MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP
N.º de pieza: MC68EN360VR33L ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $129.81 | $129,81 |
| 10 | $115.5 | $1.155,00 |
| 100 | $98.4 | $9.840,00 |
| 500 | $86.2 | $43.100,00 |
| 1.000 | $78.95 | $78.950,00 |
MC68EN360VR33L Descripción general
A microprocessor (MPU) is the central processing unit of an embedded system, integrating an arithmetic-logic unit, register file, instruction decoder, memory-management unit, and peripheral controllers onto a single die. The MC68360 family sits in the hierarchy: MPU -> embedded processor -> 32-bit CISC/RISC hybrid (CPU32+ core with RISC comm engine) -> communications controller. It is engineered for telecom, datacom, and industrial-control applications where deterministic serial-channel handling is required alongside a general-purpose host CPU.
Key features include a 32-bit CPU32+ core with 4 GB address space, dedicated RISC communications processor supporting SCCs (serial communication channels), an integrated 10/100 Ethernet MAC with MII interface, dual 8 Kbyte instruction/data caches, DRAM controller, DMA controller, timers, and parallel I/O. The 357-PBGA package uses a 25x25 mm substrate with 1.27 mm pitch, and a typical operating junction temperature range of -40C to +85C. The architecture offloads protocol processing from the host CPU, freeing it for application-layer tasks.
The CPU32+ core is binary-compatible with the M68k instruction set, enabling reuse of legacy 68000-family code and toolchains, while the QUICC engine independently manages serial framing. Compared with earlier MC68360 variants, the 'EN' version integrates Ethernet, reducing external PHY-controller glue logic and PCB area. Compared with MC68360ZQ33L, this part shares the same 33 MHz CPU32+ core but is offered in the plastic PBGA 'VR' package versus ceramic 'ZQ'.
Typical applications include 10/100 Ethernet-attached routers, multi-port serial bridges, ISDN terminal adapters, industrial PLCs with Ethernet uplinks, frame-relay access devices, and legacy telecom line cards. The integrated Ethernet MAC plus multiple SCCs makes the device a one-chip solution for compact embedded communications products.
When designing with the MC68EN360VR33L, allocate adequate PCB area for the 25x25 mm 357-BGA and use at least four PCB layers with a continuous ground plane beneath the package for thermal dissipation and signal integrity. Decouple all VCC pins with 0.1 uF ceramic capacitors placed within 5 mm of each ball, and follow the Motorola QUICC hardware-design checklist for SI on the MII bus. Verify that all unused balls are tied per the datasheet's 'no-connect' recommendations.
Alternativas directas para MC68EN360VR33L — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC68EN360VR33L (mismo factor de forma y huella) — difiere en Core Architecture, Package, Mounting Type, Data Bus Width, DMA Channels.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC68EN360VR25L
✅ Sustitución directa✓ En stock
$71.41 / unidad
Ver hoja de datos →MC68EN360VR40L
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC68EN360CVR33L
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC68360VR33L
✅ Sustitución directa✓ En stock
$44.1 / unidad
Ver hoja de datos →MC68EN360ZQ33L
✅ Sustitución directa✓ En stock
$52.75 / unidad
Ver hoja de datos →MC68EN360VR33L Valores máximos y características eléctricas
| Processor Type | M683xx 32-bit CPU32+ |
| Core Architecture | CPU32+ with QUICC RISC communications engine |
| Core Count | 1 |
| Bus Speed / Operating Frequency | 33 MHz |
| Ancho del bus de datos | 32-bit |
| Address Bus Width | 32-bit (4 GB space) |
| Tensión de alimentación | 5 V |
| Ethernet MAC | Integrated 10/100 Ethernet (MII interface) - 'EN' suffix |
| Serial Communication Channels (SCC) | 4 (per QUICC engine) |
| DMA Channels | 2 (per QUICC engine) |
| Timers | 4 general-purpose 16-bit timers |
| DRAM Controller | Integrated, supports FPM/EDO DRAM |
| Interrupt Controller | Integrated, programmable priority |
| Encapsulado | 357-Ball PBGA, 25x25 mm, 1.27 mm pitch ('VR') |
| Tipo de montaje | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Instruction Set | M68k (CPU32+) binary-compatible |
| Packaging | Tray |
| Lead Free / RoHS | Lead Free / RoHS Compliant |
| Process Technology | 0.57 um CMOS (per Freescale datasheet) |
Guía de configuración de pines de MC68EN360VR33L 357-ball pbga, 25x25 mm, 1.27 mm pitch ('vr')
Configuración de pines para MC68EN360VR33L (encapsulado 357-ball pbga, 25x25 mm, 1.27 mm pitch ('vr')). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC68EN360VR33L.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC68EN360VR33L es adecuado para 6 aplicacións: Ethernet-Attached Industrial Router, Multi-Port Serial Communication Bridge, ISDN Terminal Adapter / NT1, Frame-Relay / X.25 Access Device, Industrial PLC with Ethernet Uplink, Legacy Telecom Line Card.
