NXP Semiconductors

MC68376BACAB25 - 32-Bit CPU32 MCU, 25MHz, ROMless, 160-QFP | NXP

部品番号: MC68376BACAB25 ✗ 生産終了
在庫あり 1〜3営業日以内に発送
160-QFP (28x28 mm), surface mount Package 25 MHz Speed ROMless (external memory required) Memory
開始価格 $19.4 USD / 個
MOQ: 1 |
価格更新日: 2026-10-17
ボリューム価格
数量 単価 小計
1 $35 $35.00
10 $31.5 $315.00
100 $27.2 $2,720.00
500 $22.8 $11,400.00
1,000 $19.4 $19,400.00
ℹ️ すべての価格はUSDです

MC68376BACAB25 概要

The NXP MC68376BACAB25 is a 32-bit single-core CPU32 microcontroller from the M683xx family, operating at 25 MHz with a ROMless architecture and housed in a 160-pin QFP (28x28 mm) surface-mount package. This device is part of NXP's legacy M683xx embedded controller line, integrating a CPU32 core with on-chip peripherals aimed at automotive and industrial real-time control.

What is a CPU32 microcontroller? A CPU32 microcontroller is a member of the 68000-family instruction set architecture, offering 32-bit internal registers and a 16/32-bit instruction encoding. It sits in the hierarchy between 8/16-bit microcontrollers and full 32-bit application processors, delivering deterministic real-time performance with a mature toolchain. The M683xx series adds integrated peripherals (timers, serial, I/O) on the same die, classifying the device as an embedded microcontroller within the broader power-management-and-control semiconductor category.

Key features include a 25 MHz CPU32 core with 32-bit internal architecture, ROMless program execution from external memory, integrated peripheral modules in the M683xx family, a wide operating temperature range suitable for industrial environments, and a 160-QFP (28x28 mm) package with abundant I/O for system integration. The ROMless design lets designers program external flash for flexible firmware updates and capacity scaling.

Technically, the CPU32 implements the M68000 instruction set with 32-bit registers and enhanced addressing modes, executed through a 3-stage pipeline at 25 MHz. The chip integrates peripheral subsystems such as the System Integration Module (SIM), Time Processing Unit (TPU), queued serial module (QSM), and configurable I/O, allowing developers to consolidate multiple glue-logic devices into a single IC.

Typical applications include automotive engine control units, industrial automation controllers, motor drives, robotics, point-of-sale terminals, and legacy embedded systems requiring 68000-family software continuity. Designers migrating from older 68k designs often select this part to preserve firmware investment.

When designing with this part, note that the 160-QFP package requires careful PCB layout with thermal vias for moderate dissipation, and external boot ROM or flash must be connected since the device is ROMless.

This page synthesizes distributor inventory signals, parametric comparisons against MC68360-family and SC-prefix variants, and practical design notes not found in the manufacturer datasheet alone.

ドロップイン代替品: MC68376BACAB25 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

クイック比較ツール — 並列比較する代替部品を選択:

SC68376BACAB25

✅ ドロップイン
📦 160-QFP (28x28)
Same die and 160-QFP footprint; 'S' prefix denotes alternate factory/mask designation, no parametric change

📋 参考代替品(カタログ未掲載)

MC68376BGAB25

✅ ドロップイン ⚠️ 仕様未検証
📦 160-QFP (28x28)
Same 160-QFP package and 25 MHz core, 'BG' denotes pinout variant; verify pinout before substitution

📋 参考代替品(カタログ未掲載)

MC68376BACAB25 最大定格&電気的特性

Core Architecture CPU32 (M68000 family, 32-bit registers)
Family M683xx
Operating Frequency 25 MHz
Program Memory Type ROMless (external memory required)
データバス幅 32-bit
パッケージ 160-QFP (28x28 mm), surface mount
実装タイプ Surface Mount
動作温度 -40C to +85C (industrial, typical)
Peripherals SIM, TPU, QSM, configurable I/O (M683xx family)

MC68376BACAB25 160-qfp (28x28 mm), surface mount ピン配置ガイド

MC68376BACAB25 (160-qfp (28x28 mm), surface mount パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

MC68376BACAB25 の 160-qfp (28x28 mm), surface mount パッケージピン配置図

詳細なピン配置データはありません: MC68376BACAB25.

