MC7447AVS1167NB - PowerPC G4 MPU 1.167GHz 360-FCCLGA | NXP
N.º de pieza: MC7447AVS1167NB ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $242 | $24.200,00 |
| 500 | $215 | $107.500,00 |
| 1.000 | $189.5 | $189.500,00 |
MC7447AVS1167NB Descripción general
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions stored in external memory; within the broader IC taxonomy it sits above microcontrollers (which integrate memory and peripherals), and is a subcategory of processors that falls under digital logic ICs and ultimately semiconductor devices. The PowerPC G4 architecture adds AltiVec/VMX SIMD execution units on top of the standard PowerPC ISA, accelerating vector, DSP, and media workloads.
Key features of the MC7447AVS1167NB include a 1.167 GHz clock frequency, 32 KB L1 instruction cache, 32 KB L1 data cache, and a unified 512 KB on-chip L2 cache. The device integrates a 64-bit FSB (front-side bus) interface, dual on-chip PLL clock multipliers, and dedicated thermal management pins. The MPC7447A core is built on a 0.13 µm CMOS process, supporting core voltages around 1.3 V with separate I/O voltage rails.
Architecturally, the MC7447AVS1167NB implements a 7-stage super-scalar pipeline with out-of-order execution, branch prediction, and dedicated AltiVec vector execution units operating on 128-bit operands. This positions it well above ARM9-class devices for floating-point and signal-processing benchmarks, while the 1.167 GHz internal clock is derived from an external bus clock that is multiplied internally.
Typical applications include high-performance embedded routers, network switches, RAID storage controllers, industrial imaging platforms, and aerospace/defense signal processing subsystems that require deterministic vector DSP throughput in a fanless thermal envelope.
When designing with this part, ensure the PCB implements the full 360-ball FCCLGA land pattern with controlled-impedance FSB traces, and follow NXP's thermal-application note for heatsink interface and junction-temperature budgeting. This page synthesizes distributor pricing, drop-in MPC7447A family variants, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MC7447AVS1167NB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC7447AVS1167NB (mismo factor de forma y huella) — difiere en Core Architecture, Process Technology, Package, L1 Instruction Cache, L2 Cache.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC7447AVU1167NB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7447AHX1167NB
✓ En stock
$198.5 / unidad
Ver hoja de datos →MC7447AVU1267LB
✅ Sustitución directa✓ En stock
$68.5 / unidad
Ver hoja de datos →MC7447AHX867NB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7447AVS1167ND
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7447AVS1167NB Valores máximos y características eléctricas
| Core Architecture | PowerPC G4 (MPC7447A) |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Instruction Set | PowerPC with AltiVec/VMX SIMD |
| Frecuencia de reloj máxima | 1.167 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 512 KB (unified, on-chip) |
| Front-Side Bus Width | 64-bit MPX bus |
| Process Technology | 0.13 um CMOS |
| Operating Voltage - Core | 1.3 V (typical) |
| Operating Voltage - I/O | 1.8 V / 2.5 V |
| Temperatura de funcionamiento | 0C to +105C |
| Encapsulado | 360-FCCLGA (25 x 25 mm) |
| Tipo de montaje | Surface Mount (flip-chip BGA) |
Guía de configuración de pines de MC7447AVS1167NB 360-fcclga (25 x 25 mm)
Configuración de pines para MC7447AVS1167NB (encapsulado 360-fcclga (25 x 25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC7447AVS1167NB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC7447AVS1167NB es adecuado para 6 aplicacións: High-Performance Network Routing, RAID Storage Controllers, Industrial Imaging Platforms, Aerospace/Defense Signal Processing, Medical Imaging Acceleration, Test and Measurement Instrumentation.
High-Performance Network Routing
The MC7447AVS1167NB's 1.167 GHz PowerPC G4 core with AltiVec/VMX SIMD is well-matched to network-router data-plane workloads that require fast packet-header parsing and bulk crypto/CRC throughput. The MPC7447A series has a long history in Cisco and Juniper carrier-grade routers; placing the device on a 64-bit MPX bus with a network processor companion allows >1 Gbps forwarding rates. Unlike a soft-core SoC solution, the MC7447AVS1167NB delivers deterministic per-packet latency at industrial temperatures. The integrated 512 KB L2 cache reduces external memory accesses for routing-table lookups, lowering overall system power.
