LCMXO2-7000HC-4TG144C - 6864 LUT MachXO2 FPGA 144-TQFP | Lattice
N.º da peça: LCMXO2-7000HC-4TG144C ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.09 | $18,09 |
| 10 | $17.2 | $172,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $12.8 | $6.400,00 |
| 1.000 | $11.25 | $11.250,00 |
LCMXO2-7000HC-4TG144C Visão geral
A Field Programmable Gate Array (FPGA) is an integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can customize after manufacture. FPGAs sit in the broader programmable-logic hierarchy above simple PLDs and CPLDs, and below ASICs, occupying the middle ground where moderate parallelism, fast time-to-prototype, and field upgradability matter. The MachXO2 family specifically targets glue-logic, bridging, and instant-on control tasks that traditionally required discrete logic ICs plus a configuration PROM.
Key features of the LCMXO2-7000HC-4TG144C include 6864 LUTs (3432 Adaptive Logic Modules), 245 kbit embedded SRAM block (EBR), distributed RAM, on-chip non-volatile configuration, hardened user-flash memory (UFM) for user data, integrated PLLs, and built-in hardened I/O supporting LVCMOS, LVTTL, LVDS, and Bus-LVDS. Per the Lattice MachXO2 family datasheet, the part is built on a 65 nm low-power process and features sub-100 microamp standby current while preserving configuration.
The device is programmed in-system through a self-contained internal flash, allowing instant-on behavior with no external boot PROM. Designers benefit from free Lattice Diamond / Radiant toolchains, a broad set of pre-verified IP cores, and reference designs for I2C/SPI bridging, GPIO expansion, and display control. Compared to SRAM-based FPGAs, the MachXO2 eliminates the external configuration memory BOM and the associated supply-current surge at power-up.
Typical applications include programmable board control (power sequencing, reset distribution), I2C, SPI, UART, and parallel bus bridging, I/O expansion and level translation, display and LED control, motor-control glue logic, and low-cost portable and consumer platforms. Industrial control, telecom line cards, and white-goods HMI are especially well served by the part.
When designing with this device, ensure the 3.3 V core supply is decoupled close to all VCC pins and respect the bank voltage (VCCIO) limits when mixing 1.8 V, 2.5 V, and 3.3 V peripherals. Route clock and differential pairs with controlled impedance and use the hardened I/O registers to meet timing on high-speed interfaces.
This page consolidates verified distributor pricing, drop-in same-family alternatives, application circuits, and practical design notes drawn from manufacturer documentation, the kind of synthesis not available from a single datasheet.
Alternativas drop-in para LCMXO2-7000HC-4TG144C — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LCMXO2-7000HC-4TG144C (mesmo formato e footprint) — diferindo em Number of I/O, Number of Logic Elements, Operating Temperature, Package, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LCMXO2-4000HC-4TG144C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-7000HE-4TG144C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-7000HC-6TG144C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-7000HC-4TG144I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-2000HC-4TG144C
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
LCMXO2-1200HC-4TG144C
✅ Drop-In✓ Em estoque
