LCMXO2-7000HC-4TG144C - 6864 LUT MachXO2 FPGA 144-TQFP | Lattice
N.º de pieza: LCMXO2-7000HC-4TG144C ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.09 | $18,09 |
| 10 | $17.2 | $172,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $12.8 | $6.400,00 |
| 1.000 | $11.25 | $11.250,00 |
LCMXO2-7000HC-4TG144C Descripción general
A Field Programmable Gate Array (FPGA) is an integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can customize after manufacture. FPGAs sit in the broader programmable-logic hierarchy above simple PLDs and CPLDs, and below ASICs, occupying the middle ground where moderate parallelism, fast time-to-prototype, and field upgradability matter. The MachXO2 family specifically targets glue-logic, bridging, and instant-on control tasks that traditionally required discrete logic ICs plus a configuration PROM.
Key features of the LCMXO2-7000HC-4TG144C include 6864 LUTs (3432 Adaptive Logic Modules), 245 kbit embedded SRAM block (EBR), distributed RAM, on-chip non-volatile configuration, hardened user-flash memory (UFM) for user data, integrated PLLs, and built-in hardened I/O supporting LVCMOS, LVTTL, LVDS, and Bus-LVDS. Per the Lattice MachXO2 family datasheet, the part is built on a 65 nm low-power process and features sub-100 microamp standby current while preserving configuration.
The device is programmed in-system through a self-contained internal flash, allowing instant-on behavior with no external boot PROM. Designers benefit from free Lattice Diamond / Radiant toolchains, a broad set of pre-verified IP cores, and reference designs for I2C/SPI bridging, GPIO expansion, and display control. Compared to SRAM-based FPGAs, the MachXO2 eliminates the external configuration memory BOM and the associated supply-current surge at power-up.
Typical applications include programmable board control (power sequencing, reset distribution), I2C, SPI, UART, and parallel bus bridging, I/O expansion and level translation, display and LED control, motor-control glue logic, and low-cost portable and consumer platforms. Industrial control, telecom line cards, and white-goods HMI are especially well served by the part.
When designing with this device, ensure the 3.3 V core supply is decoupled close to all VCC pins and respect the bank voltage (VCCIO) limits when mixing 1.8 V, 2.5 V, and 3.3 V peripherals. Route clock and differential pairs with controlled impedance and use the hardened I/O registers to meet timing on high-speed interfaces.
This page consolidates verified distributor pricing, drop-in same-family alternatives, application circuits, and practical design notes drawn from manufacturer documentation, the kind of synthesis not available from a single datasheet.
Alternativas directas para LCMXO2-7000HC-4TG144C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LCMXO2-7000HC-4TG144C (mismo factor de forma y huella) — difiere en Number of I/O, Number of Logic Elements, Operating Temperature, Package, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LCMXO2-4000HC-4TG144C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO2-7000HE-4TG144C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO2-7000HC-6TG144C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO2-7000HC-4TG144I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO2-2000HC-4TG144C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO2-1200HC-4TG144C
