LMQ66420MC3RXBRQ1 - 36V 2A Low-EMI Automotive Buck | TI
N.º de pieza: LMQ66420MC3RXBRQ1 ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
| 3.000 | $0 | $0,00 |
LMQ66420MC3RXBRQ1 Descripción general
A synchronous step-down converter (buck regulator) is a DC-DC switch-mode converter that steps down a higher input voltage to a lower output voltage using high-side and low-side MOSFET switches. In the power management IC hierarchy, a synchronous buck converter is a key building block in power management units for automotive processors, FPGAs, and MCUs. It provides higher efficiency than LDOs when the input-to-output differential is large, at the cost of switching noise. This converter's ZEN 2 technology targets ultra-low EMI for noise-sensitive automotive systems.
Key features of the LMQ66420MC3RXBRQ1 include 1.5µA quiescent current, integrated VIN bypass and bootstrap capacitors, MODE/SYNC pin for frequency adjustment and synchronization, AEC-Q100 qualification, and a -40°C to 150°C operating temperature range. The low EMI ZEN 2 architecture reduces the need for external filtering and shielding. The 14-pin VQFN-FCRLF (RXB) package supports compact layouts for camera modules and ADAS sensors.
The device is built as an ultra-small synchronous automotive step-down converter. The MODE/SYNC pin can set the frequency or synchronize it to avoid noise-sensitive frequency bands, an important feature for EMI-sensitive applications. NC pins between critical high-voltage pins reduce potential failures and improve pin FMEA, according to TI product information.
This converter is ideal for automotive ADAS domain controllers, infotainment systems, gateways, telematics units, camera module power, industrial 24V distributed power, and processor core rails. It efficiently powers SoCs, FPGAs and MCUs from a 12V or 24V bus.
Designers should follow TI's layout guidance for low-EMI buck converters: place the input capacitor near the VIN pin, use the exposed thermal pad, and select a shielded inductor sized for 2A output. The integrated VIN bypass capacitor reduces high-frequency loop inductance but does not replace the required external bulk input capacitance.
Alternativas directas para LMQ66420MC3RXBRQ1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LMQ66420MC3RXBRQ1 (mismo factor de forma y huella) — difiere en Input Voltage Range, Operating Temperature Range, Package.
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LMQ66420MA3RXBRQ1
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$1.82 / unidad
Ver hoja de datos →LMQ66420MB3RXBRQ1
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LMQ66410MC3RXBRQ1
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LMQ66410MA3RXBRQ1
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LMQ66430MC3RXBRQ1
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LMQ66420MC3RXBRQ1 Valores máximos y características eléctricas
| Función | Synchronous buck step-down converter |
| Output Current | 2 A |
| Rango de tensión de entrada | 3 V to 36 V |
| Output Voltage Configuration | Positive adjustable (fixed) 1V (3.3V) |
| Corriente en reposo | 1.5 µA |
| Número de salidas | 1 |
| Rectificación síncrona | Yes |
| Integrated VIN Bypass Capacitor | Yes |
| Integrated CBOOT Capacitor | Yes |
| EMI Mitigation | ZEN 2 ultra-low-EMI technology |
| MODE/SYNC Pin | Yes (frequency setting and synchronization) |
| Encapsulado | VQFN-FCRLF (RXB) 14 |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | -40°C to 150°C |
| Automotive Qualification | AEC-Q100 qualified |
| Family | LMQ664x0-Q1 |
Guía de configuración de pines de LMQ66420MC3RXBRQ1 vqfn-fcrlf (rxb) 14
Configuración de pines para LMQ66420MC3RXBRQ1 (encapsulado vqfn-fcrlf (rxb) 14). Este dispositivo de potencia presenta terminales de puerta, drenador y fuente. Para encapsulados no polarizados, consulte la hoja de datos del fabricante para conocer la orientación exacta del pin 1 y los detalles del footprint. Las aplicaciones habituales incluyen el diseño de fuentes de alimentación, el accionamiento de motores y la conmutación de cargas.
No hay datos detallados de patillaje disponibles para LMQ66420MC3RXBRQ1.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LMQ66420MC3RXBRQ1 es adecuado para 6 aplicacións: Automotive ADAS Domain Controller, Automotive Infotainment and Cluster, Automotive Gateway/Telematics, Camera Module Power, Industrial 24V Distributed Power, Processor Core/IO Rails in Safety Controllers.
Automotive ADAS Domain Controller
The LMQ66420MC3RXBRQ1 efficiently steps down the 12V automotive battery to a clean 3.3V or 1V rail for ADAS SoCs. Its 36V input rating handles load-dump transients, while 2A output supports MCU/IO and sensor aggregation. The ZEN 2 low-EMI architecture and MODE/SYNC are critical for meeting CISPR 25 requirements in camera and radar compute modules. Using integrated VIN bypass and CBOOT capacitors minimizes PCB area and parasitic inductance. For processor power sequencing, pair with TDA4VL21HGAALZRQ1 and an LP87725-Q1 PMIC for multi-rail support.
