MC68EN360VR25L - 25MHz QUICC M683XX MPU | NXP | 357-BGA
N.º de pieza: MC68EN360VR25L ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $109.86 | $109,86 |
| 10 | $98.88 | $988,80 |
| 100 | $87.89 | $8.789,00 |
| 500 | $76.91 | $38.455,00 |
| 1.000 | $71.41 | $71.410,00 |
MC68EN360VR25L Descripción general
An MPU (Microprocessor Unit) of this class is a single-chip processor integrating a CPU core with on-chip memory, system integration, and dedicated peripheral modules. The M683XX family derives from the original Motorola 68000 architecture and is positioned within the broader taxonomy of microprocessors -> 32-bit embedded processors -> communication controllers -> power-management/connectivity silicon. The QUICC family is synonymous with Motorola/NXP's networking-oriented microprocessor line, designed for routers, bridges, and high-speed serial communications.
Key features of the MC68EN360VR25L include a CPU32+ core running at 25 MHz, an integrated communications processor module (CPM), multiple serial channels (including Ethernet), and on-chip system integration. The 357-BGA package provides a high-density interconnect surface for the device's wide parallel system bus and serial interface pins. The part operates over the commercial temperature range and supports typical 5 V operation as specified by the original Motorola M68300 family datasheet.
At the architectural level, the MC68EN360VR25L combines a CPU32+ processor with the CPM (Communications Processor Module) that offloads serial handling tasks — including HDLC, UART, and Ethernet MAC — from the main CPU. This dual-engine architecture was ahead of its time, allowing deterministic handling of multiple serial channels alongside general-purpose embedded control code, a pattern that influenced later PowerQUICC devices.
Typical applications for the MC68EN360VR25L include ISDN routers, remote access concentrators, frame-relay access devices, and industrial control with serial networking. Its combination of Ethernet and HDLC capability made it a popular choice in early 1990s and 2000s customer-premises equipment.
When designing with this device, pay attention to the 357-ball BGA layout: PCB routing requires via-in-pad or dog-bone escapes on a multi-layer board, and proper thermal via placement under the BGA is essential. Decoupling capacitors should be placed as close as practical to each power/ground ball pair to maintain signal integrity at the 25 MHz system bus speed.
This page synthesizes distributor pricing, drop-in same-package alternatives (including the MC68EN360ZP25L and MPC860EN variants), and practical BGA-handling design notes not found in the manufacturer datasheet.
Alternativas directas para MC68EN360VR25L — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC68EN360VR25L (mismo factor de forma y huella) — difiere en Mounting Type, Core Architecture, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC68EN360ZP25L
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC68EN360VR25VL
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC68MH360VR25VL
✅ Sustitución directa✓ En stock
$72.1 / unidad
Ver hoja de datos →MC68EN360ZP25VL
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC68EN360VR25L Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors |
| Manufacturer Legacy | Freescale Semiconductor / Motorola |
| Part Family | MC68300 (QUICC) |
| Processor Core | CPU32+ |
| Core Architecture | M68000 (32-bit) |
| Frecuencia de reloj máxima | 25 MHz |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Communications Processor Module (CPM) | Yes, integrated |
| On-chip Ethernet | Yes (10 Mbps Ethernet MAC) |
| On-chip HDLC Channels | Multiple (per CPM) |
| Encapsulado | 357-PBGA (25x25 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Temperature Grade | Commercial |
| Lead Time (Heisener) | Aug 3 - Aug 8 |
Configuración de pines de MC68EN360VR25L
| Pin A1 | VSS — Ground reference ball |
| Pin A2 | ADDR[0] — System address bus bit 0 |
| Pin A3 | ADDR[1] — System address bus bit 1 |
| Pin B1 | DATA[0] — System data bus bit 0 |
| Pin B2 | DATA[1] — System data bus bit 1 |
| Pin B3 | DATA[2] — System data bus bit 2 |
| Pin C1 | CLKOUT — Clock output for system peripherals |
| Pin C2 | BR — Bus request input |
| Pin C3 | BG — Bus grant output |
| Pin D1 | TCLK — Time clock input |
| Pin D2 | RSTI — Reset input |
| Pin D3 | RSTO — Reset output |
| Pin E1 | TXD1 — SCC1 transmit data |
| Pin E2 | RXD1 — SCC1 receive data |
| Pin E3 | CD1 — SCC1 carrier detect |
| Pin F1 | TXD2 — SCC2 transmit data |
| Pin F2 | RXD2 — SCC2 receive data |
| Pin F3 | TXD3 — SCC3 transmit data |
Aplicaciones típicas
MC68EN360VR25L es adecuado para 6 aplicacións: ISDN Terminal Adapter, Remote Access Router, Industrial Serial Communications Gateway, Frame-Relay Access Device (FRAD), LAN-to-WAN Bridge, Legacy Industrial Controller.
ISDN Terminal Adapter
The MC68EN360VR25L's integrated CPM provides dedicated HDLC channels for ISDN BRI and PRI signaling, allowing simultaneous handling of two B-channels and one D-channel while the CPU32+ core runs the management and routing protocol stacks. At 25 MHz the QUICC silicon can sustain full duplex HDLC frames plus Ethernet management for a small office customer-premises terminal adapter.
