MC7447AVS1167NB - PowerPC G4 MPU 1.167GHz 360-FCCLGA | NXP
Référence : MC7447AVS1167NB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2 685,00 |
| 100 | $242 | $24 200,00 |
| 500 | $215 | $107 500,00 |
| 1 000 | $189.5 | $189 500,00 |
MC7447AVS1167NB Présentation
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions stored in external memory; within the broader IC taxonomy it sits above microcontrollers (which integrate memory and peripherals), and is a subcategory of processors that falls under digital logic ICs and ultimately semiconductor devices. The PowerPC G4 architecture adds AltiVec/VMX SIMD execution units on top of the standard PowerPC ISA, accelerating vector, DSP, and media workloads.
Key features of the MC7447AVS1167NB include a 1.167 GHz clock frequency, 32 KB L1 instruction cache, 32 KB L1 data cache, and a unified 512 KB on-chip L2 cache. The device integrates a 64-bit FSB (front-side bus) interface, dual on-chip PLL clock multipliers, and dedicated thermal management pins. The MPC7447A core is built on a 0.13 µm CMOS process, supporting core voltages around 1.3 V with separate I/O voltage rails.
Architecturally, the MC7447AVS1167NB implements a 7-stage super-scalar pipeline with out-of-order execution, branch prediction, and dedicated AltiVec vector execution units operating on 128-bit operands. This positions it well above ARM9-class devices for floating-point and signal-processing benchmarks, while the 1.167 GHz internal clock is derived from an external bus clock that is multiplied internally.
Typical applications include high-performance embedded routers, network switches, RAID storage controllers, industrial imaging platforms, and aerospace/defense signal processing subsystems that require deterministic vector DSP throughput in a fanless thermal envelope.
When designing with this part, ensure the PCB implements the full 360-ball FCCLGA land pattern with controlled-impedance FSB traces, and follow NXP's thermal-application note for heatsink interface and junction-temperature budgeting. This page synthesizes distributor pricing, drop-in MPC7447A family variants, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MC7447AVS1167NB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC7447AVS1167NB (même facteur de forme et même empreinte) — différant par Core Architecture, Process Technology, Package, L1 Instruction Cache, L2 Cache.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC7447AVU1167NB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7447AHX1167NB
✓ En stock
$198.5 / unité
Voir la fiche technique →MC7447AVU1267LB
✅ Remplacement direct✓ En stock
$68.5 / unité
Voir la fiche technique →MC7447AHX867NB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7447AVS1167ND
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7447AVS1167NB Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC G4 (MPC7447A) |
| Number of Cores | 1 |
| Largeur du bus de données | 32-bit |
| Instruction Set | PowerPC with AltiVec/VMX SIMD |
| Fréquence d'horloge maximale | 1.167 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 512 KB (unified, on-chip) |
| Front-Side Bus Width | 64-bit MPX bus |
| Process Technology | 0.13 um CMOS |
| Operating Voltage - Core | 1.3 V (typical) |
| Operating Voltage - I/O | 1.8 V / 2.5 V |
| Température de fonctionnement | 0C to +105C |
| Boîtier | 360-FCCLGA (25 x 25 mm) |
| Type de montage | Surface Mount (flip-chip BGA) |
Guide de configuration des broches du MC7447AVS1167NB 360-fcclga (25 x 25 mm)
Configuration des broches du MC7447AVS1167NB (boîtier 360-fcclga (25 x 25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC7447AVS1167NB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC7447AVS1167NB convient pour 6 applications: High-Performance Network Routing, RAID Storage Controllers, Industrial Imaging Platforms, Aerospace/Defense Signal Processing, Medical Imaging Acceleration, Test and Measurement Instrumentation.
High-Performance Network Routing
The MC7447AVS1167NB's 1.167 GHz PowerPC G4 core with AltiVec/VMX SIMD is well-matched to network-router data-plane workloads that require fast packet-header parsing and bulk crypto/CRC throughput. The MPC7447A series has a long history in Cisco and Juniper carrier-grade routers; placing the device on a 64-bit MPX bus with a network processor companion allows >1 Gbps forwarding rates. Unlike a soft-core SoC solution, the MC7447AVS1167NB delivers deterministic per-packet latency at industrial temperatures. The integrated 512 KB L2 cache reduces external memory accesses for routing-table lookups, lowering overall system power.
Recommandé
RAID Storage Controllers
Storage array controllers benefit from the MC7447AVS1167NB's 1.167 GHz vector throughput when running XOR parity computation and Reed-Solomon erasure coding. AltiVec SIMD accelerates 128-bit XOR operations natively; the 64-bit FSB streams RAID stripe data from SAS/SATA controllers with low stall overhead. Compared with ARM9-based RAID ASICs, the MC7447AVS1167NB sustains 2-3x the IOPS for 6 Gbps SATA channels. The 360-FCCLGA package provides robust thermal coupling to the chassis-level heatsink required for sustained parity rebuild workloads.