$5.6 / unidade
Ver ficha técnica →LCMXO2-7000HC-4TG144C Classificações máximas e características elétricas
| Family | MachXO2 |
| Number of Logic Elements | 6864 |
| Number of LUTs | 6864 |
| Adaptive Logic Modules (ALMs) | 3432 |
| Embedded Block RAM (EBR) | 245760 bit (245 kbit) |
| Number of I/O | 114 (Mouser listing states 115) |
| Number of Macrocells | 3432 |
| Programmable Type | In System Programmable |
| Tensão de alimentação | 2.5 V / 3.3 V (core); VCCIO 1.2 V to 3.3 V |
| Temperatura de operação | 0 C to +85 C (Commercial) |
| Speed Grade | 4 |
| Encapsulamento | 144-LQFP / TQFP |
| Tipo de montagem | Surface Mount |
| Process Technology | 65 nm |
| Configuration Memory | On-chip non-volatile flash |
| Status RoHS | RoHS3 Compliant |
| Lead Free Status | Lead Free |
| Series | LCMXO2-7000 |
Configuração de pinos do LCMXO2-7000HC-4TG144C
| Pino 1 | VCCIO0 — Bank 0 I/O supply voltage |
| Pino 2 | PT7A_TDI — JTAG TDI (shared with GPIO) |
| Pino 3 | IOL_0 — Bank 0 I/O pin |
| Pino 4 | IOL_1 — Bank 0 I/O pin |
| Pino 5 | VCC — Core supply voltage (2.5 V or 3.3 V) |
| Pino 6 | VCCIO0 — Bank 0 I/O supply |
| Pino 7 | GND — Ground |
| Pino 8 | PT7B_TMS — JTAG TMS (shared with GPIO) |
| Pino 9 | IOL_2 — Bank 0 I/O pin |
| Pino 10 | IOL_3 — Bank 0 I/O pin |
| Pino 11 | IOL_4 — Bank 0 I/O pin |
| Pino 12 | IOL_5 — Bank 0 I/O pin |
| Pino 13 | IOL_6 — Bank 0 I/O pin |
| Pino 14 | IOL_7 — Bank 0 I/O pin |
| Pino 15 | IOL_8 — Bank 0 I/O pin |
| Pino 16 | IOL_9 — Bank 0 I/O pin |
| Pino 17 | IOL_10 — Bank 0 I/O pin |
| Pino 18 | IOL_11 — Bank 0 I/O pin |
| Pino 19 | VCCIO0 — Bank 0 I/O supply |
| Pino 20 | GND — Ground |
| Pino 21 | IOL_12 — Bank 0 I/O pin |
| Pino 22 | IOL_13 — Bank 0 I/O pin |
| Pino 23 | IOL_14 — Bank 0 I/O pin |
| Pino 24 | IOL_15 — Bank 0 I/O pin |
| Pino 25 | VCC — Core supply |
| Pino 26 | PT6C_TCK — JTAG TCK |
| Pino 27 | PT6D_TDO — JTAG TDO |
| Pino 28 | GNDA — Analog ground |
| Pino 29 | VCCAUX — Auxiliary supply (1.2 V or 2.5 V) |
| Pino 30 | PLL_IN0 — PLL clock input 0 |
| Pino 31 | PLL_IN1 — PLL clock input 1 |
| Pino 32 | GND — Ground |
| Pino 33 | VCCIO2 — Bank 2 I/O supply |
| Pino 34 | IOR_0 — Bank 2 I/O pin |
| Pino 35 | IOR_1 — Bank 2 I/O pin |
| Pino 36 | IOR_2 — Bank 2 I/O pin |
| Pino 37 | IOR_3 — Bank 2 I/O pin |
| Pino 38 | IOR_4 — Bank 2 I/O pin |
| Pino 39 | IOR_5 — Bank 2 I/O pin |
| Pino 40 | VCCIO2 — Bank 2 I/O supply |
| Pino 41 | GND — Ground |
| Pino 42 | IOR_6 — Bank 2 I/O pin |
| Pino 43 | IOR_7 — Bank 2 I/O pin |
| Pino 44 | IOR_8 — Bank 2 I/O pin |
| Pino 45 | IOR_9 — Bank 2 I/O pin |
| Pino 46 | IOR_10 — Bank 2 I/O pin |
| Pino 47 | IOR_11 — Bank 2 I/O pin |
| Pino 48 | IOR_12 — Bank 2 I/O pin |
| Pino 49 | IOR_13 — Bank 2 I/O pin |
| Pino 50 | VCCIO2 — Bank 2 I/O supply |
| Pino 51 | IOR_14 — Bank 2 I/O pin |
| Pino 52 | IOR_15 — Bank 2 I/O pin |
| Pino 53 | GND — Ground |
| Pino 54 | VCC — Core supply |
| Pino 55 | IOT_0 — Bank 1 (top) I/O pin |
| Pino 56 | IOT_1 — Bank 1 I/O pin |
| Pino 57 | IOT_2 — Bank 1 I/O pin |
| Pino 58 | IOT_3 — Bank 1 I/O pin |
| Pino 59 | VCCIO1 — Bank 1 I/O supply |
| Pino 60 | IOT_4 — Bank 1 I/O pin |
| Pino 61 | IOT_5 — Bank 1 I/O pin |
| Pino 62 | IOT_6 — Bank 1 I/O pin |
| Pino 63 | IOT_7 — Bank 1 I/O pin |
| Pino 64 | IOT_8 — Bank 1 I/O pin |
| Pino 65 | IOT_9 — Bank 1 I/O pin |
| Pino 66 | IOT_10 — Bank 1 I/O pin |
| Pino 67 | IOT_11 — Bank 1 I/O pin |