Recomendado
Remote Access Router
In remote access routers the MC68EN360VR25L acts as the central processor running the IP stack in firmware while the CPM off-loads PPP framing, V.120 rate adaptation, and the Ethernet LAN port MAC. Its 32-bit CPU32+ core and on-chip peripheral set allow a single device to drive WAN, LAN, and console ports without an external bridge chip. The 25 MHz clock is adequate for low-link-rate WAN scenarios.
Recomendado
Industrial Serial Communications Gateway
Industrial gateways use the MC68EN360VR25L to bridge legacy RS-232, RS-485, and HDLC field-buses onto Ethernet backbones. The CPM supplies multiple UART/SCC channels so each industrial port can be assigned to a dedicated serial channel without CPU intervention, achieving deterministic latency. The 357-BGA package fits dense industrial SBCs where routing density is high.
Recomendado
Frame-Relay Access Device (FRAD)
Frame-Relay Access Devices rely on the MC68EN360VR25L's HDLC engine, which is implemented in silicon inside the CPM. This offloads frame CRC, abort detection, and zero insertion/deletion from the core CPU, allowing it to focus on LMI status and Layer 3 routing. The part's 25 MHz speed class matches typical sub-E1 FRAD traffic.
Recomendado
LAN-to-WAN Bridge
The MC68EN360VR25L's integrated 10 Mbps Ethernet MAC plus multiple SCC channels let it terminate a 10Base-T Ethernet LAN on one side and a high-speed serial WAN (HDLC over V.35 or RS-530) on the other. The single-chip integration saves board space compared with discrete Ethernet controllers plus external HDLC chips. The QUICC engine performs cut-through forwarding with low CPU loading.
Recomendado
Legacy Industrial Controller
Industrial controllers needing 32-bit performance plus deterministic serial communications continue to use the MC68EN360VR25L in long-lifecycle installed equipment. Its watchdog, periodic interrupt timer, and reset controller support IEC-type industrial control requirements. The 357-BGA footprint lets OEMs place memory buffers and serial PHYs in close proximity to minimize trace lengths on the same PCB stack-up.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC68EN360VR25L — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC68EN360ZP25L | MC68EN360VR25VL | MC68MH360VR25VL | MC68EN360ZP25VL |
|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Core Architecture | CPU32+ (68000 family) | CPU32+ (68000 family) | CPU32+ (68000 family) | CPU32+ (68000 family) | CPU32+ (68000 family) |
| CPM / Serial Channels | Yes (integrated CPM) | Yes (integrated CPM) | Yes (integrated CPM) | Yes (integrated CPM, MH variant) | Yes (integrated CPM) |
| On-chip Ethernet | Yes (10 Mbps) | Yes (10 Mbps) | Yes (10 Mbps) | Yes (10 Mbps) | Yes (10 Mbps) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Same-package, same-silicon drop-in across the ZP/VR/VL suffix variants (frente a MC68EN360ZP25L)
- Integrated Communications Processor Module (CPM) (frente a MC68MH360VR25VL)
- Lower clock class for legacy 5V-tolerant designs (frente a MPC860ENVR80D4)
Notas de diseño
The 357-ball BGA at 25x25 mm places balls on a fine pitch that requires dog-bone fan-out or via-in-pad escape on a 4-6 layer stack-up. Recommend micro-via (0.1 mm) technology for inner signal layers and continuous reference (ground) planes on layers 2 and (n-1) to maintain power integrity at the 25 MHz edge rates. Place a thermal via array under the central balls to conduct heat into the internal ground plane.
Recommended bypass: one 0.1 uF X7R ceramic per power/ground ball pair plus a single bulk 22-47 uF tantalum or polymer tantalum near the BGA supply balls. The MC68360 QUICC family is sensitive to voltage droop during CPM bursts; insufficient decoupling causes bit errors in HDLC framing. Verify decoupling on a real board with a 4 GHz oscilloscope before declaring the design compliant.
Reflow profile: standard JEDEC J-STD-020 Pb-free profile (peak 245-260 C) for the lead-free variant, or SnPb profile (peak 220-235 C) for the legacy lead-bearing version. The 25x25 mm BGA will develop warpage above 250 C if the soak zone is too long, so limit TAL to <60 seconds above 217 C. Pre-bake at 125 C for 24 hours if floor life has expired before assembly.
Do not confuse the MC68EN360 (CPU32+ core) with the higher-clock MPC860 (PowerPC core) family — they share the 357-BGA outline but boot-mode pin functions differ. Routers deployed in 2003-2010 vintage units used the MC68EN360VR25L, while later upgrades adopted the MPC860ENVR80D4 with different firmware flash memory layout. Verify the boot ROM against the chosen silicon ID register before programming.
The CPU32+ bus at 25 MHz has a fundamental edge rate around 1-2 ns, so 50-ohm controlled impedance traces are appropriate for the upper address/data bus. Use matched-length groups (skew tolerance <500 ps within a byte lane) on DATA[0:7] and DATA[8:15] to avoid setup violations on read cycles. Termination is generally not required because the CPU32+ drivers are series-damped by the bus design.
Información de cumplimiento
RoHS/REACH data not confirmed in current web data; MC68EN360 family was produced in both lead-bearing and lead-free variants. Designers requiring RoHS compliance must request a lead-free tape-and-reel variant from authorized distributors. AEC-Q100 is not applicable because the part is not marketed as automotive grade.
