M1AFS1500-1FGG676I - Fusion Mixed-Signal FPGA 252 I/O | Microchip
부품 번호: M1AFS1500-1FGG676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
M1AFS1500-1FGG676I 개요
A mixed-signal FPGA is a field-programmable gate array that combines digital programmable logic fabric with on-chip analog peripherals, flash memory blocks, and clock management circuitry in a single monolithic die. Within the power-management hierarchy of programmable logic, the Fusion family sits alongside pure digital FPGA families but uniquely integrates configurable analog blocks, making it a system-on-chip alternative that can replace discrete MCUs, supervisory ICs, and analog monitoring components.
Key features include flash-based (non-volatile) configuration that eliminates external boot PROMs and gives instant-on operation, integrated analog peripherals for voltage, current, and temperature monitoring, large embedded flash memory blocks, and comprehensive clock generation and management circuitry. The 252 available I/Os support industrial interfaces, and the FGG676 ball grid array provides dense, thermally robust surface-mount connectivity.
Technically, the device uses Microsemi 130nm flash process technology, storing configuration in floating-gate cells rather than SRAM, which delivers inherent SEU resistance and zero configuration time. The -1 speed grade supports system timing targets suitable for control-plane and monitoring applications rather than the highest-speed datapath designs; the cited 1282.05 MHz figure reflects datasheet family characterization metrics.
Typical applications include industrial automation controllers, power-supply supervision and telemetry, embedded system management, aerospace and defense control logic where non-volatile secure configuration is mandated, and medical instrumentation front ends that benefit from on-chip analog monitoring.
When designing with this part, budget the 1.5V core and I/O bank rails carefully, and verify bank voltage compatibility for your interface standards before layout.
This page synthesizes distributor availability, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: M1AFS1500-1FGG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS1500-1FGG676I (동일 폼 팩터 및 풋프린트) — 차이점: Family, Package, RoHS Status, System Gates, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
AFS1500-1FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS1500-2FGG676I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$59.6 / 개
데이터시트 보기 →M1AFS1500-FGG676I
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$89.9 / 개
데이터시트 보기 →M1AFS1500-1FGG676I 최대 정격 & 전기적 특성
| Family | Fusion (Mixed-Signal FPGA) |
| System Gates | 1.5 M gates |
| Logic Resources | 276480 bits |
| User I/O | 252 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm flash-based |
| Configuration Memory | Flash (non-volatile, instant-on) |
| Speed Grade | -1 |
| 패키지 | 676-pin FBGA (FGG676) |
| 동작 온도 | -40C to +85C (industrial) |
| 실장 유형 | Surface Mount |
| Analog Peripherals | Integrated configurable analog blocks (voltage, current, temperature monitoring) |
| Embedded Flash Memory | Large flash memory blocks integrated |
| Clock Management | Integrated clock generation and management circuitry |
| On-Chip Frequency Characterization | 1282.05 MHz (datasheet family metric) |
| Packaging | Tray |
M1AFS1500-1FGG676I 676-pin fbga (fgg676) 핀 구성 가이드
M1AFS1500-1FGG676I(676-pin fbga (fgg676) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS1500-1FGG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS1500-1FGG676I 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Power Supply Supervision and Telemetry, Aerospace and Defense System Management, Embedded System Management (BMC/Chassis Management), Medical Instrumentation Monitoring, Test and Measurement Equipment.
Industrial Automation Controllers
The M1AFS1500-1FGG676I fits industrial controller designs that need a single monolithic device combining programmable logic, flash configuration, and analog telemetry. Its 252 user I/Os support multiple industrial interface banks, while the integrated analog blocks monitor board-level voltage, current, and temperature without external supervisory ICs. Because configuration is flash-based, the controller is operational within milliseconds of power-up - important for machinery with strict reset-to-run requirements. The 130nm fabric at the -1 speed grade comfortably implements state machines, interlocks, and communication glue logic; the trade-off is that this is not the fastest fabric available, so designers should keep high-throughput datapaths modest and rely on the device's integration advantage for control-plane logic in factory automation and motor-control supervisory nodes.
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Power Supply Supervision and Telemetry
Fusion's defining feature is its configurable analog subsystem, making the M1AFS1500-1FGG676I a natural fit for multi-rail power-supply supervision. On-chip analog monitoring tracks voltages, currents, and temperature across the backplane, and the flash fabric implements threshold logic, sequencing, and fault logging without a separate microcontroller. In a typical deployment the FPGA watches 12 or more rails, asserts enable signals in the correct sequence, and reports telemetry over an embedded interface; unlike a discrete supervisor chain, thresholds and sequences are reprogrammable in the field. Designers should budget the analog block's channel count and accuracy expectations from the Fusion datasheet, since this integration replaces several discrete monitor ICs and shrinks BOM cost in telecom rectifiers, server power shelves, and industrial PSU monitoring.
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Aerospace and Defense System Management
Flash-based configuration gives the M1AFS1500-1FGG676I inherent single-event-upset resilience compared with SRAM FPGAs, and the monolithic device powers up with valid configuration instantly - two properties valued in defense ground systems, test sets, and platform management units. The industrial -40C to +85C grade covers most ground-based environments, and the 676-ball FBGA provides the I/O density needed for chassis management, built-in-test, and secure bootstrap functions. Note that this commercial-industrial part is not radiation qualified: for flight missions, Microchip's RTAX family (such as RTAX2000S or RTAX4000S) is the appropriate qualified choice. For non-rad programs, Fusion reduces component count by folding housekeeping analog, flash storage, and control logic into one die, improving reliability and shrinking board area in constrained enclosures.
