M1AFS1500-1FGG676I - Fusion Mixed-Signal FPGA 252 I/O | Microchip
N.º de pieza: M1AFS1500-1FGG676I ✓ Activo| Cant. | Precio unitario | Total |
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M1AFS1500-1FGG676I Descripción general
A mixed-signal FPGA is a field-programmable gate array that combines digital programmable logic fabric with on-chip analog peripherals, flash memory blocks, and clock management circuitry in a single monolithic die. Within the power-management hierarchy of programmable logic, the Fusion family sits alongside pure digital FPGA families but uniquely integrates configurable analog blocks, making it a system-on-chip alternative that can replace discrete MCUs, supervisory ICs, and analog monitoring components.
Key features include flash-based (non-volatile) configuration that eliminates external boot PROMs and gives instant-on operation, integrated analog peripherals for voltage, current, and temperature monitoring, large embedded flash memory blocks, and comprehensive clock generation and management circuitry. The 252 available I/Os support industrial interfaces, and the FGG676 ball grid array provides dense, thermally robust surface-mount connectivity.
Technically, the device uses Microsemi 130nm flash process technology, storing configuration in floating-gate cells rather than SRAM, which delivers inherent SEU resistance and zero configuration time. The -1 speed grade supports system timing targets suitable for control-plane and monitoring applications rather than the highest-speed datapath designs; the cited 1282.05 MHz figure reflects datasheet family characterization metrics.
Typical applications include industrial automation controllers, power-supply supervision and telemetry, embedded system management, aerospace and defense control logic where non-volatile secure configuration is mandated, and medical instrumentation front ends that benefit from on-chip analog monitoring.
When designing with this part, budget the 1.5V core and I/O bank rails carefully, and verify bank voltage compatibility for your interface standards before layout.
This page synthesizes distributor availability, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para M1AFS1500-1FGG676I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con M1AFS1500-1FGG676I (mismo factor de forma y huella) — difiere en Family, Package, RoHS Status, System Gates, Core Supply Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
AFS1500-1FGG676I
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M1AFS1500-2FGG676I
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$59.6 / unidad
Ver hoja de datos →M1AFS1500-FGG676I
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$89.9 / unidad
Ver hoja de datos →M1AFS1500-1FGG676I Valores máximos y características eléctricas
| Family | Fusion (Mixed-Signal FPGA) |
| System Gates | 1.5 M gates |
| Logic Resources | 276480 bits |
| User I/O | 252 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash-based |
| Configuration Memory | Flash (non-volatile, instant-on) |
| Speed Grade | -1 |
| Encapsulado | 676-pin FBGA (FGG676) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Tipo de montaje | Surface Mount |
| Analog Peripherals | Integrated configurable analog blocks (voltage, current, temperature monitoring) |
| Embedded Flash Memory | Large flash memory blocks integrated |
| Clock Management | Integrated clock generation and management circuitry |
| On-Chip Frequency Characterization | 1282.05 MHz (datasheet family metric) |
| Packaging | Tray |
Guía de configuración de pines de M1AFS1500-1FGG676I 676-pin fbga (fgg676)
Configuración de pines para M1AFS1500-1FGG676I (encapsulado 676-pin fbga (fgg676)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para M1AFS1500-1FGG676I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
M1AFS1500-1FGG676I es adecuado para 6 aplicacións: Industrial Automation Controllers, Power Supply Supervision and Telemetry, Aerospace and Defense System Management, Embedded System Management (BMC/Chassis Management), Medical Instrumentation Monitoring, Test and Measurement Equipment.
Industrial Automation Controllers
The M1AFS1500-1FGG676I fits industrial controller designs that need a single monolithic device combining programmable logic, flash configuration, and analog telemetry. Its 252 user I/Os support multiple industrial interface banks, while the integrated analog blocks monitor board-level voltage, current, and temperature without external supervisory ICs. Because configuration is flash-based, the controller is operational within milliseconds of power-up - important for machinery with strict reset-to-run requirements. The 130nm fabric at the -1 speed grade comfortably implements state machines, interlocks, and communication glue logic; the trade-off is that this is not the fastest fabric available, so designers should keep high-throughput datapaths modest and rely on the device's integration advantage for control-plane logic in factory automation and motor-control supervisory nodes.
Recomendado
Power Supply Supervision and Telemetry
Fusion's defining feature is its configurable analog subsystem, making the M1AFS1500-1FGG676I a natural fit for multi-rail power-supply supervision. On-chip analog monitoring tracks voltages, currents, and temperature across the backplane, and the flash fabric implements threshold logic, sequencing, and fault logging without a separate microcontroller. In a typical deployment the FPGA watches 12 or more rails, asserts enable signals in the correct sequence, and reports telemetry over an embedded interface; unlike a discrete supervisor chain, thresholds and sequences are reprogrammable in the field. Designers should budget the analog block's channel count and accuracy expectations from the Fusion datasheet, since this integration replaces several discrete monitor ICs and shrinks BOM cost in telecom rectifiers, server power shelves, and industrial PSU monitoring.