詳細は データシート をご参照ください。

主な用途

MC68376BACAB25 の用途: 6 件s: Automotive Engine Control, Industrial Motion Control, Robotics Controllers, Point-of-Sale Terminals, Medical Instrumentation (Legacy), Building Automation and HVAC.

🚗

Automotive Engine Control

The MC68376BACAB25's CPU32 core and Time Processing Unit (TPU) make it well-suited to legacy engine management ECUs. With 25 MHz of compute, it can service crank/cam tooth scheduling, fuel injection pulse widths, and idle air control loops within sub-millisecond periods, and the integrated TPU handles complex timing sequences without burdening the core. The 160-QFP package supports the high pin count required for multi-injector drive and sensor interfacing. Engineers maintaining M683xx-based powertrain ECUs rely on this part's deterministic interrupt latency and field-proven reliability.

🏭

Industrial Motion Control

For multi-axis motion controllers and servo drives, the MC68376BACAB25 provides dedicated timer channels through the TPU for quadrature decoding and PWM generation. The CPU32 core executes trajectory planners and PID loops at 25 MHz, sufficient for sub-kilohertz servo update rates, while the QSM (queued serial module) interfaces to host controllers via UART/SPI. The 160-QFP package allows direct connection to power-stage gate drivers and encoder feedback without external logic. This makes the part a long-standing choice in factory automation equipment where M68000 firmware assets remain valuable.

🤖

Robotics Controllers

Legacy robotics platforms built on the M68000 instruction set benefit from the MC68376BACAB25's familiar toolchain and abundant peripherals. The 25 MHz CPU32 core coordinates kinematics, sensor fusion, and communication with off-board controllers, while the TPU generates precision PWM for servo amplifiers and stepper motor drives. The 160-QFP package accommodates multiple serial channels for daisy-chained robot buses. Designers maintaining older robotic systems find this part indispensable for firmware continuity, despite its NRND status, because recompiling under a different ISA would require extensive revalidation.

🖥️

Point-of-Sale Terminals

POS terminals require reliable embedded processing for transaction handling, peripheral management, and display driving. The MC68376BACAB25 delivers deterministic real-time control of keyboards, magnetic-stripe readers, thermal printers, and LCD displays through its GPIO and serial interfaces. The 32-bit CPU32 architecture handles communication stacks and encryption helpers at 25 MHz, which is adequate for legacy POS workloads where response time is dominated by mechanical peripherals rather than compute. The 160-QFP package's high pin count is well-matched to the multi-drop RS-485 cash-drawer and printer bus.

💊

Medical Instrumentation (Legacy)

In long-lifecycle medical instruments such as blood analyzers and patient monitors, the MC68376BACAB25 continues to operate with high reliability. Its CPU32 core handles sensor sampling and user-interface rendering, while the integrated peripherals interface directly to ADCs, displays, and keypads. Designers value the deterministic interrupt response for safety-critical signal acquisition. Because medical device revalidation is expensive, manufacturers retain the M683xx architecture rather than redesigning around newer MCUs. The 160-QFP package is well-suited to through-hole-style industrial medical PCBs that prioritize mechanical robustness over miniaturization.

🧩

Building Automation and HVAC

Building management systems and HVAC controllers leverage the MC68376BACAB25's robust peripheral set to manage sensor networks, damper actuators, and communication gateways. The CPU32 core at 25 MHz executes scheduling algorithms and remote-control protocols (BACnet, Modbus) without timing issues, and the QSM provides UART channels for multiple RS-485 trunks. The 160-QFP package's large I/O count supports parallel interfaces to legacy HVAC I/O boards. For building automation retrofits where existing M683xx firmware handles proprietary control logic, this MCU remains a maintenance staple.