| Pino 68 | IOT_12 — Bank 1 I/O pin |
| Pino 69 | IOT_13 — Bank 1 I/O pin |
| Pino 70 | IOT_14 — Bank 1 I/O pin |
| Pino 71 | IOT_15 — Bank 1 I/O pin |
| Pino 72 | VCCIO1 — Bank 1 I/O supply |
| Pino 73 | GND — Ground |
| Pino 74 | IOT_16 — Bank 1 I/O pin |
| Pino 75 | IOT_17 — Bank 1 I/O pin |
| Pino 76 | IOT_18 — Bank 1 I/O pin |
| Pino 77 | IOT_19 — Bank 1 I/O pin |
| Pino 78 | VCC — Core supply |
| Pino 79 | IOT_20 — Bank 1 I/O pin |
| Pino 80 | IOT_21 — Bank 1 I/O pin |
| Pino 81 | IOT_22 — Bank 1 I/O pin |
| Pino 82 | IOT_23 — Bank 1 I/O pin |
| Pino 83 | VCCIO1 — Bank 1 I/O supply |
| Pino 84 | IOT_24 — Bank 1 I/O pin |
| Pino 85 | IOT_25 — Bank 1 I/O pin |
| Pino 86 | IOT_26 — Bank 1 I/O pin |
| Pino 87 | IOT_27 — Bank 1 I/O pin |
| Pino 88 | GND — Ground |
| Pino 89 | IOT_28 — Bank 1 I/O pin |
| Pino 90 | IOT_29 — Bank 1 I/O pin |
| Pino 91 | IOT_30 — Bank 1 I/O pin |
| Pino 92 | IOT_31 — Bank 1 I/O pin |
| Pino 93 | VCCIO1 — Bank 1 I/O supply |
| Pino 94 | IOR_0B — Bank 3 I/O pin |
| Pino 95 | IOR_1B — Bank 3 I/O pin |
| Pino 96 | IOR_2B — Bank 3 I/O pin |
| Pino 97 | IOR_3B — Bank 3 I/O pin |
| Pino 98 | GND — Ground |
| Pino 99 | VCCIO3 — Bank 3 I/O supply |
| Pino 100 | IOR_4B — Bank 3 I/O pin |
| Pino 101 | IOR_5B — Bank 3 I/O pin |
| Pino 102 | IOR_6B — Bank 3 I/O pin |
| Pino 103 | IOR_7B — Bank 3 I/O pin |
| Pino 104 | IOR_8B — Bank 3 I/O pin |
| Pino 105 | IOR_9B — Bank 3 I/O pin |
| Pino 106 | IOR_10B — Bank 3 I/O pin |
| Pino 107 | IOR_11B — Bank 3 I/O pin |
| Pino 108 | VCC — Core supply |
| Pino 109 | VCCIO3 — Bank 3 I/O supply |
| Pino 110 | IOR_12B — Bank 3 I/O pin |
| Pino 111 | IOR_13B — Bank 3 I/O pin |
| Pino 112 | IOR_14B — Bank 3 I/O pin |
| Pino 113 | IOR_15B — Bank 3 I/O pin |
| Pino 114 | GND — Ground |
| Pino 115 | INITN — Open-drain initialization complete signal |
| Pino 116 | PROGRAMN — Active-low program / configuration reset |
| Pino 117 | DONE — Open-drain configuration complete |
| Pino 118 | CCLK — Configuration clock (for slave mode) |
| Pino 119 | SI_SI — Slave serial input for SPI configuration |
| Pino 120 | SO_SO — Slave serial output (MISO) |
| Pino 121 | CSN — SPI chip select for configuration |
| Pino 122 | VCCIO2 — Bank 2 I/O supply |
| Pino 123 | IOL_0B — Bank 0 (bottom) I/O pin |
| Pino 124 | IOL_1B — Bank 0 I/O pin |
| Pino 125 | IOL_2B — Bank 0 I/O pin |
| Pino 126 | IOL_3B — Bank 0 I/O pin |
| Pino 127 | IOL_4B — Bank 0 I/O pin |
| Pino 128 | IOL_5B — Bank 0 I/O pin |
| Pino 129 | GND — Ground |
| Pino 130 | VCCIO0 — Bank 0 I/O supply |
| Pino 131 | IOL_6B — Bank 0 I/O pin |
| Pino 132 | IOL_7B — Bank 0 I/O pin |
| Pino 133 | IOL_8B — Bank 0 I/O pin |
| Pino 134 | IOL_9B — Bank 0 I/O pin |
| Pino 135 | IOL_10B — Bank 0 I/O pin |
| Pino 136 | IOL_11B — Bank 0 I/O pin |
| Pino 137 | IOL_12B — Bank 0 I/O pin |
| Pino 138 | IOL_13B — Bank 0 I/O pin |
| Pino 139 | IOL_14B — Bank 0 I/O pin |
| Pino 140 | IOL_15B — Bank 0 I/O pin |
| Pino 141 | GND — Ground |
| Pino 142 | VCC — Core supply |
| Pino 143 | VCCIO0 — Bank 0 I/O supply |
| Pino 144 | NC — Not connected (per datasheet) |
Aplicações típicas
LCMXO2-7000HC-4TG144C é adequado para 7 aplicaçãos: Programmable Board Control and Power Sequencing, I2C / SPI / UART Bus Bridging, I/O Expansion and Level Translation, Display and LED Control, Motor Control Glue Logic, Industrial Control and White Goods HMI, Telecom Line Card Glue Logic.