Recomendado
RAID Storage Controllers
Storage array controllers benefit from the MC7447AVS1167NB's 1.167 GHz vector throughput when running XOR parity computation and Reed-Solomon erasure coding. AltiVec SIMD accelerates 128-bit XOR operations natively; the 64-bit FSB streams RAID stripe data from SAS/SATA controllers with low stall overhead. Compared with ARM9-based RAID ASICs, the MC7447AVS1167NB sustains 2-3x the IOPS for 6 Gbps SATA channels. The 360-FCCLGA package provides robust thermal coupling to the chassis-level heatsink required for sustained parity rebuild workloads.
Recomendado
Industrial Imaging Platforms
Machine-vision and industrial imaging systems rely on the MC7447AVS1167NB's SIMD units to run real-time convolution kernels and color-space conversions at line-rate. The 1.167 GHz clock and 32 KB L1 data cache deliver predictable per-pixel throughput for GigE Vision streams. Industrial temperature-grade FCCLGA packaging (where 'NB' bin may apply) supports operation in factory-floor enclosures. Designers should note that vector code in AltiVec intrinsics typically yields 4-8x speedups over scalar C for image processing, justifying the higher unit cost vs an MCU-based design.
Recomendado
Aerospace/Defense Signal Processing
Aerospace and defense subsystems have long relied on the MC7447AVS1167NB's radiation-tolerant behavior and AltiVec DSP throughput for radar, SIGINT, and electronic-warfare preprocessing. The extended temperature grade and ceramic FCCLGA package offer rugged mechanical properties required for avionics LRUs. PowerPC ISA continuity preserves mission-critical software stacks (VxWorks, LynxOS-178) certified for DO-178C contexts. Modern defense designs often pair this part with FPGA front-ends for RF digitizer pipelines.
Recomendado
Medical Imaging Acceleration
The MC7447AVS1167NB can serve as a co-processor in ultrasound and CT imaging systems, where the AltiVec units accelerate beamforming and tomographic reconstruction kernels. The 1.167 GHz clock in the MPC7447A family is sufficient for low-to-mid-tier cart-based ultrasound beamformers; its deterministic instruction timing simplifies FDA 510(k) verification. The 64-bit MPX bus interfaces cleanly to DDR-era memory controllers for high-bandwidth frame transfer.
Recomendado
Test and Measurement Instrumentation
Test gear such as oscilloscopes, logic analyzers, and protocol analyzers benefit from the MC7447AVS1167NB's ability to ingest high-speed ADC samples and run real-time FFT, eye-diagram, and protocol decode computations. AltiVec accelerates complex-IQ math for vector-signal analysis (VSA), and the 512 KB on-die L2 holds FFT windows in cache without external memory pressure. The long-lifecycle PowerPC ecosystem (compiler, RTOS, JTAG tooling) keeps long-term calibration equipment maintainable.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC7447AVS1167NB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC7447AVU1167NB | MC7447AHX1167NB | MC7447AVU1267LB | MC7447AHX867NB | MC7447AVS1167ND |
|---|---|---|---|---|---|---|
| Package | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Frequency | 1.167 GHz | 1.167 GHz | 1.167 GHz | 1.267 GHz | 867 MHz | 1.167 GHz |
| Core Architecture | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Process Technology | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS |
| Core Voltage | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Higher clock frequency within same package family (frente a MC7447AHX867NB)
- Industry-standard PowerPC software ecosystem continuity (frente a ARM Cortex-based SoCs)
- Larger L2 cache vs lower-end MPC7447A family members (frente a MPC7447A low-power variants)
Notas de diseño
Estimated: at typical 1.3 V core and 1.167 GHz, the MPC7447A core dissipates approximately 10-15 W under sustained load. A chassis-mounted heatsink with thermal interface material (TIM) and adequate airflow is required for continuous operation; for fanless enclosures, derate the clock or use the 867 MHz MPC7447AHX867NB instead. Junction temperature must remain below 105 C for industrial reliability.
The 360-ball FCCLGA requires a controlled-impedance 50-ohm microstrip/stripline stackup for the 64-bit MPX FSB traces, with matched-length tuning to within +/-50 ps. Per NXP AN-2600, place at least 8 PCB ground vias in a symmetrical pattern under the package thermal slug for heat extraction. Use a 4-6 layer board minimum to accommodate the high-density breakout and BGA fanout.
Do not confuse the MPC7447A (this part) with the MPC7448 - the latter has a different L2 cache policy and a different FSB parity scheme. When migrating to MPC7448-based MC7448THX1400ND or similar, validate that the host bridge and BIOS support the updated configuration registers. Treat RoHS status as unknown until confirmed against the specific date code label on the part reel.
Información de cumplimiento
Compliance status depends on specific date code and reel packaging; the FCCLGA ceramic package is not automatically Pb-free - request the latest NXP/legacy datasheet addendum for the exact order code suffix. The part predates the 2006 RoHS recast.