Recomendado
Automotive Infotainment and Cluster
Infotainment systems demand low ripple and low EMI for audio/video SoCs. The LMQ66420MC3RXBRQ1 provides up to 2A at 3.3V from a 12V bus, reducing beat frequencies with programmable switching frequency via MODE/SYNC. The synchronous design achieves high efficiency, reducing thermal load inside the cabin. Integrated CBOOT capacitor simplifies layout. This converter can power display interfaces and audio codecs while an LP87725-Q1 supervises the rail. Its AEC-Q100 qualification suits head-unit and cluster applications with extended temperature range.
Recomendado
Automotive Gateway/Telematics
Always-on telematics units benefit from the 1.5µA quiescent current of the LMQ66420MC3RXBRQ1, enabling low-power standby in vehicles. The 3V to 36V input range covers cold-crank and load-dump events. The 2A output can power a gateway MCU such as AM62A1-Q1 and communication interfaces. The low-EMI ZEN 2 converter helps pass module-level emissions tests. Integrated capacitors save space in compact telematics enclosures. Pair with TPS65036x-Q1 for additional managed power rails.
Recomendado
Camera Module Power
Surround-view cameras require small, low-noise power solutions in constrained housings. The LMQ66420MC3RXBRQ1's 14-pin VQFN-FCRLF package and integrated VIN bypass and CBOOT capacitors reduce the external component footprint. With 2A output and fixed 3.3V option, it can supply the imager, serializer, and signal conditioner. Its 36V input tolerance simplifies connection to battery or module pre-regulator. The ultra-low EMI characteristic reduces interference with image sensor clocking. It complements image processors and is suitable for automotive camera modules.
Recomendado
Industrial 24V Distributed Power
In industrial robotics and factory controllers, 24V bus rails may see transients up to 36V. The LMQ66420MC3RXBRQ1 accepts 3V to 36V and provides 2A at 1V/3.3V for MCUs, FPGAs, and I/O. The synchronous architecture gives high efficiency, reducing heatsink requirements in sealed enclosures. The MODE/SYNC pin allows synchronizing multiple converters to a single clock, simplifying EMI compliance. Use with TMS320F280037C-Q1 or similar MCUs in PLC and motor-control I/O boards.
Recomendado
Processor Core/IO Rails in Safety Controllers
Safety-critical automotive controllers require predictable power delivery. The LMQ66420MC3RXBRQ1 can power the core or I/O rail of a real-time MCU like TMS320F28P650SH-Q1 from a 12V supply. The integrated VIN bypass and CBOOT capacitors reduce switching-loop parasitics, improving output voltage transient response. The 2A rating is sufficient for MCU plus peripheral loads, while the low quiescent current supports sleep modes. AEC-Q100 qualification and pin FMEA design aid functional safety implementations; combine with a system basis chip for monitoring.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LMQ66420MC3RXBRQ1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LMQ66420MA3RXBRQ1 | LMQ66420MB3RXBRQ1 | LMQ66410MC3RXBRQ1 | LMQ66430MC3RXBRQ1 |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | VQFN-FCRLF (RXB) 14 | VQFN-FCRLF (RXB) 14 - same | VQFN-FCRLF (RXB) 14 - same | VQFN-FCRLF (RXB) 14 - same | VQFN-FCRLF (RXB) 14 - same |
| Output Current | 2 A | 2 A | 2 A | 1 A | 3 A |
| Input Voltage Range | 3V to 36V | 3V to 36V | 3V to 36V | 3V to 36V | 3V to 36V |
| Quiescent Current | 1.5 µA | 1.5 µA | 1.5 µA | 1.5 µA | 1.5 µA |
| Integrated VIN Bypass/CBOOT Capacitors | Yes | Yes | Yes | Yes | Yes |
| ZEN 2 Low-EMI Technology | Yes | Yes | Yes | Yes | Yes |
| Automotive Qualification | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
Diferenciadores clave
- 2A output current in a compact 14-pin VQFN-FCRLF package with integrated capacitors (frente a LMQ66410MC3RXBRQ1)
- 1.5µA quiescent current for always-on automotive loads (frente a LMQ66430MC3RXBRQ1)
- ZEN 2 ultra-low-EMI technology with integrated bypass/boost capacitors (frente a LMQ66420MA3RXBRQ1)
Notas de diseño
Place a 10µF ceramic input capacitor as close to the VIN pin as possible. The LMQ66420MC3RXBRQ1 integrates the VIN bypass and CBOOT capacitors, but the external input capacitor is still required for stability and ripple reduction. Add multiple vias to the exposed thermal pad and keep the high-frequency switching loop (VIN-SW-GND) small to realize ZEN 2 low-EMI benefits.
Use the MODE/SYNC pin to set the switching frequency or synchronize it to an external clock, avoiding noise-sensitive frequency bands in automotive systems. The ZEN 2 architecture already reduces EMI, but with a 2A buck converter, select a shielded inductor and minimize the output trace loop area to keep conducted and radiated emissions low.
At 2A output, the LMQ66420MC3RXBRQ1's power loss depends on input/output differential and switching frequency. For junction temperatures up to 150°C in automotive environments, provide a sufficient copper area connected to the VQFN-FCRLF exposed pad. Use thermal vias to an internal ground plane and calculate junction temperature using the device's thermal metrics before final layout.
Información de cumplimiento
Automotive AEC-Q100 qualified per TI product page. RoHS/REACH/lead-free status not explicitly listed in the provided web data and should be confirmed from the latest TI datasheet and packing information.