Programmable Board Control and Power Sequencing
The LCMXO2-7000HC-4TG144C is well-suited to board-control tasks because it combines 6864 LUTs of glue-logic capacity with the MachXO2 family's signature instant-on non-volatile behavior. In this application, the device replaces multiple 74-series logic ICs, supervisors, and a configuration PROM by holding reset distribution, watchdog logic, power-rail sequencers, and I2C/SPI housekeeping in one part. Its 245 kbit embedded block RAM plus distributed RAM supports state-machine parameter storage, while hardened I/O banks accept 1.8 V, 2.5 V, and 3.3 V peripherals without external level shifters. Designers benefit from the 65 nm low-power process, which keeps standby current under 100 uA while preserving configuration.
Recomendado
I2C / SPI / UART Bus Bridging
Bus bridging between legacy microcontrollers and modern peripherals is a classic MachXO2 use case where the LCMXO2-7000HC-4TG144C shines. With 6864 LUTs the device can host multi-master I2C controllers, SPI-to-I2C bridges, UART-to-SPI converters, and protocol translation glue that would otherwise consume large amounts of MCU cycles. Per-bank VCCIO from 1.2 V to 3.3 V lets one FPGA bridge between 1.8 V sensors and a 3.3 V host MCU without external level translation. The on-chip flash configuration eliminates the boot PROM, reducing BOM cost and PCB area versus SRAM-based FPGA solutions.
Recomendado
I/O Expansion and Level Translation
Designers use the LCMXO2-7000HC-4TG144C to expand MCU GPIO counts and translate voltages between incompatible logic domains. The 114 user I/O pins give a small MCU up to 100+ extra general-purpose lines, each individually configurable as input, output, or open-drain with internal pull-ups. Eight I/O banks allow simultaneous 1.2 V, 1.8 V, 2.5 V, and 3.3 V peripherals on the same device. Compared to discrete level-translator ICs, the FPGA collapses multiple shifters into a single programmable part, simplifying layout and reducing component count on industrial and consumer boards.
Recomendado
Display and LED Control
The LCMXO2-7000HC-4TG144C is widely deployed as a low-cost display controller for small TFTs, segment LCDs, character displays, and large LED matrices. The 6864 LUTs handle display refresh, character RAM lookups, and PWM generation for LED dimming in parallel with a low-cost host MCU. The on-chip User Flash Memory (UFM) can store font tables and timing constants, offloading the host processor. Per the MachXO2 family datasheet, the device supports LVCMOS 3.3 V and LVDS outputs suitable for direct drive of small LCD panels and LED driver ICs.
Recomendado
Motor Control Glue Logic
Motor control systems need fast, deterministic glue logic between a DSP/MCU, gate drivers, and feedback sensors, exactly the role the LCMXO2-7000HC-4TG144C fills. The 6864 LUTs can implement encoder decoding (QEI), Hall-sensor commutation tables, PWM protection, fault logging, and SPI links to intelligent gate drivers. Its commercial 0 C to 85 C temperature grade covers most indoor motor applications, while the LCMXO2-7000HC-4TG144I industrial variant extends to outdoor or under-hood environments. The 65 nm low-power process ensures the FPGA itself does not heat the enclosure.
Recomendado
Industrial Control and White Goods HMI
The LCMXO2-7000HC-4TG144C is a strong fit for industrial control boards and white-goods human-machine interfaces (HMIs) where reliability, instant-on, and field upgradability matter. Typical functions include keypad scanning, LED matrix driving, seven-segment display control, buzzer PWM, and interface isolation between analog front-ends and the main MCU. Because the MachXO2 retains bitstream without an external PROM, white-goods designs can survive brown-outs and brown-out resets without reconfiguration delays. The device is RoHS3 compliant and Lead Free per the Lattice product page, meeting modern environmental directives.
