MC68376BACAB25 - 32-Bit CPU32 MCU, 25MHz, ROMless, 160-QFP | NXP
N.º de pieza: MC68376BACAB25 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $35 | $35,00 |
| 10 | $31.5 | $315,00 |
| 100 | $27.2 | $2.720,00 |
| 500 | $22.8 | $11.400,00 |
| 1.000 | $19.4 | $19.400,00 |
MC68376BACAB25 Descripción general
What is a CPU32 microcontroller? A CPU32 microcontroller is a member of the 68000-family instruction set architecture, offering 32-bit internal registers and a 16/32-bit instruction encoding. It sits in the hierarchy between 8/16-bit microcontrollers and full 32-bit application processors, delivering deterministic real-time performance with a mature toolchain. The M683xx series adds integrated peripherals (timers, serial, I/O) on the same die, classifying the device as an embedded microcontroller within the broader power-management-and-control semiconductor category.
Key features include a 25 MHz CPU32 core with 32-bit internal architecture, ROMless program execution from external memory, integrated peripheral modules in the M683xx family, a wide operating temperature range suitable for industrial environments, and a 160-QFP (28x28 mm) package with abundant I/O for system integration. The ROMless design lets designers program external flash for flexible firmware updates and capacity scaling.
Technically, the CPU32 implements the M68000 instruction set with 32-bit registers and enhanced addressing modes, executed through a 3-stage pipeline at 25 MHz. The chip integrates peripheral subsystems such as the System Integration Module (SIM), Time Processing Unit (TPU), queued serial module (QSM), and configurable I/O, allowing developers to consolidate multiple glue-logic devices into a single IC.
Typical applications include automotive engine control units, industrial automation controllers, motor drives, robotics, point-of-sale terminals, and legacy embedded systems requiring 68000-family software continuity. Designers migrating from older 68k designs often select this part to preserve firmware investment.
When designing with this part, note that the 160-QFP package requires careful PCB layout with thermal vias for moderate dissipation, and external boot ROM or flash must be connected since the device is ROMless.
This page synthesizes distributor inventory signals, parametric comparisons against MC68360-family and SC-prefix variants, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para MC68376BACAB25 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SC68376BACAB25
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MC68376BGAB25
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MC68376BACAB25 Valores máximos y características eléctricas
| Core Architecture | CPU32 (M68000 family, 32-bit registers) |
| Family | M683xx |
| Operating Frequency | 25 MHz |
| Program Memory Type | ROMless (external memory required) |
| Ancho del bus de datos | 32-bit |
| Encapsulado | 160-QFP (28x28 mm), surface mount |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (industrial, typical) |
| Peripherals | SIM, TPU, QSM, configurable I/O (M683xx family) |
Guía de configuración de pines de MC68376BACAB25 160-qfp (28x28 mm), surface mount
Configuración de pines para MC68376BACAB25 (encapsulado 160-qfp (28x28 mm), surface mount). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC68376BACAB25.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC68376BACAB25 es adecuado para 6 aplicacións: Automotive Engine Control, Industrial Motion Control, Robotics Controllers, Point-of-Sale Terminals, Medical Instrumentation (Legacy), Building Automation and HVAC.
Automotive Engine Control
The MC68376BACAB25's CPU32 core and Time Processing Unit (TPU) make it well-suited to legacy engine management ECUs. With 25 MHz of compute, it can service crank/cam tooth scheduling, fuel injection pulse widths, and idle air control loops within sub-millisecond periods, and the integrated TPU handles complex timing sequences without burdening the core. The 160-QFP package supports the high pin count required for multi-injector drive and sensor interfacing. Engineers maintaining M683xx-based powertrain ECUs rely on this part's deterministic interrupt latency and field-proven reliability.
Recomendado
Industrial Motion Control
For multi-axis motion controllers and servo drives, the MC68376BACAB25 provides dedicated timer channels through the TPU for quadrature decoding and PWM generation. The CPU32 core executes trajectory planners and PID loops at 25 MHz, sufficient for sub-kilohertz servo update rates, while the QSM (queued serial module) interfaces to host controllers via UART/SPI. The 160-QFP package allows direct connection to power-stage gate drivers and encoder feedback without external logic. This makes the part a long-standing choice in factory automation equipment where M68000 firmware assets remain valuable.
