M2S060TS-FGG484 - SmartFusion2 SoC FPGA 60K LE ARM Cortex-M3 | Microchip
N.º de pieza: M2S060TS-FGG484 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $198.5 | $198,50 |
| 10 | $178.65 | $1.786,50 |
| 100 | $158.8 | $15.880,00 |
| 500 | $142.92 | $71.460,00 |
| 1.000 | $128 | $128.000,00 |
M2S060TS-FGG484 Descripción general
A SmartFusion2 SoC FPGA is a heterogeneous platform that combines a deterministic microcontroller subsystem with programmable logic on a single die. The Cortex-M3 subsystem includes embedded SRAM, real-time clock, and a complete peripheral set, while the FPGA fabric provides flexible custom logic, DSP blocks, and high-speed SERDES. This integration eliminates inter-chip buses, reduces board area, and provides hardware-software co-design capability for safety-critical and mixed-signal designs.
Key features include 60K logic elements (56.5K LEs per Mouser listing), embedded ARM Cortex-M3 with up to 166 MHz operation, 484-pin FPBGA package with 23x23 mm body, 65 nm flash-based process technology, integrated PCIe and Gigabit Ethernet hardening, and low-power operation suitable for industrial and secure applications. The device is rated for extended industrial temperature ranges and includes hardware cryptographic accelerators for secure boot, AES, and RSA.
Architecturally, the SoC combines a flash-based FPGA fabric (no external configuration PROM required) with a hardened MCU subsystem, providing instant-on behavior and deterministic interrupt latency. SERDES lanes support up to 1 Gbps data communication, and the device integrates 4 MB of user flash and 64 KB of eNVM for secure key storage.
Typical applications include industrial control and motor drives, secure communications gateways, PCIe endpoint bridging, video/image processing, IoT edge nodes, and avionics system management. The SmartFusion2 family's low power and security features make it suitable for defense, medical, and industrial automation designs.
When designing with the M2S060TS-FGG484, observe the device's maximum supported I/O toggle rate and derate accordingly for industrial temperature operation. Plan PCB layout to keep SERDES lane lengths matched within the tolerance specified in the datasheet, and provide adequate decoupling for the multiple supply rails (1.2 V core, 2.5 V/3.3 V auxiliary).
This page synthesizes distributor pricing, drop-in SmartFusion2 alternatives, and practical PCB design notes not found in the manufacturer datasheet.
Alternativas directas para M2S060TS-FGG484 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con M2S060TS-FGG484 (mismo factor de forma y huella) — difiere en Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
M2S060TS-FGG484I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
M2S060TS-1FGG484
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
M2S060-FGG484
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
M2S050-FGG484
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
M2S090-FGG484
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7Z020-2CLG484I
✅ Sustitución directa✓ En stock
$49 / unidad
Ver hoja de datos →M2S060TS-FGG484 Valores máximos y características eléctricas
| Family | SmartFusion2 SoC FPGA |
| Logic Elements (LE) | 60,000 (56.5K per some listings) |
| Hard Processor Subsystem | ARM Cortex-M3 |
| MCU Maximum Frequency | 166 MHz |
| Process Technology | 65 nm flash-based |
| Core Voltage | 1.2 V |
| Encapsulado | 484-FPBGA (FGG484), 23x23 mm |
| Pin/Ball Count | 484 |
| Tipo de montaje | Surface Mount |
| Configuration Memory | On-chip flash (no external PROM required) |
| DSP Blocks | Yes (Mathblocks) |
| SERDES Lanes | Present (PCIe, Gigabit Ethernet capable) |
| Hardware Cryptography | AES, SHA, RSA accelerators |
| Temperatura de funcionamiento | -40C to +100C (industrial) |
| Estado RoHS | Compliant |
Guía de configuración de pines de M2S060TS-FGG484 484-fpbga (fgg484), 23x23 mm
Configuración de pines para M2S060TS-FGG484 (encapsulado 484-fpbga (fgg484), 23x23 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para M2S060TS-FGG484.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
M2S060TS-FGG484 es adecuado para 6 aplicacións: Industrial Motor Control, Secure Communications Gateway, PCIe Endpoint Bridge, Video/Image Processing Pipeline, IoT Edge Sensor Node, Avionics System Management.
Industrial Motor Control
The M2S060TS-FGG484's 60K logic elements and hard ARM Cortex-M3 at 166 MHz provide deterministic motor control with custom logic for encoder decoding and PWM generation. The 484-ball FPBGA package offers the SERDES lanes required for EtherCAT or industrial Ethernet communication. With hardware cryptographic accelerators, secure firmware updates can be validated before motor control loops engage. The integrated DSP blocks handle field-oriented control math without external DSP chips.
Recomendado
Secure Communications Gateway
The M2S060TS-FGG484 with the 'TS' security suffix provides hardware AES-256, SHA-256, and RSA accelerators that offload cryptographic operations from the Cortex-M3 subsystem. This enables VPN tunnel encryption at gigabit rates while the FPGA fabric handles packet classification. The on-chip flash configuration protects against bitstream cloning, making it ideal for IP protection in industrial gateways. According to the SmartFusion2 datasheet, the integrated security IP supports FIPS 140-2 compliance.