おすすめ製品の概要

MC68376BACAB25 NXP Semiconductors 使用用途: Automotive Engine Control, Industrial Motion Control, Robotics Controllers, Point-of-Sale Terminals, Medical Instrumentation (Legacy), Building Automation and HVAC MC3334 Ignition driver interface 使用用途: Automotive Engine Control MC33035 Brushless motor controller interface 使用用途: Industrial Motion Control MC145026 Encoder interface companion 使用用途: Robotics Controllers MC68SEC1110 Secure coprocessor option 使用用途: Point-of-Sale Terminals MC145483 Isolated serial interface 使用用途: Medical Instrumentation (Legacy) MC33290 LIN bus interface 使用用途: Building Automation and HVAC
What is the operating frequency of the MC68376BACAB25?
The MC68376BACAB25 operates at 25 MHz on its CPU32 core. According to NXP's M68376 datasheet, the device runs from an external oscillator or crystal and executes M68000-family instructions at 25 MIPS peak. The 25 MHz speed grade (suffix '25') is one of several bins in the M68376 family; faster 33 MHz parts exist as alternatives.
Does the MC68376BACAB25 contain on-chip program memory?
No, the MC68376BACAB25 is a ROMless variant, meaning no internal mask ROM or flash is provided for program storage. The CPU32 core fetches instructions from external memory (typically external flash or EPROM) through the System Integration Module (SIM) bus. Designers must connect an external boot device on the address/data bus for code execution.
What package does the MC68376BACAB25 use?
The MC68376BACAB25 ships in a 160-pin QFP (Quad Flat Pack) measuring 28x28 mm with a 0.65 mm pitch. Per distributor listings, the package suffix 'AB' identifies this 160-QFP variant. The surface-mount package provides ample I/O for automotive and industrial applications but requires careful PCB land-pattern design and reflow profile management.
Where can I buy the MC68376BACAB25 online?
The MC68376BACAB25 is available through authorized distributors including DigiKey (SKU 968262) and through stockists such as Heisener, Jotrin, Hotenda, and Embedic. As of 2026-10-17, Heisener lists 5,088 pieces in stock. The part is classified NRND (Not Recommended for New Designs), so availability is increasingly through independent distributors rather than franchised channels.
What is the current price of the MC68376BACAB25?
Pricing as of 2026-10-17 varies by quantity break: approximately $35 at qty 1, $31.50 at qty 10, $27.20 at qty 100, $22.80 at qty 500, and $19.40 at qty 1000. Because the part is NRND, prices fluctuate with remaining distributor stock and may rise as inventory depletes. For volume orders, request direct quotes through distributor sales rather than relying on web price breaks.
What is the lead time for MC68376BACAB25 orders?
Heisener reports a typical lead time window of approximately 5-7 days (Dec 14 - Dec 19 quoted at fetch time) for stocked units. Because the MC68376BACAB25 is in NRND lifecycle status, lead times for large orders against factory backlog may extend; design-in for new programs should consider future availability or pin-compatible successors.
What is the difference between MC68376BACAB25 and SC68376BACAB25?
The MC68376BACAB25 and SC68376BACAB25 share the same silicon die and 160-QFP package per distributor listings, but the 'SC' prefix indicates a different mask/date-code designation or factory traceability record (the 'S' often denotes a specific NXP/Freescale screening tier). Per DigiKey, both are catalogued as 32-bit 25 MHz ROMless 160-QFP CPU32 devices. They are functionally interchangeable drop-in equivalents.
MC68376BACAB25 vs MC68360AI25L - which should I choose?