Recommandé
Industrial Imaging Platforms
Machine-vision and industrial imaging systems rely on the MC7447AVS1167NB's SIMD units to run real-time convolution kernels and color-space conversions at line-rate. The 1.167 GHz clock and 32 KB L1 data cache deliver predictable per-pixel throughput for GigE Vision streams. Industrial temperature-grade FCCLGA packaging (where 'NB' bin may apply) supports operation in factory-floor enclosures. Designers should note that vector code in AltiVec intrinsics typically yields 4-8x speedups over scalar C for image processing, justifying the higher unit cost vs an MCU-based design.
Recommandé
Aerospace/Defense Signal Processing
Aerospace and defense subsystems have long relied on the MC7447AVS1167NB's radiation-tolerant behavior and AltiVec DSP throughput for radar, SIGINT, and electronic-warfare preprocessing. The extended temperature grade and ceramic FCCLGA package offer rugged mechanical properties required for avionics LRUs. PowerPC ISA continuity preserves mission-critical software stacks (VxWorks, LynxOS-178) certified for DO-178C contexts. Modern defense designs often pair this part with FPGA front-ends for RF digitizer pipelines.
Recommandé
Medical Imaging Acceleration
The MC7447AVS1167NB can serve as a co-processor in ultrasound and CT imaging systems, where the AltiVec units accelerate beamforming and tomographic reconstruction kernels. The 1.167 GHz clock in the MPC7447A family is sufficient for low-to-mid-tier cart-based ultrasound beamformers; its deterministic instruction timing simplifies FDA 510(k) verification. The 64-bit MPX bus interfaces cleanly to DDR-era memory controllers for high-bandwidth frame transfer.
Recommandé
Test and Measurement Instrumentation
Test gear such as oscilloscopes, logic analyzers, and protocol analyzers benefit from the MC7447AVS1167NB's ability to ingest high-speed ADC samples and run real-time FFT, eye-diagram, and protocol decode computations. AltiVec accelerates complex-IQ math for vector-signal analysis (VSA), and the 512 KB on-die L2 holds FFT windows in cache without external memory pressure. The long-lifecycle PowerPC ecosystem (compiler, RTOS, JTAG tooling) keeps long-term calibration equipment maintainable.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC7447AVS1167NB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC7447AVU1167NB | MC7447AHX1167NB | MC7447AVU1267LB | MC7447AHX867NB | MC7447AVS1167ND |
|---|---|---|---|---|---|---|
| Package | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) | 360-FCCLGA (25x25 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Frequency | 1.167 GHz | 1.167 GHz | 1.167 GHz | 1.267 GHz | 867 MHz | 1.167 GHz |
| Core Architecture | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A | PowerPC G4 MPC7447A |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Process Technology | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS |
| Core Voltage | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Higher clock frequency within same package family (vs MC7447AHX867NB)
- Industry-standard PowerPC software ecosystem continuity (vs ARM Cortex-based SoCs)
- Larger L2 cache vs lower-end MPC7447A family members (vs MPC7447A low-power variants)
Notes de conception
Estimated: at typical 1.3 V core and 1.167 GHz, the MPC7447A core dissipates approximately 10-15 W under sustained load. A chassis-mounted heatsink with thermal interface material (TIM) and adequate airflow is required for continuous operation; for fanless enclosures, derate the clock or use the 867 MHz MPC7447AHX867NB instead. Junction temperature must remain below 105 C for industrial reliability.
The 360-ball FCCLGA requires a controlled-impedance 50-ohm microstrip/stripline stackup for the 64-bit MPX FSB traces, with matched-length tuning to within +/-50 ps. Per NXP AN-2600, place at least 8 PCB ground vias in a symmetrical pattern under the package thermal slug for heat extraction. Use a 4-6 layer board minimum to accommodate the high-density breakout and BGA fanout.
Do not confuse the MPC7447A (this part) with the MPC7448 - the latter has a different L2 cache policy and a different FSB parity scheme. When migrating to MPC7448-based MC7448THX1400ND or similar, validate that the host bridge and BIOS support the updated configuration registers. Treat RoHS status as unknown until confirmed against the specific date code label on the part reel.
Informations de conformité
Compliance status depends on specific date code and reel packaging; the FCCLGA ceramic package is not automatically Pb-free - request the latest NXP/legacy datasheet addendum for the exact order code suffix. The part predates the 2006 RoHS recast.
