M1AFS250-FG256I - 250K FPGA, 256-LBGA | Microchip
N.º de pieza: M1AFS250-FG256I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $47.85 | $47,85 |
| 10 | $43.2 | $432,00 |
| 100 | $38.4 | $3.840,00 |
| 500 | $35.65 | $17.825,00 |
| 1.000 | $33.1 | $33.100,00 |
M1AFS250-FG256I Descripción general
A field-programmable gate array (FPGA) is an integrated circuit whose logic fabric can be configured after manufacturing to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software processors in the digital system hierarchy: they provide hardware-level parallelism and deterministic timing while remaining reconfigurable in the field. The Fusion family extends the FPGA concept by adding configurable analog blocks, large flash memory blocks, and clock generation and management circuitry in a single monolithic device, making it a mixed-signal programmable system-on-chip.
Key features include a 130nm, 7-layer metal, flash-based CMOS process; 350 MHz system performance; 1.5V core supply; 36,864 bits of total RAM; and 114 user I/Os in a 256-LBGA package. The M1 designation indicates an ARM Cortex-M1 soft processor is available, enabling embedded software and FPGA logic to share one device. The flash-based architecture eliminates the need for external configuration memory and provides instant-on operation at power-up.
Technical depth is provided by the Fusion mixed-signal architecture, which integrates configurable analog front-end resources, large flash memory blocks, and comprehensive clock generation circuitry alongside the FPGA fabric. This allows designers to implement analog sensing, data conversion, digital signal processing, and system management functions without separate analog or configuration ICs. The device supports IEEE 1149.1 JTAG boundary scan for programming and test, simplifying board-level verification.
Typical applications include smart battery management systems, industrial motor control, medical patient monitoring, aerospace flight control, IoT edge gateways, and security surveillance cameras. The wide industrial temperature range and nonvolatile flash behavior make the M1AFS250-FG256I suitable for harsh environments where reliable power-up and low power consumption are critical.
When designing with this device, pay close attention to the 1.425V to 1.575V core supply. Use multiple decoupling capacitors placed close to the BGA balls and follow the manufacturer's power-up sequencing guidance. The 256-ball LBGA requires a multi-layer PCB with controlled impedance for high-speed I/O and adequate thermal vias for heat spreading.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers quickly evaluate the M1AFS250-FG256I for new designs or as a drop-in replacement in existing systems.
Alternativas directas para M1AFS250-FG256I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con M1AFS250-FG256I (mismo factor de forma y huella) — difiere en RoHS Status, System Gates, Package, Operating Temperature, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
M1AFS250-FGG256I
✅ Sustitución directa✓ En stock
$49.5 / unidad
Ver hoja de datos →M1AFS250-FG256
✅ Sustitución directa✓ En stock
$112 / unidad
Ver hoja de datos →M1AFS250-FGG256
✅ Sustitución directa✓ En stock
$88 / unidad
Ver hoja de datos →M1AFS250-1FG256I
✅ Sustitución directa✓ En stock
$96.5 / unidad
Ver hoja de datos →AFS250-FG256I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
M1AFS250-FG256I Valores máximos y características eléctricas
| Series | Fusion |
| Number of Gates | 250000 |
| Number of I/O | 114 |
| Total RAM Bits | 36864 |
| Tensión de alimentación | 1.425V ~ 1.575V |
| Temperatura de funcionamiento | -40C ~ +100C (TJ) |
| Encapsulado / Carcasa | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Product Status | Active |
| Manufacturer Lead Time | 16 weeks |
| Process Technology | 130nm, 7-layer metal, flash-based CMOS |
| System Performance | 350 MHz |
| Core | ARM Cortex-M1 |
| Estado RoHS | RoHS Non-Compliant |
| Lead Free Status | Contains Lead |
Guía de configuración de pines de M1AFS250-FG256I 256-fpbga (17x17)
Configuración de pines para M1AFS250-FG256I (encapsulado 256-fpbga (17x17)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para M1AFS250-FG256I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
M1AFS250-FG256I es adecuado para 6 aplicacións: Smart Battery Management System, Industrial Motor Control, Medical Patient Monitoring, Aerospace and Defense Flight Control, IoT Edge Gateway and Sensor Fusion, Security Surveillance Camera.
