M7AFS600-2FGG484 - Fusion FPGA 600K Gates | Microchip Technology
MPN: M7AFS600-2FGG484 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $293.67 | $293.67 |
| 10 | $275 | $2,750.00 |
| 100 | $250 | $25,000.00 |
| 500 | $230 | $115,000.00 |
| 1,000 | $210 | $210,000.00 |
Drop-in alternatives for M7AFS600-2FGG484 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
M7AFS600-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
M7AFS600-1FGG484
β Drop-Inπ Reference alternative (not in catalog)
M7AFS600-FGG484I
β Drop-Inπ Reference alternative (not in catalog)
M7AFS600-1FGG484I
β Drop-Inπ Reference alternative (not in catalog)
M1AFS600-1FGG484
β Drop-Inβ In Stock
$59.5 / Unit
View Datasheet βM7AFS600-2FGG484 Maximum Ratings & Electrical Characteristics
| Family | Fusion |
| System Gates | 600K |
| Number of I/Os | 172 |
| Number of Logic Elements | 110592 |
| Core Voltage | 1.5V |
| Maximum Operating Frequency | 1470.59 MHz |
| Process Technology | 130nm |
| Package | 484-BGA (FBGA) |
| Package Pitch | 1mm |
| Mounting Type | Surface Mount |
| Operating Temperature Range | 0Β°C to +85Β°C |
| Flash Memory | 110,592 bits |
| Embedded Analog | Yes (ADC, DAC, comparators) |
| RoHS Status | Compliant |
| Supply Voltage | 1.5V |
M7AFS600-2FGG484 1mm Pin Configuration Guide
Complete pinout information for M7AFS600-2FGG484 (1mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-2FGG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-2FGG484 is suitable for 6 applications: Motor Control, Power Management, Industrial Automation, Medical Devices, Aerospace and Defense, Communication Systems.
Motor Control
The M7AFS600-2FGG484 integrates programmable analog blocks (ADCs, DACs, comparators) and flash memory, making it ideal for motor control applications. The 172 I/Os can interface with position sensors, current sensors, and gate drivers. The 1.5V core and 130nm process provide low power consumption, while the 600K gates allow implementation of complex control algorithms like FOC (Field-Oriented Control). The embedded flash memory stores calibration data and firmware, enabling field updates. The device's analog front-end can directly condition sensor signals, reducing external components. With a maximum frequency of 1470.59 MHz, it can handle high-speed PWM generation and real-time control loops. The 484-FBGA package offers ample I/O for multi-axis control systems. Designers can leverage the CoreMP7 ARM processor for communication and supervisory tasks, while the FPGA fabric handles time-critical control logic. This integration reduces BOM cost and board space compared to discrete solutions.
Recommended
Power Management
The M7AFS600-2FGG484 is well-suited for power management systems due to its integrated analog blocks and flash memory. The programmable analog can monitor voltage and current, while the FPGA fabric implements digital control loops for DC-DC converters. The 1.5V core voltage and low power consumption make it suitable for battery-powered applications. The 600K gates provide ample resources for implementing power sequencing, fault detection, and communication protocols like PMBus. The embedded flash memory stores configuration and calibration data, ensuring reliable operation. The 172 I/Os can interface with power stage drivers, ADCs, and digital potentiometers. The device's high-speed capability (1470.59 MHz) enables fast transient response. The 484-FBGA package allows for compact designs. Designers can use the CoreMP7 processor for system management and the FPGA for real-time control. This integration simplifies the design and reduces component count, improving reliability and reducing cost.
Recommended
Industrial Automation
In industrial automation, the M7AFS600-2FGG484 provides a flexible platform for implementing PLCs, motor drives, and sensor interfaces. The 172 I/Os support various industrial protocols like EtherCAT, PROFINET, and Modbus. The integrated analog blocks can condition signals from temperature, pressure, and flow sensors. The 600K gates allow implementation of complex logic and state machines. The flash memory enables non-volatile storage of configuration and logs. The 1.5V core and 130nm process ensure low power dissipation, important for enclosed industrial cabinets. The device's high-speed capability (1470.59 MHz) supports fast data processing. The 484-FBGA package provides enough I/O for multiple communication interfaces. The CoreMP7 processor can handle protocol stacks, while the FPGA handles real-time I/O. This reduces the need for external microcontrollers and ASICs, simplifying the BOM and improving reliability.
