M1AFS1500-1FGG676I vs M1AFS1500-1FG676I Comparación
Comparación detallada lado a lado de M1AFS1500-1FGG676I por Microchip Technology y M1AFS1500-1FG676I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-1FGG676I - Fusion Mixed-Signal FPGA 252 I/O | Microchip
M1AFS1500-1FGG676I ✓ ActivoMicrochip Technology
M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip
M1AFS1500-1FG676I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-1FGG676I | M1AFS1500-1FG676I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $340,59 |
| Family | Fusion (Mixed-Signal FPGA) | — |
| System Gates | 1.5 M gates | — |
| Logic Resources | 276480 bits | — |
| User I/O | 252 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | 130 nm CMOS |
| Configuration Memory | Flash (non-volatile, instant-on) | — |
| Speed Grade | -1 | -1 |
| Encapsulado | 676-pin FBGA (FGG676) | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Tipo de montaje | Surface Mount | — |
| Analog Peripherals | Integrated configurable analog blocks (voltage, current, temperature monitoring) | — |
| Embedded Flash Memory | Large flash memory blocks integrated | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| On-Chip Frequency Characterization | 1282.05 MHz (datasheet family metric) | — |
| Packaging | Tray | Tray |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Manufacturer Part Number | — | M1AFS1500-1FG676I |
| Manufacturer | — | Microchip Technology (Microsemi) |
| Product Type | — | Fusion Mixed-Signal FPGA |
| Number of Gates | — | 1.5 M |
| Number of I/O | — | 252 |
| Encapsulado / Carcasa | — | 676-Pin FBGA |
| Estilo de montaje | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 (168 Hours) |
| Peak Reflow Time | — | 30 s |
| Lead Free Status | — | Contains Lead |