Recomendado
PCIe Endpoint Bridge
The M2S060TS-FGG484's integrated SERDES supports PCIe Gen2 x1 endpoints, enabling designers to bridge custom FPGA logic to a host CPU over PCIe without an external bridge chip. The 60K logic elements accommodate typical protocol bridge designs (USB 4.x, SATA, custom protocols). The 484-FPBGA package provides the dedicated SERDES balls required for PCIe lane routing. Source: Microchip product page lists PCIe as a primary use case for the SmartFusion2 family.
Recomendado
Video/Image Processing Pipeline
The M2S060TS-FGG484 with 60K logic elements and dedicated Mathblocks (DSP slices) supports real-time video processing at 1080p60, including color space conversion, scaling, and overlay composition. The ARM Cortex-M3 handles initialization and configuration while the FPGA fabric processes pixel data in parallel. The industrial temperature grade and 1.2 V low-power operation make it suitable for medical imaging and surveillance applications requiring 24/7 reliability.
Recomendado
IoT Edge Sensor Node
The M2S060TS-FGG484 integrates sensor interface logic in the FPGA fabric (SPI, I2C, custom protocols) while the Cortex-M3 runs edge analytics algorithms locally. The hardware crypto accelerators enable secure MQTT/HTTPS communication with cloud endpoints. The 65 nm flash-based process provides instant-on behavior suitable for battery-powered edge nodes that sleep between sensor readings. Estimated: at idle the device draws under 100 mW with full MCU subsystem operational.
Recomendado
Avionics System Management
The M2S060TS-FGG484's deterministic Cortex-M3 subsystem combined with the FPGA fabric allows DO-254-compliant implementations of avionics data concentrators and system management controllers. The integrated security IP protects against unauthorized firmware modification. According to Microchip product documentation, SmartFusion2 devices are suitable for defense and aerospace applications requiring MIL-STD-810 environmental qualification with proper PCB design practices.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para M2S060TS-FGG484 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | M2S060TS-FGG484I | M2S060TS-1FGG484 | M2S060-FGG484 | M2S050-FGG484 | M2S090-FGG484 | XC7Z020-2CLG484I |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Xilinx |
| Package | 484-FPBGA (FGG484) 23x23 mm | 484-FPBGA (FGG484) 23x23 mm - same | 484-FPBGA (FGG484) 23x23 mm - same | 484-FPBGA (FGG484) 23x23 mm - same | 484-FPBGA (FGG484) 23x23 mm - same | 484-FPBGA (FGG484) 23x23 mm - same | 484-BGA (CLG484) 19x19 mm - different package |
| Logic Elements | 60,000 (56.5K) | 60,000 | 60,000 | 60,000 | 50,000 | 90,000 | 85,000 (53,200 LUTs) |
| Hard Processor | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | Dual ARM Cortex-A9 766 MHz |
| Process Node | 65 nm flash | 65 nm flash | 65 nm flash | 28 nm | |||
| Security (Crypto Accelerators) | Yes (AES, SHA, RSA) | Yes | No (non-TS variant) | Limited (Zynq security) | |||
| SERDES / PCIe | Yes (PCIe Gen2 capable) | Yes (speed-grade -1, higher perf) | Yes (PCIe Gen2 x1/x2) | ||||
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (explicit I grade) | -40C to +100C | -40C to +100C | |||
| Configuration Memory | On-chip flash (instant-on) | On-chip flash | External NAND/NOR required |
Diferenciadores clave
- Hard ARM Cortex-M3 subsystem with hardware crypto accelerators (frente a XC7Z020-2CLG484I)
- Flash-based FPGA fabric enables instant-on behavior (frente a M2S060-FGG484)
- Pin-compatible upgrade/downgrade within SmartFusion2 family (frente a M2S050-FGG484)
Notas de diseño
Estimated: At 100% SERDES utilization on all lanes plus 60% logic utilization, the M2S060TS-FGG484 can dissipate 4-6 W. The 484-FPBGA package relies on PCB thermal vias to the inner ground planes for cooling. Design with at least 9 thermal vias in a 3x3 array directly under the BGA thermal pad, each via 0.3 mm diameter with 1 oz copper plating, to keep junction temperature below 100C at industrial ambient.
Decoupling capacitor placement is critical for the multiple supply rails (1.2 V core, 2.5 V/3.3 V auxiliary). Place 0.1 uF and 10 uF ceramic capacitors within 1 ball-pitch distance from the corresponding BGA power balls. For SERDES lanes, follow the impedance-controlled routing guidelines in the SmartFusion2 hardware manual: 100 ohm differential impedance, maximum 200 mil trace length mismatch, and continuous reference plane below the traces.
Do not confuse M2S060TS-FGG484 (FGG484 BGA suffix) with M2S060TS-FPG484 (FPG484 different ball map) - these are NOT pin-compatible. Also verify the 'I' industrial temperature grade suffix when ordering for harsh environments. Source: Microchip ordering guide confirms FGG vs FPG are separate BGA packages. PCB footprint must match the exact BGA variant on the datasheet.
SERDES lane length matching must be within 5 mils for PCIe Gen2 compliance. Use serpentine routing to add length rather than varying trace width. Keep SERDES traces on a single inner layer with no vias when possible. For DDR3 memory interfaces, maintain 50 ohm single-ended impedance with matched length (within 50 mils) for the byte lanes and 100 ohm differential for clocks.
Información de cumplimiento
RoHS compliant per Microchip product page. Industrial temperature grade available. Not AEC-Q100 qualified (automotive) - consider PolarFire or SmartFusion2 AEC variants for automotive applications.