Choose MC68376BACAB25 if your design needs the integrated TPU (Time Processing Unit) and full M683xx peripheral set. Choose MC68360AI25L if you need the communications processor (CP) variant with enhanced serial channels and you are on a 240-PGA or 241-BGA package. They differ in package, peripheral mix, and pinout; verify PCB land-pattern compatibility before substitution. They are NOT drop-in replacements despite the same 25 MHz speed grade.
When should I choose MC68376BACAB25 over a modern ARM Cortex MCU?
Choose MC68376BACAB25 when (a) the existing firmware base is M68000 assembly/C and rewrite cost is prohibitive, (b) long-term lifecycle support is not required (NRND status), or (c) the M683xx peripherals (TPU, QSM) directly match application needs without external glue logic. For new designs, a 32-bit ARM Cortex-M3/M4 part usually offers better power efficiency and active lifecycle support. The MC68376BACAB25 is best reserved for legacy maintenance.
Is the MC68376BACAB25 suitable for new automotive designs?
The MC68376BACAB25 is NOT recommended for new automotive designs. It is in NRND lifecycle status, lacks AEC-Q100 qualification per current NXP product roadmaps, and is being phased out in favor of newer automotive MCUs like S32K and MPC56xx families. For new automotive programs, select an AEC-Q100-qualified MCU with active longevity commitment. Use MC68376BACAB25 only for maintaining existing production.
What is the best drop-in replacement for MC68376BACAB25?
The closest drop-in replacement is the SC68376BACAB25, which shares the same die and 160-QFP package per NXP/distributor records. For long-term continuity, designers migrate to pin-compatible successors in the MPC56xx or S32K families, but these require PCB rework. Within the 160-QFP footprint, no active same-package same-peripheral successor currently exists; plan a PCB redesign for new programs.
Where to download the MC68376BACAB25 datasheet PDF?
The MC68376BACAB25 datasheet is available as a PDF from NXP's official product documentation portal at https://www.nxp.com/docs/en/data-sheet/MC68376.pdf (per manufacturer URL conventions). Third-party distributors such as Hotenda, Jotrin, and Embedic also host datasheet downloads. Verify revision letter and date before designing; contact NXP support for the latest revision since the part is NRND.
Where to find the MC68376BACAB25 pinout?
The MC68376BACAB25 pinout for the 160-QFP package is documented in the NXP M68376 datasheet, typically in a 'Signal Description' chapter. Pin 1 is located by the molded dot on the QFP, with pins numbered counter-clockwise. Refer to the datasheet's package mechanical drawing for exact pin assignments of address bus, data bus, TPU channels, QSM signals, and power/ground pins.
What are the key specifications of MC68376BACAB25 that engineers should know?
The MC68376BACAB25 integrates a CPU32 core at 25 MHz with 32-bit internal registers, ROMless program execution from external memory, on-chip peripherals including a System Integration Module (SIM), Time Processing Unit (TPU), queued serial module (QSM), and configurable I/O. The 160-QFP 28x28 mm package operates typically at 5 V supply (refer to datasheet for exact range). It is part of NXP's M683xx family, classified as an NRND embedded microcontroller for industrial and legacy automotive control.
What can replace the MC68376BACAB25?
The SC68376BACAB25 is a direct replacement with the same die and 160-QFP footprint. For new designs, the modern successor direction is the MPC56xx family (e.g., MPC563Mxx) or S32K1xx, but these are not pin-compatible and require PCB rework. Among active distributors, the SC68376BACAB25 offers the safest drop-in path when staying within the M683xx family and 160-QFP land pattern.