Recommended
Medical Devices
The M7AFS600-2FGG484 is suitable for medical devices such as patient monitors, infusion pumps, and diagnostic equipment. Its integrated analog blocks can interface with biosensors, while the FPGA fabric implements signal processing algorithms. The 600K gates provide ample resources for digital filtering and data acquisition. The flash memory stores patient data and calibration parameters. The 1.5V core and low power consumption are critical for battery-operated devices. The 172 I/Os support various display and communication interfaces. The device's high-speed capability (1470.59 MHz) enables real-time processing of physiological signals. The 484-FBGA package allows for compact designs. The CoreMP7 processor can manage user interfaces and communication, while the FPGA handles real-time signal processing. This integration reduces component count and power consumption, improving device reliability and patient safety.
Recommended
Aerospace and Defense
The M7AFS600-2FGG484 is used in aerospace and defense applications such as avionics, radar, and communication systems. Its 600K gates and 172 I/Os support complex digital signal processing and interface requirements. The integrated flash memory provides secure, non-volatile storage for configuration and mission data. The 1.5V core and 130nm process offer a balance of performance and power. The device's high-speed capability (1470.59 MHz) is suitable for high-bandwidth data processing. The 484-FBGA package is rugged and suitable for harsh environments. The CoreMP7 processor can handle control and communication tasks, while the FPGA implements custom logic. The programmable analog blocks can interface with sensors and actuators. This integration reduces system weight and power, critical for aerospace platforms. Designers must consider radiation effects and may need to implement mitigation techniques.
Recommended
Communication Systems
The M7AFS600-2FGG484 is ideal for communication systems such as base stations, routers, and software-defined radios. The 172 I/Os support high-speed serial interfaces like LVDS and SERDES. The 600K gates allow implementation of protocol processing, error correction, and packet handling. The integrated flash memory stores firmware and configuration. The 1.5V core and 130nm process provide low power consumption, important for dense communication equipment. The device's high-speed capability (1470.59 MHz) enables high-throughput data processing. The 484-FBGA package offers enough I/O for multiple channels. The CoreMP7 processor can handle network protocols, while the FPGA implements PHY and MAC layers. The programmable analog blocks can interface with RF front-ends. This integration reduces component count and power, improving system efficiency and reducing cost.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-2FGG484 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-2FGG484I | M7AFS600-1FGG484 | M7AFS600-FGG484I | M7AFS600-1FGG484I | M1AFS600-1FGG484 |
|---|---|---|---|---|---|---|
| Package | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) | 484-BGA (FBGA) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| Number of I/Os | 172 | 172 | 172 | 172 | 172 | 172 |
| Maximum Operating Frequency | 1470.59 MHz | 1470.59 MHz | 1.28205 GHz | 1.0989 GHz | 1.28205 GHz | [DATA_NEEDED] |
| Operating Temperature Range | 0Β°C to +85Β°C | -40Β°C to +100Β°C | 0Β°C to +85Β°C | -40Β°C to +100Β°C | -40Β°C to +100Β°C | [DATA_NEEDED] |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| Flash Memory | 110,592 bits | 110,592 bits | 110,592 bits | 110,592 bits | 110,592 bits | [DATA_NEEDED] |
Key Differentiators
- Integrated analog blocks (vs M1AFS600-1FGG484)
- Higher speed grade (vs M7AFS600-1FGG484)
- Commercial temperature range (vs M7AFS600-2FGG484I)
Design Notes
The M7AFS600-2FGG484 requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple. Decouple each power pin with a 0.1uF ceramic capacitor and a 10uF bulk capacitor. Ensure the power supply can handle the peak current during configuration. Refer to the datasheet for power consumption estimates.
For the 484-FBGA package, use a multi-layer PCB with dedicated power and ground planes. Place vias close to the BGA pads to minimize inductance. Follow the manufacturer's layout guidelines for the analog blocks to reduce noise. Use proper decoupling and consider a ground plane under the analog section.
The M7AFS600-2FGG484 dissipates heat based on logic utilization and I/O activity. Estimate power dissipation using the datasheet's power calculator. For high utilization, consider adding thermal vias under the package and a heatsink if necessary. Ensure adequate airflow in the enclosure.
Compliance Information
RoHS compliant per distributor data. Other compliance details not specified in the provided data.