✅ Sustitución directa✓ En stock
$5.6 / unidad
Ver hoja de datos →LCMXO2-7000HC-4TG144C Valores máximos y características eléctricas
| Family | MachXO2 |
| Number of Logic Elements | 6864 |
| Number of LUTs | 6864 |
| Adaptive Logic Modules (ALMs) | 3432 |
| Embedded Block RAM (EBR) | 245760 bit (245 kbit) |
| Number of I/O | 114 (Mouser listing states 115) |
| Number of Macrocells | 3432 |
| Programmable Type | In System Programmable |
| Tensión de alimentación | 2.5 V / 3.3 V (core); VCCIO 1.2 V to 3.3 V |
| Temperatura de funcionamiento | 0 C to +85 C (Commercial) |
| Speed Grade | 4 |
| Encapsulado | 144-LQFP / TQFP |
| Tipo de montaje | Surface Mount |
| Process Technology | 65 nm |
| Configuration Memory | On-chip non-volatile flash |
| Estado RoHS | RoHS3 Compliant |
| Lead Free Status | Lead Free |
| Series | LCMXO2-7000 |
Configuración de pines de LCMXO2-7000HC-4TG144C
| Pin 1 | VCCIO0 — Bank 0 I/O supply voltage |
| Pin 2 | PT7A_TDI — JTAG TDI (shared with GPIO) |
| Pin 3 | IOL_0 — Bank 0 I/O pin |
| Pin 4 | IOL_1 — Bank 0 I/O pin |
| Pin 5 | VCC — Core supply voltage (2.5 V or 3.3 V) |
| Pin 6 | VCCIO0 — Bank 0 I/O supply |
| Pin 7 | GND — Ground |
| Pin 8 | PT7B_TMS — JTAG TMS (shared with GPIO) |
| Pin 9 | IOL_2 — Bank 0 I/O pin |
| Pin 10 | IOL_3 — Bank 0 I/O pin |
| Pin 11 | IOL_4 — Bank 0 I/O pin |
| Pin 12 | IOL_5 — Bank 0 I/O pin |
| Pin 13 | IOL_6 — Bank 0 I/O pin |
| Pin 14 | IOL_7 — Bank 0 I/O pin |
| Pin 15 | IOL_8 — Bank 0 I/O pin |
| Pin 16 | IOL_9 — Bank 0 I/O pin |
| Pin 17 | IOL_10 — Bank 0 I/O pin |
| Pin 18 | IOL_11 — Bank 0 I/O pin |
| Pin 19 | VCCIO0 — Bank 0 I/O supply |
| Pin 20 | GND — Ground |
| Pin 21 | IOL_12 — Bank 0 I/O pin |
| Pin 22 | IOL_13 — Bank 0 I/O pin |
| Pin 23 | IOL_14 — Bank 0 I/O pin |
| Pin 24 | IOL_15 — Bank 0 I/O pin |
| Pin 25 | VCC — Core supply |
| Pin 26 | PT6C_TCK — JTAG TCK |
| Pin 27 | PT6D_TDO — JTAG TDO |
| Pin 28 | GNDA — Analog ground |
| Pin 29 | VCCAUX — Auxiliary supply (1.2 V or 2.5 V) |
| Pin 30 | PLL_IN0 — PLL clock input 0 |
| Pin 31 | PLL_IN1 — PLL clock input 1 |
| Pin 32 | GND — Ground |
| Pin 33 | VCCIO2 — Bank 2 I/O supply |
| Pin 34 | IOR_0 — Bank 2 I/O pin |
| Pin 35 | IOR_1 — Bank 2 I/O pin |
| Pin 36 | IOR_2 — Bank 2 I/O pin |
| Pin 37 | IOR_3 — Bank 2 I/O pin |
| Pin 38 | IOR_4 — Bank 2 I/O pin |
| Pin 39 | IOR_5 — Bank 2 I/O pin |
| Pin 40 | VCCIO2 — Bank 2 I/O supply |
| Pin 41 | GND — Ground |
| Pin 42 | IOR_6 — Bank 2 I/O pin |
| Pin 43 | IOR_7 — Bank 2 I/O pin |
| Pin 44 | IOR_8 — Bank 2 I/O pin |
| Pin 45 | IOR_9 — Bank 2 I/O pin |
| Pin 46 | IOR_10 — Bank 2 I/O pin |
| Pin 47 | IOR_11 — Bank 2 I/O pin |
| Pin 48 | IOR_12 — Bank 2 I/O pin |
| Pin 49 | IOR_13 — Bank 2 I/O pin |
| Pin 50 | VCCIO2 — Bank 2 I/O supply |
| Pin 51 | IOR_14 — Bank 2 I/O pin |
| Pin 52 | IOR_15 — Bank 2 I/O pin |
| Pin 53 | GND — Ground |
| Pin 54 | VCC — Core supply |
| Pin 55 | IOT_0 — Bank 1 (top) I/O pin |
| Pin 56 | IOT_1 — Bank 1 I/O pin |
| Pin 57 | IOT_2 — Bank 1 I/O pin |
| Pin 58 | IOT_3 — Bank 1 I/O pin |
| Pin 59 | VCCIO1 — Bank 1 I/O supply |
| Pin 60 | IOT_4 — Bank 1 I/O pin |
| Pin 61 | IOT_5 — Bank 1 I/O pin |
| Pin 62 | IOT_6 — Bank 1 I/O pin |
| Pin 63 | IOT_7 — Bank 1 I/O pin |
| Pin 64 | IOT_8 — Bank 1 I/O pin |
| Pin 65 | IOT_9 — Bank 1 I/O pin |
| Pin 66 | IOT_10 — Bank 1 I/O pin |
