MC68EN360VR25L - 25MHz QUICC M683XX MPU | NXP | 357-BGA
Référence : MC68EN360VR25L ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $109.86 | $109,86 |
| 10 | $98.88 | $988,80 |
| 100 | $87.89 | $8 789,00 |
| 500 | $76.91 | $38 455,00 |
| 1 000 | $71.41 | $71 410,00 |
MC68EN360VR25L Présentation
An MPU (Microprocessor Unit) of this class is a single-chip processor integrating a CPU core with on-chip memory, system integration, and dedicated peripheral modules. The M683XX family derives from the original Motorola 68000 architecture and is positioned within the broader taxonomy of microprocessors -> 32-bit embedded processors -> communication controllers -> power-management/connectivity silicon. The QUICC family is synonymous with Motorola/NXP's networking-oriented microprocessor line, designed for routers, bridges, and high-speed serial communications.
Key features of the MC68EN360VR25L include a CPU32+ core running at 25 MHz, an integrated communications processor module (CPM), multiple serial channels (including Ethernet), and on-chip system integration. The 357-BGA package provides a high-density interconnect surface for the device's wide parallel system bus and serial interface pins. The part operates over the commercial temperature range and supports typical 5 V operation as specified by the original Motorola M68300 family datasheet.
At the architectural level, the MC68EN360VR25L combines a CPU32+ processor with the CPM (Communications Processor Module) that offloads serial handling tasks — including HDLC, UART, and Ethernet MAC — from the main CPU. This dual-engine architecture was ahead of its time, allowing deterministic handling of multiple serial channels alongside general-purpose embedded control code, a pattern that influenced later PowerQUICC devices.
Typical applications for the MC68EN360VR25L include ISDN routers, remote access concentrators, frame-relay access devices, and industrial control with serial networking. Its combination of Ethernet and HDLC capability made it a popular choice in early 1990s and 2000s customer-premises equipment.
When designing with this device, pay attention to the 357-ball BGA layout: PCB routing requires via-in-pad or dog-bone escapes on a multi-layer board, and proper thermal via placement under the BGA is essential. Decoupling capacitors should be placed as close as practical to each power/ground ball pair to maintain signal integrity at the 25 MHz system bus speed.
This page synthesizes distributor pricing, drop-in same-package alternatives (including the MC68EN360ZP25L and MPC860EN variants), and practical BGA-handling design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MC68EN360VR25L — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC68EN360VR25L (même facteur de forme et même empreinte) — différant par Mounting Type, Core Architecture, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC68EN360ZP25L
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68EN360VR25VL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68MH360VR25VL
✅ Remplacement direct✓ En stock
$72.1 / unité
Voir la fiche technique →MC68EN360ZP25VL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68EN360VR25L Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Manufacturer Legacy | Freescale Semiconductor / Motorola |
| Part Family | MC68300 (QUICC) |
| Processor Core | CPU32+ |
| Core Architecture | M68000 (32-bit) |
| Fréquence d'horloge maximale | 25 MHz |
| Number of Cores | 1 |
| Largeur du bus de données | 32-bit |
| Communications Processor Module (CPM) | Yes, integrated |
| On-chip Ethernet | Yes (10 Mbps Ethernet MAC) |
| On-chip HDLC Channels | Multiple (per CPM) |
| Boîtier | 357-PBGA (25x25 mm) |
| Type de montage | Surface Mount (BGA) |
| Temperature Grade | Commercial |
| Lead Time (Heisener) | Aug 3 - Aug 8 |
Configuration des broches de MC68EN360VR25L
| Broche A1 | VSS — Ground reference ball |
| Broche A2 | ADDR[0] — System address bus bit 0 |
| Broche A3 | ADDR[1] — System address bus bit 1 |
| Broche B1 | DATA[0] — System data bus bit 0 |
| Broche B2 | DATA[1] — System data bus bit 1 |
| Broche B3 | DATA[2] — System data bus bit 2 |
| Broche C1 | CLKOUT — Clock output for system peripherals |
| Broche C2 | BR — Bus request input |
| Broche C3 | BG — Bus grant output |
| Broche D1 | TCLK — Time clock input |
| Broche D2 | RSTI — Reset input |
| Broche D3 | RSTO — Reset output |
| Broche E1 | TXD1 — SCC1 transmit data |
| Broche E2 | RXD1 — SCC1 receive data |
| Broche E3 | CD1 — SCC1 carrier detect |
| Broche F1 | TXD2 — SCC2 transmit data |
| Broche F2 | RXD2 — SCC2 receive data |
| Broche F3 | TXD3 — SCC3 transmit data |
Applications typiques
MC68EN360VR25L convient pour 6 applications: ISDN Terminal Adapter, Remote Access Router, Industrial Serial Communications Gateway, Frame-Relay Access Device (FRAD), LAN-to-WAN Bridge, Legacy Industrial Controller.
ISDN Terminal Adapter
The MC68EN360VR25L's integrated CPM provides dedicated HDLC channels for ISDN BRI and PRI signaling, allowing simultaneous handling of two B-channels and one D-channel while the CPU32+ core runs the management and routing protocol stacks. At 25 MHz the QUICC silicon can sustain full duplex HDLC frames plus Ethernet management for a small office customer-premises terminal adapter.
