M2S060TS-FGG484 - SmartFusion2 SoC FPGA 60K LE ARM Cortex-M3 | Microchip
부품 번호: M2S060TS-FGG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $198.5 | $198.50 |
| 10 | $178.65 | $1,786.50 |
| 100 | $158.8 | $15,880.00 |
| 500 | $142.92 | $71,460.00 |
| 1,000 | $128 | $128,000.00 |
M2S060TS-FGG484 개요
A SmartFusion2 SoC FPGA is a heterogeneous platform that combines a deterministic microcontroller subsystem with programmable logic on a single die. The Cortex-M3 subsystem includes embedded SRAM, real-time clock, and a complete peripheral set, while the FPGA fabric provides flexible custom logic, DSP blocks, and high-speed SERDES. This integration eliminates inter-chip buses, reduces board area, and provides hardware-software co-design capability for safety-critical and mixed-signal designs.
Key features include 60K logic elements (56.5K LEs per Mouser listing), embedded ARM Cortex-M3 with up to 166 MHz operation, 484-pin FPBGA package with 23x23 mm body, 65 nm flash-based process technology, integrated PCIe and Gigabit Ethernet hardening, and low-power operation suitable for industrial and secure applications. The device is rated for extended industrial temperature ranges and includes hardware cryptographic accelerators for secure boot, AES, and RSA.
Architecturally, the SoC combines a flash-based FPGA fabric (no external configuration PROM required) with a hardened MCU subsystem, providing instant-on behavior and deterministic interrupt latency. SERDES lanes support up to 1 Gbps data communication, and the device integrates 4 MB of user flash and 64 KB of eNVM for secure key storage.
Typical applications include industrial control and motor drives, secure communications gateways, PCIe endpoint bridging, video/image processing, IoT edge nodes, and avionics system management. The SmartFusion2 family's low power and security features make it suitable for defense, medical, and industrial automation designs.
When designing with the M2S060TS-FGG484, observe the device's maximum supported I/O toggle rate and derate accordingly for industrial temperature operation. Plan PCB layout to keep SERDES lane lengths matched within the tolerance specified in the datasheet, and provide adequate decoupling for the multiple supply rails (1.2 V core, 2.5 V/3.3 V auxiliary).
This page synthesizes distributor pricing, drop-in SmartFusion2 alternatives, and practical PCB design notes not found in the manufacturer datasheet.
드롭인 대체품: M2S060TS-FGG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M2S060TS-FGG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M2S060TS-FGG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2S060TS-1FGG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2S060-FGG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2S050-FGG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M2S090-FGG484
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7Z020-2CLG484I
✅ 드롭인✓ 재고 있음
$49 / 개
데이터시트 보기 →M2S060TS-FGG484 최대 정격 & 전기적 특성
| Family | SmartFusion2 SoC FPGA |
| Logic Elements (LE) | 60,000 (56.5K per some listings) |
| Hard Processor Subsystem | ARM Cortex-M3 |
| MCU Maximum Frequency | 166 MHz |
| Process Technology | 65 nm flash-based |
| Core Voltage | 1.2 V |
| 패키지 | 484-FPBGA (FGG484), 23x23 mm |
| Pin/Ball Count | 484 |
| 실장 유형 | Surface Mount |
| Configuration Memory | On-chip flash (no external PROM required) |
| DSP Blocks | Yes (Mathblocks) |
| SERDES Lanes | Present (PCIe, Gigabit Ethernet capable) |
| Hardware Cryptography | AES, SHA, RSA accelerators |
| 동작 온도 | -40C to +100C (industrial) |
| RoHS 상태 | Compliant |
M2S060TS-FGG484 484-fpbga (fgg484), 23x23 mm 핀 구성 가이드
M2S060TS-FGG484(484-fpbga (fgg484), 23x23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M2S060TS-FGG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M2S060TS-FGG484 적합 용도: 6 애플리케이션s: Industrial Motor Control, Secure Communications Gateway, PCIe Endpoint Bridge, Video/Image Processing Pipeline, IoT Edge Sensor Node, Avionics System Management.
Industrial Motor Control
The M2S060TS-FGG484's 60K logic elements and hard ARM Cortex-M3 at 166 MHz provide deterministic motor control with custom logic for encoder decoding and PWM generation. The 484-ball FPBGA package offers the SERDES lanes required for EtherCAT or industrial Ethernet communication. With hardware cryptographic accelerators, secure firmware updates can be validated before motor control loops engage. The integrated DSP blocks handle field-oriented control math without external DSP chips.
추천
Secure Communications Gateway
The M2S060TS-FGG484 with the 'TS' security suffix provides hardware AES-256, SHA-256, and RSA accelerators that offload cryptographic operations from the Cortex-M3 subsystem. This enables VPN tunnel encryption at gigabit rates while the FPGA fabric handles packet classification. The on-chip flash configuration protects against bitstream cloning, making it ideal for IP protection in industrial gateways. According to the SmartFusion2 datasheet, the integrated security IP supports FIPS 140-2 compliance.
추천
PCIe Endpoint Bridge
The M2S060TS-FGG484's integrated SERDES supports PCIe Gen2 x1 endpoints, enabling designers to bridge custom FPGA logic to a host CPU over PCIe without an external bridge chip. The 60K logic elements accommodate typical protocol bridge designs (USB 4.x, SATA, custom protocols). The 484-FPBGA package provides the dedicated SERDES balls required for PCIe lane routing. Source: Microchip product page lists PCIe as a primary use case for the SmartFusion2 family.