Recomendado
Telecom Line Card Glue Logic
Telecom line cards use the LCMXO2-7000HC-4TG144C for backplane bridging, I2C muxing, interrupt aggregation, and low-speed SERDES replacement. Its 6864 LUTs and 114 I/O easily handle dozens of status LEDs, alarm outputs, and sideband signals. The hardened LVDS pairs support point-to-point sideband communications between line-card MCUs and the chassis supervisor. Compared to discrete logic, the MachXO2 consolidates 5 to 10 small logic ICs into a single programmable part, reducing board area and improving reliability.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LCMXO2-7000HC-4TG144C — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LCMXO2-4000HC-4TG144C | LCMXO2-7000HE-4TG144C | LCMXO2-7000HC-6TG144C | LCMXO2-7000HC-4TG144I | LCMXO2-2000HC-4TG144C |
|---|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) | 144-TQFP (same) |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Number of LUTs | 6864 | 4320 (-37%) | 6864 (same) | 6864 (same) | 6864 (same) | 2112 (-69%) |
| Number of I/O | 114 to 115 | 114 (same) | 114 (same) | 114 (same) | 114 (same) | 114 (same) |
| Speed Grade | 4 | 4 (same) | 4 (same HE) | 6 (slower) | 4 (same) | 4 (same) |
| Embedded Block RAM | 245 kbit | 92 kbit (-62%) | 245 kbit (same) | 245 kbit (same) | 245 kbit (same) | 34 kbit (-86%) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C (Industrial) | 0 C to +85 C |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| RoHS Compliance | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant | RoHS3 Compliant |
Principais diferenciais
- Higher LUT count and EBR than the LCMXO2-4000HC-4TG144C in the same 144-TQFP footprint (vs LCMXO2-4000HC-4TG144C)
- Same LUT architecture as the LCMXO2-7000HE-4TG144C but lower power consumption (vs LCMXO2-7000HE-4TG144C)
- On-chip non-volatile flash configuration eliminates external boot PROM (vs SRAM-based FPGAs in similar 144-TQFP packages)
- Hardened I/O banks support 1.2 V to 3.3 V mixed-voltage designs (vs Discrete level-translator ICs plus a CPLD)
Notas de projeto
The LCMXO2-7000HC-4TG144C requires separate decoupling on VCC (core), VCCIOx (per I/O bank), and VCCAUX (PLL analog). Place a 0.1 uF X7R ceramic cap on every VCC/VCCIO/VCCAUX pin pair, and add a bulk 10 uF tantalum or ceramic within 1 inch of the package. Estimated: with 114 I/O at 8 mA each switching at 50 MHz, expect core current draw of approximately 80 to 120 mA - mark the supply with at least 250 mA headroom.
Route clock traces first with controlled impedance and short stubs. Per the MachXO2 family datasheet, the PLL analog supply VCCAUX must be filtered with a ferrite bead or 10 ohm resistor in series and decoupled to analog ground (GNDA) for low PLL jitter. Keep all PLL clock traces away from switching I/O on adjacent layers to avoid coupling.
Do not leave JTAG pins floating; if JTAG is unused, route TDI, TMS to a defined logic level via internal pull-ups. Per the MachXO2 datasheet, an unconnected TCK can cause spurious configuration requests. Also confirm that PROGRAMN is tied high through a 1 kohm to 10 kohm resistor, not driven low at power-up, to avoid an inadvertent configuration cycle.
When using LVDS pairs on the MachXO2, match trace lengths within 150 mil and maintain 100 ohm differential impedance. Series-couple each LVDS pair with a 100 ohm resistor near the driver pin. Estimated: differential return loss above 10 dB at 200 MHz is achievable on standard 4-layer FR-4 with proper stack-up. Consult the MachXO2 hardware checklist for working with silicon guidance.
Place all decoupling capacitors on the same layer as the FPGA, within 100 mil of their respective supply pin. Use a continuous ground plane on layer 2 for shortest return paths. Per the Lattice hardware checklist, vias-in-pad are acceptable for the 144-TQFP thermal pad, which should be soldered to a copper pad connected to the ground plane for improved thermal dissipation.
Informações de conformidade
RoHS3 Compliant and Lead Free per Lattice product page. REACH compliance status not detailed in the verified snippets. AEC-Q100 not applicable - Lattice does not qualify MachXO2 to automotive grade; choose LCMXO2-7000HC-4TG144I only for industrial temperature ranges, not for AEC-Q100 automotive designs.