Ethernet-Attached Industrial Router
The MC68EN360VR33L's integrated 10/100 Ethernet MAC plus four SCCs make it a strong fit for compact industrial routers. The 33 MHz CPU32+ handles routing-table lookups and TCP/IP forwarding while the QUICC engine manages up to four serial uplinks (RS-232/RS-485) for legacy field-bus aggregation. Designers place the BGA on a 4-layer PCB with continuous ground plane beneath the 25x25 mm package to manage the 5 V supply's switching transients and meet industrial EMC requirements.
Recomendado
Multi-Port Serial Communication Bridge
The MC68EN360VR33L's QUICC engine independently runs four SCCs (Serial Communication Channels) supporting HDLC, async, transparent, and bisync protocols. At 33 MHz, the RISC comm engine sustains full-duplex 2 Mbps on each SCC, ideal for bridging four legacy serial lines to an Ethernet backbone. A typical design uses an external PHY on the MII bus and a serial transceiver array; the 'EN' integrated MAC eliminates the need for an external Ethernet controller, saving 2-3 square inches of board area.
Recomendado
ISDN Terminal Adapter / NT1
The MC68EN360VR33L was a canonical reference design for ISDN terminal adapters and NT1 line cards in the late 1990s. Its SCCs handle ISDN D-channel HDLC while the integrated Ethernet MAC provides the LAN-side bridge. The 33 MHz CPU32+ runs ISDN call-control software stacks and the QUICC offloads layer-2 framing for jitter-free operation. Per the Freescale QUICC application notes, the part's deterministic comm engine gives sub-millisecond channel-timing accuracy.
Recomendado
Frame-Relay / X.25 Access Device
Frame-relay and X.25 access multiplexers historically used the MC68360 family because the QUICC's SCC HDLC engine handles LAP-F and LAP-B link-layer protocols at line rate with minimal CPU overhead. The 'EN' variant adds 10/100 Ethernet so the FRAD can aggregate multiple WAN ports to one Ethernet uplink without an external MAC. The 357-BGA package handles thermal dissipation of the 5 V, 33 MHz core at typical 2-3 W operating power.
Recomendado
Industrial PLC with Ethernet Uplink
PLC chassis that aggregate digital and analog I/O onto an Ethernet backplane often used the MC68EN360VR33L as the central MPU. The CPU32+ runs ladder-logic interpreters while the QUICC engine manages serial field-bus (Modbus RTU, PROFIBUS-DP) and the 'EN' Ethernet MAC uplinks the PLC to the plant network. The -40C to +85C industrial temperature rating supports cabinet-mounted deployment.