추천
Video/Image Processing Pipeline
The M2S060TS-FGG484 with 60K logic elements and dedicated Mathblocks (DSP slices) supports real-time video processing at 1080p60, including color space conversion, scaling, and overlay composition. The ARM Cortex-M3 handles initialization and configuration while the FPGA fabric processes pixel data in parallel. The industrial temperature grade and 1.2 V low-power operation make it suitable for medical imaging and surveillance applications requiring 24/7 reliability.
추천
IoT Edge Sensor Node
The M2S060TS-FGG484 integrates sensor interface logic in the FPGA fabric (SPI, I2C, custom protocols) while the Cortex-M3 runs edge analytics algorithms locally. The hardware crypto accelerators enable secure MQTT/HTTPS communication with cloud endpoints. The 65 nm flash-based process provides instant-on behavior suitable for battery-powered edge nodes that sleep between sensor readings. Estimated: at idle the device draws under 100 mW with full MCU subsystem operational.
추천
Avionics System Management
The M2S060TS-FGG484's deterministic Cortex-M3 subsystem combined with the FPGA fabric allows DO-254-compliant implementations of avionics data concentrators and system management controllers. The integrated security IP protects against unauthorized firmware modification. According to Microchip product documentation, SmartFusion2 devices are suitable for defense and aerospace applications requiring MIL-STD-810 environmental qualification with proper PCB design practices.
추천
추천 제품 요약
엔지니어링 참조 데이터: M2S060TS-FGG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M2S060TS-FGG484I | M2S060TS-1FGG484 | M2S060-FGG484 | M2S050-FGG484 | M2S090-FGG484 | XC7Z020-2CLG484I |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Xilinx |
| Package | 484-FPBGA (FGG484) 23x23 mm | 484-FPBGA (FGG484) 23x23 mm - same | 484-FPBGA (FGG484) 23x23 mm - same | 484-FPBGA (FGG484) 23x23 mm - same | 484-FPBGA (FGG484) 23x23 mm - same | 484-FPBGA (FGG484) 23x23 mm - same | 484-BGA (CLG484) 19x19 mm - different package |
| Logic Elements | 60,000 (56.5K) | 60,000 | 60,000 | 60,000 | 50,000 | 90,000 | 85,000 (53,200 LUTs) |
| Hard Processor | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | ARM Cortex-M3 166 MHz | Dual ARM Cortex-A9 766 MHz |
| Process Node | 65 nm flash | 65 nm flash | 65 nm flash | 28 nm | |||
| Security (Crypto Accelerators) | Yes (AES, SHA, RSA) | Yes | No (non-TS variant) | Limited (Zynq security) | |||
| SERDES / PCIe | Yes (PCIe Gen2 capable) | Yes (speed-grade -1, higher perf) | Yes (PCIe Gen2 x1/x2) | ||||
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (explicit I grade) | -40C to +100C | -40C to +100C | |||
| Configuration Memory | On-chip flash (instant-on) | On-chip flash | External NAND/NOR required |
주요 차별점
- Hard ARM Cortex-M3 subsystem with hardware crypto accelerators (vs XC7Z020-2CLG484I)
- Flash-based FPGA fabric enables instant-on behavior (vs M2S060-FGG484)
- Pin-compatible upgrade/downgrade within SmartFusion2 family (vs M2S050-FGG484)
설계 노트
Estimated: At 100% SERDES utilization on all lanes plus 60% logic utilization, the M2S060TS-FGG484 can dissipate 4-6 W. The 484-FPBGA package relies on PCB thermal vias to the inner ground planes for cooling. Design with at least 9 thermal vias in a 3x3 array directly under the BGA thermal pad, each via 0.3 mm diameter with 1 oz copper plating, to keep junction temperature below 100C at industrial ambient.
Decoupling capacitor placement is critical for the multiple supply rails (1.2 V core, 2.5 V/3.3 V auxiliary). Place 0.1 uF and 10 uF ceramic capacitors within 1 ball-pitch distance from the corresponding BGA power balls. For SERDES lanes, follow the impedance-controlled routing guidelines in the SmartFusion2 hardware manual: 100 ohm differential impedance, maximum 200 mil trace length mismatch, and continuous reference plane below the traces.
Do not confuse M2S060TS-FGG484 (FGG484 BGA suffix) with M2S060TS-FPG484 (FPG484 different ball map) - these are NOT pin-compatible. Also verify the 'I' industrial temperature grade suffix when ordering for harsh environments. Source: Microchip ordering guide confirms FGG vs FPG are separate BGA packages. PCB footprint must match the exact BGA variant on the datasheet.
SERDES lane length matching must be within 5 mils for PCIe Gen2 compliance. Use serpentine routing to add length rather than varying trace width. Keep SERDES traces on a single inner layer with no vias when possible. For DDR3 memory interfaces, maintain 50 ohm single-ended impedance with matched length (within 50 mils) for the byte lanes and 100 ohm differential for clocks.
규정 준수 정보
RoHS compliant per Microchip product page. Industrial temperature grade available. Not AEC-Q100 qualified (automotive) - consider PolarFire or SmartFusion2 AEC variants for automotive applications.