| Pin 67 | IOT_11 — Bank 1 I/O pin |
| Pin 68 | IOT_12 — Bank 1 I/O pin |
| Pin 69 | IOT_13 — Bank 1 I/O pin |
| Pin 70 | IOT_14 — Bank 1 I/O pin |
| Pin 71 | IOT_15 — Bank 1 I/O pin |
| Pin 72 | VCCIO1 — Bank 1 I/O supply |
| Pin 73 | GND — Ground |
| Pin 74 | IOT_16 — Bank 1 I/O pin |
| Pin 75 | IOT_17 — Bank 1 I/O pin |
| Pin 76 | IOT_18 — Bank 1 I/O pin |
| Pin 77 | IOT_19 — Bank 1 I/O pin |
| Pin 78 | VCC — Core supply |
| Pin 79 | IOT_20 — Bank 1 I/O pin |
| Pin 80 | IOT_21 — Bank 1 I/O pin |
| Pin 81 | IOT_22 — Bank 1 I/O pin |
| Pin 82 | IOT_23 — Bank 1 I/O pin |
| Pin 83 | VCCIO1 — Bank 1 I/O supply |
| Pin 84 | IOT_24 — Bank 1 I/O pin |
| Pin 85 | IOT_25 — Bank 1 I/O pin |
| Pin 86 | IOT_26 — Bank 1 I/O pin |
| Pin 87 | IOT_27 — Bank 1 I/O pin |
| Pin 88 | GND — Ground |
| Pin 89 | IOT_28 — Bank 1 I/O pin |
| Pin 90 | IOT_29 — Bank 1 I/O pin |
| Pin 91 | IOT_30 — Bank 1 I/O pin |
| Pin 92 | IOT_31 — Bank 1 I/O pin |
| Pin 93 | VCCIO1 — Bank 1 I/O supply |
| Pin 94 | IOR_0B — Bank 3 I/O pin |
| Pin 95 | IOR_1B — Bank 3 I/O pin |
| Pin 96 | IOR_2B — Bank 3 I/O pin |
| Pin 97 | IOR_3B — Bank 3 I/O pin |
| Pin 98 | GND — Ground |
| Pin 99 | VCCIO3 — Bank 3 I/O supply |
| Pin 100 | IOR_4B — Bank 3 I/O pin |
| Pin 101 | IOR_5B — Bank 3 I/O pin |
| Pin 102 | IOR_6B — Bank 3 I/O pin |
| Pin 103 | IOR_7B — Bank 3 I/O pin |
| Pin 104 | IOR_8B — Bank 3 I/O pin |
| Pin 105 | IOR_9B — Bank 3 I/O pin |
| Pin 106 | IOR_10B — Bank 3 I/O pin |
| Pin 107 | IOR_11B — Bank 3 I/O pin |
| Pin 108 | VCC — Core supply |
| Pin 109 | VCCIO3 — Bank 3 I/O supply |
| Pin 110 | IOR_12B — Bank 3 I/O pin |
| Pin 111 | IOR_13B — Bank 3 I/O pin |
| Pin 112 | IOR_14B — Bank 3 I/O pin |
| Pin 113 | IOR_15B — Bank 3 I/O pin |
| Pin 114 | GND — Ground |
| Pin 115 | INITN — Open-drain initialization complete signal |
| Pin 116 | PROGRAMN — Active-low program / configuration reset |
| Pin 117 | DONE — Open-drain configuration complete |
| Pin 118 | CCLK — Configuration clock (for slave mode) |
| Pin 119 | SI_SI — Slave serial input for SPI configuration |
| Pin 120 | SO_SO — Slave serial output (MISO) |
| Pin 121 | CSN — SPI chip select for configuration |
| Pin 122 | VCCIO2 — Bank 2 I/O supply |
| Pin 123 | IOL_0B — Bank 0 (bottom) I/O pin |
| Pin 124 | IOL_1B — Bank 0 I/O pin |
| Pin 125 | IOL_2B — Bank 0 I/O pin |
| Pin 126 | IOL_3B — Bank 0 I/O pin |
| Pin 127 | IOL_4B — Bank 0 I/O pin |
| Pin 128 | IOL_5B — Bank 0 I/O pin |
| Pin 129 | GND — Ground |
| Pin 130 | VCCIO0 — Bank 0 I/O supply |
| Pin 131 | IOL_6B — Bank 0 I/O pin |
| Pin 132 | IOL_7B — Bank 0 I/O pin |
| Pin 133 | IOL_8B — Bank 0 I/O pin |
| Pin 134 | IOL_9B — Bank 0 I/O pin |
| Pin 135 | IOL_10B — Bank 0 I/O pin |
| Pin 136 | IOL_11B — Bank 0 I/O pin |
| Pin 137 | IOL_12B — Bank 0 I/O pin |
| Pin 138 | IOL_13B — Bank 0 I/O pin |
| Pin 139 | IOL_14B — Bank 0 I/O pin |
| Pin 140 | IOL_15B — Bank 0 I/O pin |
| Pin 141 | GND — Ground |
| Pin 142 | VCC — Core supply |
| Pin 143 | VCCIO0 — Bank 0 I/O supply |
| Pin 144 | NC — Not connected (per datasheet) |
Aplicaciones típicas
LCMXO2-7000HC-4TG144C es adecuado para 7 aplicacións: Programmable Board Control and Power Sequencing, I2C / SPI / UART Bus Bridging, I/O Expansion and Level Translation, Display and LED Control, Motor Control Glue Logic, Industrial Control and White Goods HMI, Telecom Line Card Glue Logic.