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Embedded System Management (BMC/Chassis Management)
The M1AFS1500-1FGG676I serves as a system-management controller in servers, storage shelves, and telecom chassis, where it aggregates fan, temperature, voltage, and slot-presence signals. The integrated flash blocks store logs and firmware images, the analog blocks digitize sensor inputs directly, and the 1.5V-core fabric implements protocol bridges to the management network. Because Fusion is non-volatile and instant-on, management functions are available before host processors boot - critical for pre-boot health checks and Brownout protection. With 252 I/Os the device can fan out to many slots without external buffer logic. Designers trade off the 130nm fabric's modest performance against this integration: management state machines and I2C/UART bridges run comfortably, but the part is not intended for host datapath processing.
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Medical Instrumentation Monitoring
Medical diagnostic devices benefit from the M1AFS1500-1FGG676I's ability to monitor internal supply rails, patient-module connection integrity, and enclosure temperature through its configurable analog blocks while simultaneously implementing interface and control logic in flash fabric. Non-volatile configuration ensures the instrument is functional the moment power is applied, supporting the fast power-up expectations of point-of-care equipment, and field upgrades are performed by reprogramming flash without changing hardware. The industrial temperature grade covers clinical environments comfortably. Typical roles include front-end sequencing for analog acquisition boards, interlock logic for X-ray or laser subsystems, and communication glue logic between acquisition ASICs and the host compute module. Designers should follow IEC 60601 system-level isolation practices externally, since the FPGA itself does not provide patient-isolation barriers.
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Test and Measurement Equipment
Bench and rack instruments use the M1AFS1500-1FGG676I as housekeeping and interface logic: the analog subsystem monitors internal rails and self-temperature, the flash fabric implements trigger distribution, relay control, and bus interfaces, and 252 I/Os connect front-panel and backplane signals without external glue. Instant-on flash configuration lets the instrument pass self-test immediately at power-up, an expectation in automated test systems where boot delays reduce throughput. The -1 speed grade handles management and interface clocks; designers needing nanosecond-grade timing capture should pair the FPGA with dedicated front-end circuitry. Integration of monitoring, storage, and logic in one die shortens the instrument's board and firmware bring-up compared with a discrete supervisor-plus-CPLD-plus-flash approach commonly used in legacy designs.
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추천 제품 요약
엔지니어링 참조 데이터: M1AFS1500-1FGG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | AFS1500-1FGG676I | M1AFS1500-2FGG676I | M1AFS1500-FGG676I |
|---|---|---|---|---|
| Package | 676-pin FBGA (FGG676) | 676-pin FBGA (FGG676) - same | 676-pin FBGA (FGG676) - same | 676-pin FBGA (FGG676) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| System Gates | 1.5 M gates | 1.5 M gates | 1.5 M gates | 1.5 M gates |
| User I/O | 252 | 252 | 252 | 252 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -1 | -1 | -2 (faster) | Standard (slower than -1) |
| Configuration Memory | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
주요 차별점
- Faster timing at no footprint cost (vs M1AFS1500-FGG676I)
- Same silicon through an alternate ordering flow (vs AFS1500-1FGG676I)
- Non-volatile flash configuration with integrated analog (vs Xilinx/Intel SRAM FPGAs)
설계 노트
The M1AFS1500-1FGG676I runs from a 1.5V core with additional per-bank I/O rails set by the interface standards used. Estimate core current from the Microchip Fusion power calculator in Libero SoC before sizing regulators; Fusion flash fabric draws essentially zero configuration current at power-up, unlike SRAM FPGAs, which simplifies inrush design. Decouple each rail with bulk ceramic plus local 0.1uF capacitors at BGA via field arrays, and follow the Fusion family power sequencing application note to ensure I/O banks do not back-drive the core during multi-rail ramp-up.
A 676-ball FBGA with 1.0mm or finer pitch requires careful fanout planning: use via-in-pad or dogbone fanout on outer rows and route inner balls on inner layers. Target controlled-impedance stackup for high-speed I/O banks and reserve solid ground planes adjacent to signal layers. Place bulk capacitance for the 1.5V core distributed symmetrically under the package to minimize IR drop across the ball field. Follow Microchip's Fusion PCB layout guidelines for ball-map escape routing, and verify land pattern per the FGG676 mechanical drawing in the datasheet before fabrication.
Two frequent mistakes with Fusion designs: (1) assuming a cross-brand FPGA can substitute - Fusion's integrated analog subsystem and flash fabric have no pin-compatible equivalent, so supply-chain plans should qualify AFS1500-1FGG676I or FGG676 speed-grade variants instead; (2) overlooking that speed grades are not interchangeable for timing-critical designs - a standard-grade device may not meet timing closure verified on a -1 or -2 part. Always re-run Libero SoC timing analysis after any device substitution, and confirm date-code authenticity when purchasing mature Fusion inventory from broker channels.
규정 준수 정보
Compliance status not stated in the provided web data; verify RoHS/REACH status on the official Microchip M1AFS1500 product page compliance documentation.
