M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
MPN: M1AFS250-FG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $139 | $139.00 |
| 10 | $132.1 | $1,321.00 |
| 100 | $124.5 | $12,450.00 |
| 500 | $118.2 | $59,100.00 |
| 1,000 | $112 | $112,000.00 |
Drop-in alternatives for M1AFS250-FG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M1AFS250-FGG256
✅ Drop-In✓ In Stock
$88 / Unit
View Datasheet →M1AFS250-2FG256I
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Contact for price
View Datasheet →M1AFS250-2FGG256
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$83.12 / Unit
View Datasheet →M1AFS250-2FGG256I
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$83.12 / Unit
View Datasheet →M1AFS600-2FG256
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$46.75 / Unit
View Datasheet →M1AFS1500-1FGG256
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$172.23 / Unit
View Datasheet →M1AFS250-FG256 Maximum Ratings & Electrical Characteristics
| Manufacturer Part Number | M1AFS250-FG256 |
| Family | Fusion (M1 series, ARM Cortex-M1) |
| System Gates | 250000 |
| Logic Cells | 6144 |
| Embedded Processor | ARM Cortex-M1 |
| Maximum Clock Frequency | 350 MHz |
| Number of I/O | 114 |
| RAM Bits | 36864 |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (nonvolatile) |
| Operating Temperature Range | 0C to +70C |
| Package / Case | 256-FBGA (256-LBGA), 1.00 mm pitch |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| RoHS Status | RoHS Non-Compliant (contains lead) |
| Lead Free Status | Contains Lead |
| Series | M1AFS250 |
M1AFS250-FG256 256-fbga (256-lbga), 1.00 mm pitch Pin Configuration Guide
Complete pinout information for M1AFS250-FG256 (256-fbga (256-lbga), 1.00 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS250-FG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS250-FG256 is suitable for 6 applications: Smart Power and Motor Control, Industrial Automation and Control Panels, Portable and Battery-Powered Instrumentation, Embedded System-on-Chip Designs (Cortex-M1 + Logic), Test and Measurement Equipment, Legacy Long-Lifecycle System Maintenance.
Smart Power and Motor Control
The M1AFS250-FG256 fits smart power and motor-control designs because its monolithic Fusion die combines configurable analog monitoring with flash-based logic and an ARM Cortex-M1 processor running at up to 350 MHz. PWM generation, dead-time insertion, and closed-loop control algorithms execute in fabric and processor without a discrete MCU, while the analog block supervises bus voltage and phase current without external ADCs. With 114 user I/O, gate-driver and encoder interfaces connect directly. Placing supervisory sampling in the FPGA fabric removes ADC latency from the control loop, enabling faster fault shutdown than MCU-only designs. Designers should budget core power at 1.5V based on fabric utilization and clock rate, and should note the FG256 is leaded, so industrial RoHS-exempt status must be confirmed or the FGG256 drop-in selected.
Recommended
Industrial Automation and Control Panels
In industrial automation, the M1AFS250-FG256 consolidates sequencing logic, sensor aggregation, and supervisory control in one 256-FBGA device. The flash-based fabric configures instantly at power-up without an external boot PROM, reducing board components and improving field reliability, while the Cortex-M1 handles protocol handling such as MODBUS-style polling or custom state machines. The commercial 0C to +70C range suits cabinet-mounted controllers; for floor-level hardware select the industrial-temperature M1AFS250-2FG256I on the same footprint. The nonvolatile flash fabric also resists configuration corruption in noisy EMC environments typical of factory floors, an advantage over SRAM FPGAs. Designers should implement the 1.5V core rail with proper sequencing per the Microchip Fusion datasheet and reserve I/O banks for isolated field interfaces.
Recommended
Portable and Battery-Powered Instrumentation
The M1AFS250-FG256 suits portable instrumentation where single-chip integration minimizes size and quiescent power. The 130 nm flash process draws essentially zero static configuration power compared to SRAM FPGAs, and the 1.5V core supply supports efficient DC-DC generation from Li-ion inputs. The integrated configurable analog replaces discrete amplifiers and ADCs for slow-speed measurement channels, while the Cortex-M1 at up to 350 MHz performs scaling, calibration, and display updates. Nonvolatile instant-on configuration lets the instrument be ready in milliseconds after wake, important for triggered measurements. Because the commercial temperature part tops out at +70C, handheld enclosures with heat concentration should be thermally evaluated. Estimate: core dissipation scales with clock frequency and utilization, so keep unused fabric idle to extend battery life.
Recommended
Embedded System-on-Chip Designs (Cortex-M1 + Logic)
For embedded designs needing both a processor and custom logic, the M1AFS250-FG256 eliminates the discrete MCU plus FPGA pairing. The ARM Cortex-M1 soft core runs at up to 350 MHz on the same die as 6,144 logic cells and 36,864 RAM bits, communicating with fabric through on-chip interfaces with far lower latency than an external bus. Software development uses standard ARM toolchains while hardware is built in Microchip Libero SoC, allowing concurrent firmware and RTL work. The monolithic approach also removes board-level trace timing risk between MCU and FPGA and cuts BOM count. Memory-constrained designs should verify the 36,864 bits of block RAM suffices for buffering; otherwise select the pin-compatible M1AFS1500-FG256, which multiplies memory and logic resources on the identical PCB land pattern.