Smart Battery Management System
The M1AFS250-FG256I fits smart battery management systems (BMS) because its Fusion mixed-signal architecture integrates configurable analog blocks and flash memory alongside FPGA logic. Designers can monitor cell voltage and temperature through the analog front end while implementing state-of-charge algorithms in the ARM Cortex-M1 processor or FPGA fabric. The 1.425V to 1.575V core supply and wide industrial temperature range support automotive and industrial BMS modules. The nonvolatile flash configuration allows the BMS controller to start instantly at power-up, which is critical for safety interlocks. In a typical BMS, the M1AFS250-FG256I is coupled with precision voltage references, op-amp signal conditioning, and battery-protection front-end ICs.
Recomendado
Industrial Motor Control
For industrial motor control, the M1AFS250-FG256I provides 114 user I/Os and 250K system gates for implementing PWM generation, encoder decoding, and fault logic in hardware. The 350 MHz system performance supports fast current-loop and commutation algorithms. The device's flash-based architecture removes the need for an external configuration PROM, reducing component count and startup latency in factory automation equipment. The -40C to +100C operating range suits drives installed near motors and high-temperature enclosures. In a motor drive, the FPGA can interface to gate drivers and current-sense amplifiers, while the integrated flash memory stores calibration data and boot parameters. A higher-density alternative such as the A3P600-FG256I can be considered when more logic resources are required.
Recomendado
Medical Patient Monitoring
The M1AFS250-FG256I is suited to medical patient monitoring because its mixed-signal analog blocks can condition physiological signals before conversion, while the FPGA fabric implements digital filtering and protocol handling. The ARM Cortex-M1 core allows embedded software to run alongside deterministic hardware logic. The low-power flash process and wide temperature range enable reliable operation in portable monitors and bedside equipment. The 36,864 RAM bits are useful for buffering ECG, SpO2, or temperature waveforms. Typical designs pair the M1AFS250-FG256I with instrumentation amplifiers, low-offset op-amps, and precision references to amplify microvolt-level biosignals. The nonvolatile configuration is advantageous in safety-critical medical systems because the device is immediately functional when power is applied.
Recomendado
Aerospace and Defense Flight Control
The M1AFS250-FG256I supports aerospace and defense flight control applications with its flash-based, nonvolatile FPGA fabric and -40C to +100C temperature rating. Because the device retains its configuration when powered off and is live at power-up, it is well suited for safety-critical actuation and sensor-processing tasks. The 250K system gates and 114 I/Os are sufficient for implementing redundant control loops, telemetry formatting, and discrete I/O management. The 1.5V core with 1.425V to 1.575V range simplifies power tree design alongside other low-voltage avionics components. The device can interface with analog MEMS sensors, position encoders, and serial buses used in flight control systems. For radiation-tolerant or higher-density needs, designers can evaluate other Microchip FPGA families.
Recomendado
IoT Edge Gateway and Sensor Fusion
In IoT edge gateways, the M1AFS250-FG256I can aggregate multiple sensor inputs using its 114 I/Os and configurable analog blocks, then preprocess data in the FPGA fabric before forwarding to a host processor or network controller. The ARM Cortex-M1 option enables embedded data fusion and protocol handling on the same device. The 36,864 RAM bits buffer sensor frames, while the flash-based nature ensures instant boot without an external memory. The 1.5V core and low power consumption suit compact, always-on gateways. The integrated analog front end can directly interface with temperature, humidity, or current sensors, reducing discrete components. Designers can pair this FPGA with low-power radios or Ethernet controllers for reliable edge connectivity.