Recomendado
Robotics Controllers
Legacy robotics platforms built on the M68000 instruction set benefit from the MC68376BACAB25's familiar toolchain and abundant peripherals. The 25 MHz CPU32 core coordinates kinematics, sensor fusion, and communication with off-board controllers, while the TPU generates precision PWM for servo amplifiers and stepper motor drives. The 160-QFP package accommodates multiple serial channels for daisy-chained robot buses. Designers maintaining older robotic systems find this part indispensable for firmware continuity, despite its NRND status, because recompiling under a different ISA would require extensive revalidation.
Recomendado
Point-of-Sale Terminals
POS terminals require reliable embedded processing for transaction handling, peripheral management, and display driving. The MC68376BACAB25 delivers deterministic real-time control of keyboards, magnetic-stripe readers, thermal printers, and LCD displays through its GPIO and serial interfaces. The 32-bit CPU32 architecture handles communication stacks and encryption helpers at 25 MHz, which is adequate for legacy POS workloads where response time is dominated by mechanical peripherals rather than compute. The 160-QFP package's high pin count is well-matched to the multi-drop RS-485 cash-drawer and printer bus.
Recomendado
Medical Instrumentation (Legacy)
In long-lifecycle medical instruments such as blood analyzers and patient monitors, the MC68376BACAB25 continues to operate with high reliability. Its CPU32 core handles sensor sampling and user-interface rendering, while the integrated peripherals interface directly to ADCs, displays, and keypads. Designers value the deterministic interrupt response for safety-critical signal acquisition. Because medical device revalidation is expensive, manufacturers retain the M683xx architecture rather than redesigning around newer MCUs. The 160-QFP package is well-suited to through-hole-style industrial medical PCBs that prioritize mechanical robustness over miniaturization.
Recomendado
Building Automation and HVAC
Building management systems and HVAC controllers leverage the MC68376BACAB25's robust peripheral set to manage sensor networks, damper actuators, and communication gateways. The CPU32 core at 25 MHz executes scheduling algorithms and remote-control protocols (BACnet, Modbus) without timing issues, and the QSM provides UART channels for multiple RS-485 trunks. The 160-QFP package's large I/O count supports parallel interfaces to legacy HVAC I/O boards. For building automation retrofits where existing M683xx firmware handles proprietary control logic, this MCU remains a maintenance staple.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC68376BACAB25 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SC68376BACAB25 | MC68376BGAB25 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 160-QFP (28x28) | 160-QFP (28x28) - same | 160-QFP (28x28) - same |
| Operating Frequency | 25 MHz | 25 MHz | 25 MHz |
| Core Architecture | CPU32 (M68000 family) | CPU32 (M68000 family) | CPU32 (M68000 family) |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) |
| Data Bus Width | 32-bit | 32-bit | 32-bit |
| Integrated TPU | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND |
Diferenciadores clave
- Drop-in factory/mask sibling with identical die (frente a SC68376BACAB25)
- Mature M683xx toolchain and firmware base (frente a Modern ARM Cortex-M3 MCU)
- Integrated Time Processing Unit (TPU) (frente a Generic 32-bit MCU without TPU)
Notas de diseño
The 160-QFP package uses a 0.65 mm pitch, which is at the edge of standard SMT capability. Use NSMD (non-solder-mask defined) pads with a 0.55 mm pad width and 0.30 mm mask opening to improve solder joint reliability. Apply thermal vias beneath the central thermal pad area (if present in the mechanical drawing) to spread heat into inner copper planes. Stencil aperture should be slightly reduced (1:0.9) to prevent solder bridging between adjacent fine-pitch leads.
Since the MC68376BACAB25 is ROMless, you must connect an external boot device (typically a parallel EPROM/flash) to the address/data bus BEFORE applying power to the CPU32 core. A missing or improperly sized external memory interface will result in a bus-error trap on reset, not a graceful idle state. Reference the System Integration Module (SIM) chapter of the datasheet for chip-select and bus-sizing configuration registers.
At 25 MHz the CPU32 core dissipates roughly 0.5-1 W depending on peripheral activity and output loading. The 160-QFP thermal resistance (theta_JA) is approximately 30-35 C/W on a 4-layer JEDEC board, giving a junction rise of 15-35 C above ambient. Provide a top-side copper pour area of at least 1 square inch around the package for adequate cooling; for hot enclosures (above 70 C ambient), add thermal vias to inner planes. Derate if running peripheral interfaces at full bandwidth continuously.
Información de cumplimiento
RoHS, REACH, lead-free, and halogen-free status were not present in the verified distributor listings; marking [DATA_NEEDED] in specs reflects this gap. AEC-Q100 not stated as qualified per current NXP roadmaps.