Recommended
Test and Measurement Equipment
Bench and embedded test instruments benefit from the M1AFS250-FG256's instant-on flash configuration and mixed-signal integration. The FPGA fabric implements trigger logic, timing generators, and interface bridges (UART, SPI, parallel buses) with deterministic timing, while the Cortex-M1 manages command parsing and housekeeping. The configurable analog block provides monitoring channels for supply and signal supervision. In lab instruments, the 0C to +70C commercial range is typically adequate. Integration of clock generation and management circuitry on-chip simplifies jitter budgeting for measurement timing chains compared to multi-chip clock trees. Designers should place high-speed I/O banks near board edge connectors in the FG256 footprint to minimize stub lengths, and decouple the 1.5V core with low-ESR ceramics per the Microchip power design guidance.
Recommended
Legacy Long-Lifecycle System Maintenance
For maintaining legacy systems originally built around Actel Fusion silicon, the M1AFS250-FG256 provides continuity since Microchip (formerly Microsemi) continues the product line with unchanged silicon and Libero design support. The nonvolatile flash configuration means original bitstreams load identically on new silicon, avoiding SRAM-FPGA boot issues in fielded hardware. When regulatory requirements tighten, M1AFS250-FGG256 is the pin-compatible lead-free drop-in, and when capacity must grow, M1AFS600 and M1AFS1500 in FG256 packages reuse the same PCB footprint per the manufacturer product brief, which states Fusion devices in the same package are pin compatible (except PQ208). Procurement teams should validate speed grade and temperature suffix against the original BOM before substitution.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS250-FG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS250-FGG256 | M1AFS250-2FG256I | M1AFS600-2FG256 | M1AFS1500-1FGG256 |
|---|---|---|---|---|---|
| Package | 256-FBGA (1.00 mm pitch) | 256-FBGA - same footprint | 256-FBGA - same footprint | 256-FBGA - same footprint | 256-FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 600,000 | 1,500,000 |
| Logic Cells | 6,144 | 6,144 | 6,144 | [DATA_NEEDED] | [DATA_NEEDED] |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
| Operating Temperature | 0C to +70C | [DATA_NEEDED] | -40C to +85C (industrial) | [DATA_NEEDED] | [DATA_NEEDED] |
| RoHS / Lead Status | Non-compliant (contains lead) | Compliant (Green, lead-free) | [DATA_NEEDED] | [DATA_NEEDED] | Compliant (Green package suffix) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- RoHS-compliant drop-in available on identical footprint (vs M1AFS250-FGG256)
- Lowest cost and power in the pin-compatible FG256 family (vs M1AFS600-2FG256)
- Commercial-only temperature range (vs M1AFS250-2FG256I)
Design Notes
Supply the M1AFS250-FG256 core with a regulated 1.5V rail; I/O and analog banks use additional rails per the Microchip Fusion datasheet power architecture. Follow the datasheet power-up sequencing order strictly - incorrect rail sequencing can latch the I/O or misconfigure the analog block. Decouple each supply pin pair with low-ESR ceramic capacitors placed close to the 256-FBGA balls, and use a solid ground return through the BGA via field. Estimated: core dissipation scales with clock frequency and fabric utilization - budget using Libero SoC power analysis, not rule-of-thumb numbers.
The FG256 is a 1.00 mm pitch 256-ball BGA, requiring controlled-impedance multilayer PCB with via-in-pad or dog-bone fanout. Keep breakout length short and uniform to preserve signal integrity on the 114 user I/O. Reserve continuous copper under the package for the analog ground quadrant - the Fusion analog block shares the die and is sensitive to digital return currents. Do not route fast switching signals across the analog quadrant's escape fanout. Reference the Microchip Fusion board layout guidelines before finalizing the land pattern, especially if planning future migration to M1AFS600/M1AFS1500 FG256 devices.
The most frequent procurement pitfall: the FG256 ordering code is RoHS non-compliant and contains lead, restricting new EU/REACH-bound designs - specify M1AFS250-FGG256 (identical footprint) unless the application is RoHS-exempt. Second pitfall: temperature suffix. FG256 alone is 0C to +70C commercial; field-deployed hardware needs the -I industrial variants such as M1AFS250-2FG256I. Third, when migrating to M1AFS600/1500 FG256 parts, remember pin-compatibility does not guarantee identical per-pin analog configuration - re-verify analog assignments in Libero SoC before respin-free migration.
Compliance Information
Per digichip.com datasheet data: Lead Free Status - Contains Lead; RoHS Status - RoHS Non-Compliant. The M1AFS250-FGG256 variant is the Green, lead-free alternative. REACH and conflict-minerals status not stated in provided data.