Recomendado
Legacy Telecom Line Card
Telecom line cards for T1/E1 aggregation used the MC68EN360VR33L's four SCCs as T1/E1 framer-host interfaces plus the integrated Ethernet for backplane communication. The 33 MHz CPU32+ handles per-channel provisioning while the QUICC engine maintains link-layer framing at 2.048 Mbps per E1 channel. The 357-PBGA is well-suited to the high-density backplane geometry typical of central-office line cards.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC68EN360VR33L — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC68EN360VR25L | MC68EN360VR40L | MC68EN360CVR33L | MC68360VR33L | MC68EN360ZQ33L |
|---|---|---|---|---|---|---|
| Package | 357-PBGA 25x25 mm plastic ('VR') | 357-PBGA 25x25 mm plastic ('VR') - same | 357-PBGA 25x25 mm plastic ('VR') - same | 357-PBGA 25x25 mm plastic ('VR') - same | 357-PBGA 25x25 mm plastic ('VR') - same | 357-BGA ceramic ('ZQ') - same ball map, different mechanical |
| Brand | NXP Semiconductors (formerly Motorola/Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Architecture | CPU32+ (M68k compatible) + QUICC RISC engine | CPU32+ + QUICC RISC engine | CPU32+ + QUICC RISC engine | CPU32+ + QUICC RISC engine | CPU32+ + QUICC RISC engine | CPU32+ + QUICC RISC engine |
| Operating Frequency | 33 MHz | 25 MHz (-24%) | 40 MHz (+21%) | 33 MHz (same) | 33 MHz (same) | 33 MHz (same) |
| Integrated Ethernet MAC | Yes (10/100, MII) | Yes (10/100, MII) | Yes (10/100, MII) | Yes (10/100, MII) | No (requires external controller) | Yes (10/100, MII) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Lifecycle Status | EOL (Discontinuance Notice issued) | EOL | EOL | EOL | EOL | EOL |
| RoHS / Lead Free | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant | Lead Free / RoHS Compliant |
Diferenciadores clave
- Integrated 10/100 Ethernet MAC plus four SCCs on a single die (frente a MC68360VR33L)
- Plastic BGA reduces cost vs ceramic variant (frente a MC68EN360ZQ33L)
- Higher frequency variant exists in same package (frente a MC68EN360VR40L)
Notas de diseño
Allocate 25x25 mm board area for the 357-PBGA and use a 4-layer PCB stack-up with a continuous ground plane directly beneath the package. Per the Freescale/NXP QUICC hardware-design checklist, the 1.27 mm-pitch BGA requires 0.6 mm via-pad-diameter microvias with 0.2 mm-diameter plated-through-holes for reliable second-layer fan-out. Ensure the keepout zone beneath the package contains no signal traces crossing the thermal pad region.
Decouple every VCC ball with a 0.1 uF ceramic capacitor placed within 5 mm of the ball, plus a single 10 uF tantalum or ceramic bulk capacitor per VCC domain. The MC68EN360VR33L draws roughly 600-700 mA at 33 MHz / 5 V per Freescale power-budget data, so the 5 V rail must be rated for 1 A continuous. Power-rail sequencing per datasheet: VCC must rise monotonically within the 5 V +/- 5% spec.
Do not confuse the 'VR' plastic BGA with the 'ZQ' ceramic BGA when substituting - both are 357-ball but have different thermal-expansion coefficients and may not share identical land patterns in all footprints. Verify all unused balls are tied per datasheet 'no-connect' guidance; do not assume any unconnected BGA ball is truly floating as some serve as thermal-return paths. When migrating from MC68360VR33L (no Ethernet) to MC68EN360VR33L, ensure the Ethernet MAC firmware and MII pins are configured in software.
Estimated: at 33 MHz, 5 V supply, the MC68EN360VR33L dissipates approximately 2.5-3.0 W internally (based on Freescale power-budget guidance for 0.57 um CMOS). The 25x25 mm plastic PBGA relies heavily on PCB copper for heat spreading; design with at least 1 square inch of unbroken ground plane beneath the package, and consider thermal vias (0.3 mm pitch array) to the internal ground plane. For -40C to +85C operation, derate to 25 MHz or 30 MHz for high-ambient enclosures.
The MII Ethernet bus runs at 25 MHz (10/100) and requires 50-ohm controlled-impedance routing with matched-length traces (within 150 mil). According to Freescale QUICC reference designs, place the PHY within 50 mm of the MII pins to avoid reflection and ringing. Series-terminate the MII_TXCLK and RXCLK lines at the source. Keep parallel-port and DRAM bus traces short and impedance-matched to avoid corrupting DMA transfers.
Información de cumplimiento
RoHS Compliant and Lead Free per DigiKey product description and Freescale/NXP datasheet. REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified web data and are listed as 'unknown'. AEC-Q100 not applicable - this is an MPU for industrial/commercial use, not an automotive-qualified part.