Recomendado
Aerospace and Defense System Management
Flash-based configuration gives the M1AFS1500-1FGG676I inherent single-event-upset resilience compared with SRAM FPGAs, and the monolithic device powers up with valid configuration instantly - two properties valued in defense ground systems, test sets, and platform management units. The industrial -40C to +85C grade covers most ground-based environments, and the 676-ball FBGA provides the I/O density needed for chassis management, built-in-test, and secure bootstrap functions. Note that this commercial-industrial part is not radiation qualified: for flight missions, Microchip's RTAX family (such as RTAX2000S or RTAX4000S) is the appropriate qualified choice. For non-rad programs, Fusion reduces component count by folding housekeeping analog, flash storage, and control logic into one die, improving reliability and shrinking board area in constrained enclosures.
Recomendado
Embedded System Management (BMC/Chassis Management)
The M1AFS1500-1FGG676I serves as a system-management controller in servers, storage shelves, and telecom chassis, where it aggregates fan, temperature, voltage, and slot-presence signals. The integrated flash blocks store logs and firmware images, the analog blocks digitize sensor inputs directly, and the 1.5V-core fabric implements protocol bridges to the management network. Because Fusion is non-volatile and instant-on, management functions are available before host processors boot - critical for pre-boot health checks and Brownout protection. With 252 I/Os the device can fan out to many slots without external buffer logic. Designers trade off the 130nm fabric's modest performance against this integration: management state machines and I2C/UART bridges run comfortably, but the part is not intended for host datapath processing.
Recomendado
Medical Instrumentation Monitoring
Medical diagnostic devices benefit from the M1AFS1500-1FGG676I's ability to monitor internal supply rails, patient-module connection integrity, and enclosure temperature through its configurable analog blocks while simultaneously implementing interface and control logic in flash fabric. Non-volatile configuration ensures the instrument is functional the moment power is applied, supporting the fast power-up expectations of point-of-care equipment, and field upgrades are performed by reprogramming flash without changing hardware. The industrial temperature grade covers clinical environments comfortably. Typical roles include front-end sequencing for analog acquisition boards, interlock logic for X-ray or laser subsystems, and communication glue logic between acquisition ASICs and the host compute module. Designers should follow IEC 60601 system-level isolation practices externally, since the FPGA itself does not provide patient-isolation barriers.
Recomendado
Test and Measurement Equipment
Bench and rack instruments use the M1AFS1500-1FGG676I as housekeeping and interface logic: the analog subsystem monitors internal rails and self-temperature, the flash fabric implements trigger distribution, relay control, and bus interfaces, and 252 I/Os connect front-panel and backplane signals without external glue. Instant-on flash configuration lets the instrument pass self-test immediately at power-up, an expectation in automated test systems where boot delays reduce throughput. The -1 speed grade handles management and interface clocks; designers needing nanosecond-grade timing capture should pair the FPGA with dedicated front-end circuitry. Integration of monitoring, storage, and logic in one die shortens the instrument's board and firmware bring-up compared with a discrete supervisor-plus-CPLD-plus-flash approach commonly used in legacy designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para M1AFS1500-1FGG676I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | AFS1500-1FGG676I | M1AFS1500-2FGG676I | M1AFS1500-FGG676I |
|---|---|---|---|---|
| Package | 676-pin FBGA (FGG676) | 676-pin FBGA (FGG676) - same | 676-pin FBGA (FGG676) - same | 676-pin FBGA (FGG676) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 1.5 M gates | 1.5 M gates | 1.5 M gates | 1.5 M gates |
| User I/O | 252 | 252 | 252 | 252 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -1 | -1 | -2 (faster) | Standard (slower than -1) |
| Configuration Memory | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
Diferenciadores clave
- Faster timing at no footprint cost (frente a M1AFS1500-FGG676I)
- Same silicon through an alternate ordering flow (frente a AFS1500-1FGG676I)
- Non-volatile flash configuration with integrated analog (frente a Xilinx/Intel SRAM FPGAs)
Notas de diseño
The M1AFS1500-1FGG676I runs from a 1.5V core with additional per-bank I/O rails set by the interface standards used. Estimate core current from the Microchip Fusion power calculator in Libero SoC before sizing regulators; Fusion flash fabric draws essentially zero configuration current at power-up, unlike SRAM FPGAs, which simplifies inrush design. Decouple each rail with bulk ceramic plus local 0.1uF capacitors at BGA via field arrays, and follow the Fusion family power sequencing application note to ensure I/O banks do not back-drive the core during multi-rail ramp-up.
A 676-ball FBGA with 1.0mm or finer pitch requires careful fanout planning: use via-in-pad or dogbone fanout on outer rows and route inner balls on inner layers. Target controlled-impedance stackup for high-speed I/O banks and reserve solid ground planes adjacent to signal layers. Place bulk capacitance for the 1.5V core distributed symmetrically under the package to minimize IR drop across the ball field. Follow Microchip's Fusion PCB layout guidelines for ball-map escape routing, and verify land pattern per the FGG676 mechanical drawing in the datasheet before fabrication.
Two frequent mistakes with Fusion designs: (1) assuming a cross-brand FPGA can substitute - Fusion's integrated analog subsystem and flash fabric have no pin-compatible equivalent, so supply-chain plans should qualify AFS1500-1FGG676I or FGG676 speed-grade variants instead; (2) overlooking that speed grades are not interchangeable for timing-critical designs - a standard-grade device may not meet timing closure verified on a -1 or -2 part. Always re-run Libero SoC timing analysis after any device substitution, and confirm date-code authenticity when purchasing mature Fusion inventory from broker channels.
Información de cumplimiento
Compliance status not stated in the provided web data; verify RoHS/REACH status on the official Microchip M1AFS1500 product page compliance documentation.
