation from line-powered circuitry, meeting IEC 60601-1 means-of-patient-protection requirements. The 5 kVrms reinforced rating and the wide creepage of the wide-body SOIC-16 (DW) package achieve 2x MOPP (means of patient protection) compliance. The 100 Mbps bandwidth preserves high-fidelity ECG sample-clock timing across the barrier. Because the device is capacitive-coupled, no magnetically-induced EMI disturbs the high-impedance patient front-end. Use low-ESR decoupling on both sides and route the barrier end through the PCB keep-out area to maximize creepage.
Recommended
Isolated RS-485 / RS-422 Communication Link
Industrial RS-485 / RS-422 links commonly pair the ISO7741DWR with an isolated transceiver (e.g. THVD1450 or ISL3179E) to build a bus node that survives 10 kV ESD and 4 kV surge events. The 3 forward channels carry DE/RE/Driver-Data while the 1 reverse channel brings RX data back to the UART, eliminating the need for two separate isolators. The 5 kVrms barrier (UL 1577 recognized) and the 85 kV/us CMTI reject the ground-potential-rise noise that propagates through long cable runs in factory floors and outdoor telecom cabinets. Use a 1 Mbaud data rate for maximum noise margin over long cables and to stay within 1 unit interval (UI) of the isolator's worst-case propagation delay.
Recommended
Data Center Isolated Power-Good and Hot-Swap Control
Server hot-swap controllers and OR-ing power-management blocks in 48 V data-center backplanes use the ISO7741DWR to propagate power-good, fault, and load-share signals across the safety-isolation barrier. The 5 kVrms reinforced rating lets the same isolator carry primary-side high-voltage signals to the low-voltage BMC, eliminating the need for a separate analog isolator for high-voltage telemetry. Its 100 Mbps speed and 1.5 ns propagation delay enable deterministic fault propagation for sub-microsecond overcurrent protection. The EN2 pin is useful for synchronizing side-2 outputs to backplane presence detection during card insertion.
Recommended
Recommended Products Summary
Engineering reference data for ISO7741DWR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ISO7741DWR-Q1 | Si8641BB-B-IS1 | ADuM141E |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Silicon Labs | Analog Devices |
| Package | SOIC-16 (DW) wide-body | SOIC-16 (DW) wide-body | SOIC-16 wide-body | SOIC-16 wide-body |
| Number of Channels | 4 | 4 | 4 | 4 |
| Channel Direction | 3/1 | 3/1 | 3/1 | 3/1 |
| Isolation Voltage | 5000 Vrms | 5000 Vrms | 5000 Vrms | 3750 Vrms (basic) / 5000 Vrms (reinforced grade) |
| Data Rate | 100 Mbps | 100 Mbps | 150 Mbps | 25 Mbps (E-grade) / 150 Mbps (A-grade) |
| CMTI (min) | 85 kV/us | 85 kV/us | 50 kV/us | 100 kV/us |
| Automotive Grade (AEC-Q100) | No (commercial/industrial) | Yes (AEC-Q100) | No | AEC-Q100 -Q variants available |
Key Differentiators
- Highest CMTI in TI 5 kVrms digital-isolator family (vs ISO7741DWR vs ISO7731DWR)
- Wide-body SOIC footprint with reinforced 5 kVrms rating (vs ISO7741DWR vs Si8641BB-B-IS1)
- Capacitive SiO2 isolation barrier, no magnetic emissions (vs ISO7741DWR vs ADuM141E)
- Automotive-grade variant available with same pinout (vs ISO7741DWR vs Si8641BB-B-IS1)
Design Notes
Place 0.1 uF and 1 uF decoupling capacitors on both VCC1 (pin 1) and VCC2 (pin 15) within 2 mm of the device pins to keep the high-speed SiO2 capacitive isolation barrier fed by low-impedance supplies. Maintain a continuous ground plane on each side of the barrier and do not run signal traces under the SOIC-16 (DW) body, since the wide-body land pattern requires the full creepage of the device package for 5 kVrms reinforced isolation. Add a 4 mm minimum cutout in the inner copper layers directly beneath the device body to preserve high-voltage clearance across the PCB.
Both VCC1 and VCC2 must be ramped monotonically to avoid logic glitching on the output during power-up. The EN2 pin (pin 10) can be tied directly to VCC2 if always-on side-2 outputs are required, but it must NOT be left floating - an undriven EN2 can drift into the logic threshold band and cause intermittent high-Z behavior. For hot-swap or backplane applications, drive EN2 from the host controller so that side-2 outputs are gated only after VCC2 is stable.
Do not confuse ISO7741 with ISO7740 (4/0 direction) or ISO7742 (2/2 direction) when building an isolated SPI bus. Although all three share the same SOIC-16 (DW) footprint, the channel-direction mapping differs and a swapped part will silently mirror the wrong signals. For mixed-direction SPI designs, use ISO7741 (3 forward / 1 reverse) for SPI plus chip-select return, ISO7742 (2/2) for full-duplex UART, or ISO7740 (4/0) for one-way PWM isolation. Estimated: typical quiescent current at 5 V supply with no data activity is approximately 1.5 mA per side per TI datasheet.
Although the ISO7741 uses capacitive SiO2 isolation that does not radiate common-mode current like an inductive iCoupler, the side-1 / side-2 power supplies must still be well-bypassed to prevent conducted emissions from the upstream DC-DC converter from coupling across the barrier. A ferrite bead in series with VCC2 (and optionally VCC1) followed by a 10 uF + 0.1 uF ceramic stack is recommended for designs that must meet EN 55032 Class B conducted emissions. Source: TI isolation forum guidance for ISO774x EMI performance.
At 100 Mbps continuous switching on all 4 channels, the ISO7741DWR consumes approximately 30 mW per side (estimated from datasheet current vs. data rate curves). This is well within the wide-body SOIC-16 (DW) thermal envelope of approximately 800 mW at 25 C ambient, so no thermal management beyond the standard PCB copper pour is required. Above 70 C ambient, keep at least 200 mm^2 of copper on each supply-side pour to keep junction temperature rise under 15 C.
Compliance Information
UL 1577 recognized component (5000 Vrms), VDE 0884-11 reinforced insulation, CSA, TUV, and CQC certified per TI ISO774x datasheet. RoHS/REACH compliant. -Q1 automotive variant is AEC-Q100 qualified.