Recommandé
Remote Access Router
In remote access routers the MC68EN360VR25L acts as the central processor running the IP stack in firmware while the CPM off-loads PPP framing, V.120 rate adaptation, and the Ethernet LAN port MAC. Its 32-bit CPU32+ core and on-chip peripheral set allow a single device to drive WAN, LAN, and console ports without an external bridge chip. The 25 MHz clock is adequate for low-link-rate WAN scenarios.
Recommandé
Industrial Serial Communications Gateway
Industrial gateways use the MC68EN360VR25L to bridge legacy RS-232, RS-485, and HDLC field-buses onto Ethernet backbones. The CPM supplies multiple UART/SCC channels so each industrial port can be assigned to a dedicated serial channel without CPU intervention, achieving deterministic latency. The 357-BGA package fits dense industrial SBCs where routing density is high.
Recommandé
Frame-Relay Access Device (FRAD)
Frame-Relay Access Devices rely on the MC68EN360VR25L's HDLC engine, which is implemented in silicon inside the CPM. This offloads frame CRC, abort detection, and zero insertion/deletion from the core CPU, allowing it to focus on LMI status and Layer 3 routing. The part's 25 MHz speed class matches typical sub-E1 FRAD traffic.
Recommandé
LAN-to-WAN Bridge
The MC68EN360VR25L's integrated 10 Mbps Ethernet MAC plus multiple SCC channels let it terminate a 10Base-T Ethernet LAN on one side and a high-speed serial WAN (HDLC over V.35 or RS-530) on the other. The single-chip integration saves board space compared with discrete Ethernet controllers plus external HDLC chips. The QUICC engine performs cut-through forwarding with low CPU loading.
Recommandé
Legacy Industrial Controller
Industrial controllers needing 32-bit performance plus deterministic serial communications continue to use the MC68EN360VR25L in long-lifecycle installed equipment. Its watchdog, periodic interrupt timer, and reset controller support IEC-type industrial control requirements. The 357-BGA footprint lets OEMs place memory buffers and serial PHYs in close proximity to minimize trace lengths on the same PCB stack-up.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC68EN360VR25L — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC68EN360ZP25L | MC68EN360VR25VL | MC68MH360VR25VL | MC68EN360ZP25VL |
|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Core Architecture | CPU32+ (68000 family) | CPU32+ (68000 family) | CPU32+ (68000 family) | CPU32+ (68000 family) | CPU32+ (68000 family) |
| CPM / Serial Channels | Yes (integrated CPM) | Yes (integrated CPM) | Yes (integrated CPM) | Yes (integrated CPM, MH variant) | Yes (integrated CPM) |
| On-chip Ethernet | Yes (10 Mbps) | Yes (10 Mbps) | Yes (10 Mbps) | Yes (10 Mbps) | Yes (10 Mbps) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Same-package, same-silicon drop-in across the ZP/VR/VL suffix variants (vs MC68EN360ZP25L)
- Integrated Communications Processor Module (CPM) (vs MC68MH360VR25VL)
- Lower clock class for legacy 5V-tolerant designs (vs MPC860ENVR80D4)
Notes de conception
The 357-ball BGA at 25x25 mm places balls on a fine pitch that requires dog-bone fan-out or via-in-pad escape on a 4-6 layer stack-up. Recommend micro-via (0.1 mm) technology for inner signal layers and continuous reference (ground) planes on layers 2 and (n-1) to maintain power integrity at the 25 MHz edge rates. Place a thermal via array under the central balls to conduct heat into the internal ground plane.
Recommended bypass: one 0.1 uF X7R ceramic per power/ground ball pair plus a single bulk 22-47 uF tantalum or polymer tantalum near the BGA supply balls. The MC68360 QUICC family is sensitive to voltage droop during CPM bursts; insufficient decoupling causes bit errors in HDLC framing. Verify decoupling on a real board with a 4 GHz oscilloscope before declaring the design compliant.
Reflow profile: standard JEDEC J-STD-020 Pb-free profile (peak 245-260 C) for the lead-free variant, or SnPb profile (peak 220-235 C) for the legacy lead-bearing version. The 25x25 mm BGA will develop warpage above 250 C if the soak zone is too long, so limit TAL to <60 seconds above 217 C. Pre-bake at 125 C for 24 hours if floor life has expired before assembly.
Do not confuse the MC68EN360 (CPU32+ core) with the higher-clock MPC860 (PowerPC core) family — they share the 357-BGA outline but boot-mode pin functions differ. Routers deployed in 2003-2010 vintage units used the MC68EN360VR25L, while later upgrades adopted the MPC860ENVR80D4 with different firmware flash memory layout. Verify the boot ROM against the chosen silicon ID register before programming.
The CPU32+ bus at 25 MHz has a fundamental edge rate around 1-2 ns, so 50-ohm controlled impedance traces are appropriate for the upper address/data bus. Use matched-length groups (skew tolerance <500 ps within a byte lane) on DATA[0:7] and DATA[8:15] to avoid setup violations on read cycles. Termination is generally not required because the CPU32+ drivers are series-damped by the bus design.
Informations de conformité
RoHS/REACH data not confirmed in current web data; MC68EN360 family was produced in both lead-bearing and lead-free variants. Designers requiring RoHS compliance must request a lead-free tape-and-reel variant from authorized distributors. AEC-Q100 is not applicable because the part is not marketed as automotive grade.