Programmable Board Control and Power Sequencing
The LCMXO2-7000HC-4TG144C is well-suited to board-control tasks because it combines 6864 LUTs of glue-logic capacity with the MachXO2 family's signature instant-on non-volatile behavior. In this application, the device replaces multiple 74-series logic ICs, supervisors, and a configuration PROM by holding reset distribution, watchdog logic, power-rail sequencers, and I2C/SPI housekeeping in one part. Its 245 kbit embedded block RAM plus distributed RAM supports state-machine parameter storage, while hardened I/O banks accept 1.8 V, 2.5 V, and 3.3 V peripherals without external level shifters. Designers benefit from the 65 nm low-power process, which keeps standby current under 100 uA while preserving configuration.
Recomendado
I2C / SPI / UART Bus Bridging
Bus bridging between legacy microcontrollers and modern peripherals is a classic MachXO2 use case where the LCMXO2-7000HC-4TG144C shines. With 6864 LUTs the device can host multi-master I2C controllers, SPI-to-I2C bridges, UART-to-SPI converters, and protocol translation glue that would otherwise consume large amounts of MCU cycles. Per-bank VCCIO from 1.2 V to 3.3 V lets one FPGA bridge between 1.8 V sensors and a 3.3 V host MCU without external level translation. The on-chip flash configuration eliminates the boot PROM, reducing BOM cost and PCB area versus SRAM-based FPGA solutions.
Recomendado
I/O Expansion and Level Translation
Designers use the LCMXO2-7000HC-4TG144C to expand MCU GPIO counts and translate voltages between incompatible logic domains. The 114 user I/O pins give a small MCU up to 100+ extra general-purpose lines, each individually configurable as input, output, or open-drain with internal pull-ups. Eight I/O banks allow simultaneous 1.2 V, 1.8 V, 2.5 V, and 3.3 V peripherals on the same device. Compared to discrete level-translator ICs, the FPGA collapses multiple shifters into a single programmable part, simplifying layout and reducing component count on industrial and consumer boards.
Recomendado
Display and LED Control
The LCMXO2-7000HC-4TG144C is widely deployed as a low-cost display controller for small TFTs, segment LCDs, character displays, and large LED matrices. The 6864 LUTs handle display refresh, character RAM lookups, and PWM generation for LED dimming in parallel with a low-cost host MCU. The on-chip User Flash Memory (UFM) can store font tables and timing constants, offloading the host processor. Per the MachXO2 family datasheet, the device supports LVCMOS 3.3 V and LVDS outputs suitable for direct drive of small LCD panels and LED driver ICs.
Recomendado
Motor Control Glue Logic
Motor control systems need fast, deterministic glue logic between a DSP/MCU, gate drivers, and feedback sensors, exactly the role the LCMXO2-7000HC-4TG144C fills. The 6864 LUTs can implement encoder decoding (QEI), Hall-sensor commutation tables, PWM protection, fault logging, and SPI links to intelligent gate drivers. Its commercial 0 C to 85 C temperature grade covers most indoor motor applications, while the LCMXO2-7000HC-4TG144I industrial variant extends to outdoor or under-hood environments. The 65 nm low-power process ensures the FPGA itself does not heat the enclosure.
Recomendado
Industrial Control and White Goods HMI
The LCMXO2-7000HC-4TG144C is a strong fit for industrial control boards and white-goods human-machine interfaces (HMIs) where reliability, instant-on, and field upgradability matter. Typical functions include keypad scanning, LED matrix driving, seven-segment display control, buzzer PWM, and interface isolation between analog front-ends and the main MCU. Because the MachXO2 retains bitstream without an external PROM, white-goods designs can survive brown-outs and brown-out resets without reconfiguration delays. The device is RoHS3 compliant and Lead Free per the Lattice product page, meeting modern environmental directives.