Recomendado
Security Surveillance Camera
The M1AFS250-FG256I is suitable for security surveillance cameras where image sensor control, pixel data formatting, and video preprocessing require parallel processing. The FPGA fabric can implement timing generation for CMOS image sensors, data alignment, and simple image filters before sending video streams to an application processor or encoder. The 250K gates provide ample resources for these functions, while 114 I/Os connect to parallel sensor interfaces and control signals. The device operates from a 1.5V core with a 1.425V to 1.575V range, fitting typical camera power trees. Its industrial temperature range supports outdoor and unenclosed camera installations. In a video system, the M1AFS250-FG256I can be paired with image sensor serdes ICs or voltage regulators that generate the low-noise analog supply.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para M1AFS250-FG256I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | M1AFS250-FGG256I | M1AFS250-FG256 | M1AFS250-FGG256 | M1AFS250-1FG256I | AFS250-FG256I |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA (17x17) | 256-LBGA (17x17) - same | 256-LBGA (17x17) - same | 256-LBGA (17x17) - same | 256-LBGA (17x17) - same | 256-LBGA (17x17) - same |
| Number of Gates | 250000 | 250000 | 250000 | 250000 | 250000 | 250000 |
| Total RAM Bits | 36864 | 36864 | 36864 | 36864 | 36864 | 36864 |
| Number of I/O | 114 | 114 | 114 | 114 | 114 | 114 |
| Supply Voltage | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V |
| Operating Temperature | -40C to +100C (TJ) | -40C to +100C (TJ) | 0C to +70C | 0C to +70C | -40C to +100C (TJ) | -40C to +100C (TJ) |
| ARM Cortex-M1 | Yes | Yes | Yes | Yes | Yes | No |
| RoHS Status | Non-compliant (contains lead) | Compliant (lead-free) | Non-compliant (contains lead) | Compliant (lead-free) | Non-compliant (contains lead) | Non-compliant (contains lead) |
Diferenciadores clave
- Contains lead, enabling tin-lead assembly for high-reliability applications (frente a M1AFS250-FGG256I)
- Industrial temperature range with ARM Cortex-M1 in one package (frente a M1AFS250-FG256)
- ARM Cortex-M1 plus mixed-signal integration in a single FPGA (frente a AFS250-FG256I)
Notas de diseño
The M1AFS250-FG256I requires a 1.425V to 1.575V core supply. Use a low-ripple DC-DC converter or LDO capable of the FPGA's transient current, and place at least one 100nF ceramic capacitor near each power ball plus a 10uF bulk capacitor per supply rail. Follow Microchip's recommended power-up sequencing for Fusion FPGAs; the flash-based device is live at power-up, so the supply must reach the recommended range cleanly to avoid undefined I/O states. Monitor inrush current and use a soft-start regulator if needed.
The 256-ball LBGA is rated for -40C to +100C junction temperature. For high-utilization designs, estimate power with Microchip's power estimator and provide a thermal path through the BGA package. Use a 4-layer or greater PCB with solid ground planes and thermal vias beneath the package to spread heat. The 17x17 mm body has no exposed pad, so thermal management depends on board copper and airflow. At maximum junction temperature, reduce system clock rate or logic utilization to stay within the thermal envelope.
Design a 4-layer minimum PCB for the 256-LBGA to provide controlled impedance for high-speed I/O and a low-inductance power distribution network. Place decoupling capacitors on the back side of the board directly under the BGA balls where possible. Route the JTAG programming pins with pull-up resistors per Microchip guidelines. Because the device is flash-based, no external configuration device is needed, which simplifies layout. Verify the BGA footprint against the latest package drawing and use Microchip's BSDL model for boundary-scan test development.
Información de cumplimiento
Verified data indicates RoHS non-compliant and contains lead. For RoHS-compliant assembly, use M1AFS250-FGG256I. AEC-Q100 not applicable for this FPGA family.