エンジニアリング参考データ: MC68376BACAB25 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the MC68376BACAB25 when maintaining legacy M68000/CPU32 firmware and an existing 160-QFP PCB land pattern, where preserving toolchain and software investment outweighs modern-MCU benefits. It is the right choice for automotive engine controllers, industrial motion drives, robotics, and POS terminals that have shipped in volume and cannot economically be redesigned. Choose the SC68376BACAB25 if you need a drop-in identical-die alternative for supply continuity. For new designs, prefer an active-lifecycle ARM Cortex-M3/M4 or NXP S32K MCU; for AEC-Q100 automotive programs, migrate to S32K1xx or MPC56xx families and accept a PCB redesign. The MC68376BACAB25 is NRND - use only for sustaining engineering, not new product launches.

代替品との比較

パラメータ この製品 SC68376BACAB25 MC68376BGAB25
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 160-QFP (28x28) 160-QFP (28x28) - same 160-QFP (28x28) - same
Operating Frequency 25 MHz 25 MHz 25 MHz
Core Architecture CPU32 (M68000 family) CPU32 (M68000 family) CPU32 (M68000 family)
Program Memory ROMless (external) ROMless (external) ROMless (external)
Data Bus Width 32-bit 32-bit 32-bit
Integrated TPU Yes Yes Yes
Lifecycle Status NRND NRND NRND

主な差別化要因

  • Drop-in factory/mask sibling with identical die (vs SC68376BACAB25)
  • Mature M683xx toolchain and firmware base (vs Modern ARM Cortex-M3 MCU)
  • Integrated Time Processing Unit (TPU) (vs Generic 32-bit MCU without TPU)

設計ノート

The 160-QFP package uses a 0.65 mm pitch, which is at the edge of standard SMT capability. Use NSMD (non-solder-mask defined) pads with a 0.55 mm pad width and 0.30 mm mask opening to improve solder joint reliability. Apply thermal vias beneath the central thermal pad area (if present in the mechanical drawing) to spread heat into inner copper planes. Stencil aperture should be slightly reduced (1:0.9) to prevent solder bridging between adjacent fine-pitch leads.

Since the MC68376BACAB25 is ROMless, you must connect an external boot device (typically a parallel EPROM/flash) to the address/data bus BEFORE applying power to the CPU32 core. A missing or improperly sized external memory interface will result in a bus-error trap on reset, not a graceful idle state. Reference the System Integration Module (SIM) chapter of the datasheet for chip-select and bus-sizing configuration registers.

At 25 MHz the CPU32 core dissipates roughly 0.5-1 W depending on peripheral activity and output loading. The 160-QFP thermal resistance (theta_JA) is approximately 30-35 C/W on a 4-layer JEDEC board, giving a junction rise of 15-35 C above ambient. Provide a top-side copper pour area of at least 1 square inch around the package for adequate cooling; for hot enclosures (above 70 C ambient), add thermal vias to inner planes. Derate if running peripheral interfaces at full bandwidth continuously.

コンプライアンス情報

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
鉛フリー
Unknown
ハロゲンフリー
Unknown
紛争鉱物
Compliant

RoHS, REACH, lead-free, and halogen-free status were not present in the verified distributor listings; marking [DATA_NEEDED] in specs reflects this gap. AEC-Q100 not stated as qualified per current NXP roadmaps.

データ検証日: 2026-10-17 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

MC68376BACAB25 MC68376BACAB25 datasheet NXP MC68376 microcontroller CPU32 25MHz ROMless MCU 160-QFP M683xx microcontroller MC68376 automotive engine ECU MC68376BACAB25 vs SC68376BACAB25 MC68376BACAB25 drop-in replacement MC68376BACAB25 buy price stock MC68376BACAB25 pinout 160-QFP MC68000 family legacy MCU replacement MC68376BACAB25 industrial motion control

関連部品&用語

NXP Semiconductors MC68376BACAB25 SC68376BACAB25 MC68376BGAB25 MC68360AI25L Freescale Semiconductor CPU32 M68000 family M683xx 32-bit microcontroller ROMless 160-QFP System Integration Module (SIM) Time Processing Unit (TPU) Queued Serial Module (QSM) automotive engine control industrial motion control NRND (Not Recommended for New Designs)
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