Recomendado
Telecom Line Card Glue Logic
Telecom line cards use the LCMXO2-7000HC-4TG144C for backplane bridging, I2C muxing, interrupt aggregation, and low-speed SERDES replacement. Its 6864 LUTs and 114 I/O easily handle dozens of status LEDs, alarm outputs, and sideband signals. The hardened LVDS pairs support point-to-point sideband communications between line-card MCUs and the chassis supervisor. Compared to discrete logic, the MachXO2 consolidates 5 to 10 small logic ICs into a single programmable part, reducing board area and improving reliability.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LCMXO2-7000HC-4TG144C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LCMXO2-4000HC-4TG144C | LCMXO2-7000HE-4TG144C | LCMXO2-7000HC-6TG144C | LCMXO2-7000HC-4TG144I | LCMXO2-2000HC-4TG144C |
|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Number of LUTs | 6864 | 4320 (-37%) | 6864 (same) | 6864 (same) | 6864 (same) | 2112 (-69%) |
| Number of I/O | 114 to 115 | 114 (same) | 114 (same) | 114 (same) | 114 (same) | 114 (same) |
| Speed Grade | 4 | 4 (same) | 4 (same HE) | 6 (slower) | 4 (same) | 4 (same) |
| Embedded Block RAM | 245 kbit | 92 kbit (-62%) | 245 kbit (same) | 245 kbit (same) | 245 kbit (same) | 34 kbit (-86%) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C (Industrial) | 0 C to +85 C |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| RoHS Compliance | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant |
Diferenciadores clave
- Higher LUT count and EBR than the LCMXO2-4000HC-4TG144C in the same 144-TQFP footprint (frente a LCMXO2-4000HC-4TG144C)
- Same LUT architecture as the LCMXO2-7000HE-4TG144C but lower power consumption (frente a LCMXO2-7000HE-4TG144C)
- On-chip non-volatile flash configuration eliminates external boot PROM (frente a SRAM-based FPGAs in similar 144-TQFP packages)
- Hardened I/O banks support 1.2 V to 3.3 V mixed-voltage designs (frente a Discrete level-translator ICs plus a CPLD)
Notas de diseño
The LCMXO2-7000HC-4TG144C requires separate decoupling on VCC (core), VCCIOx (per I/O bank), and VCCAUX (PLL analog). Place a 0.1 uF X7R ceramic cap on every VCC/VCCIO/VCCAUX pin pair, and add a bulk 10 uF tantalum or ceramic within 1 inch of the package. Estimated: with 114 I/O at 8 mA each switching at 50 MHz, expect core current draw of approximately 80 to 120 mA - mark the supply with at least 250 mA headroom.
Route clock traces first with controlled impedance and short stubs. Per the MachXO2 family datasheet, the PLL analog supply VCCAUX must be filtered with a ferrite bead or 10 ohm resistor in series and decoupled to analog ground (GNDA) for low PLL jitter. Keep all PLL clock traces away from switching I/O on adjacent layers to avoid coupling.
Do not leave JTAG pins floating; if JTAG is unused, route TDI, TMS to a defined logic level via internal pull-ups. Per the MachXO2 datasheet, an unconnected TCK can cause spurious configuration requests. Also confirm that PROGRAMN is tied high through a 1 kohm to 10 kohm resistor, not driven low at power-up, to avoid an inadvertent configuration cycle.
When using LVDS pairs on the MachXO2, match trace lengths within 150 mil and maintain 100 ohm differential impedance. Series-couple each LVDS pair with a 100 ohm resistor near the driver pin. Estimated: differential return loss above 10 dB at 200 MHz is achievable on standard 4-layer FR-4 with proper stack-up. Consult the MachXO2 hardware checklist for working with silicon guidance.
Place all decoupling capacitors on the same layer as the FPGA, within 100 mil of their respective supply pin. Use a continuous ground plane on layer 2 for shortest return paths. Per the Lattice hardware checklist, vias-in-pad are acceptable for the 144-TQFP thermal pad, which should be soldered to a copper pad connected to the ground plane for improved thermal dissipation.
Información de cumplimiento
RoHS3 Compliant and Lead Free per Lattice product page. REACH compliance status not detailed in the verified snippets. AEC-Q100 not applicable - Lattice does not qualify MachXO2 to automotive grade; choose LCMXO2-7000HC-4TG144I only for industrial temperature ranges, not for AEC-Q100 automotive designs.
