MC9S08GT16ACFDE - 8-bit S08 MCU 16KB Flash 40MHz | NXP
N.º de pieza: MC9S08GT16ACFDE ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.65 | $12,65 |
| 10 | $11.8 | $118,00 |
| 100 | $10.95 | $1.095,00 |
| 500 | $10.1 | $5.050,00 |
| 1.000 | $9.3 | $9.300,00 |
MC9S08GT16ACFDE Descripción general
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a processor core, program memory, data memory, and peripherals such as timers, serial interfaces, and analog-to-digital converters. In the system hierarchy, the MCU sits at the top of embedded control electronics, replacing combinations of discrete logic and analog control circuits with programmable firmware. The S08 family is NXP's (formerly Freescale Semiconductor) enhanced evolution of the classic 68HC08 architecture.
Key features of the MC9S08GT16ACFDE include the enhanced S08 core executing at up to 40MHz bus frequency, 16KB of in-system-programmable Flash allowing field firmware updates, and 2KB of on-chip RAM for runtime data. The QFN-48-EP (7x7 mm) surface-mount package with exposed pad provides good thermal and electrical performance for compact industrial boards.
Architecturally, the S08 core uses an enhanced CISC instruction set with background debugging mode (BDM), enabling non-intrusive in-circuit debugging without consuming on-chip resources. The GT family shares modules and development tooling across memory variants (GT8A, GT16A, GT32A), simplifying firmware porting when memory requirements change.
Typical applications include consumer appliance control, battery chargers, lighting control, small industrial automation nodes, and low-cost human-interface systems where 16KB of code space and moderate processing performance are sufficient.
Design consideration: this part is End of Life (EOL) per the NXP product page. New designs should evaluate the in-family drop-in alternatives below or an active successor family before committing.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MC9S08GT16ACFDE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S08GT16ACFDE (mismo factor de forma y huella) — difiere en Package, Core Processor, Lifecycle Status, Temperature Grade, Product Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S08GT32ACFDE
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MC9S08GT8ACFDE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT8AMFDE
✅ Sustitución directa✓ En stock
$3.78 / unidad
Ver hoja de datos →MC9S08GT16ACFDER
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT16CFBE
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.65 / unidad
Ver hoja de datos →MC9S08GT16ACFDE Valores máximos y características eléctricas
| Core Processor | S08 |
| Core Size | 8-Bit |
| Speed | 40 MHz |
| Flash Memory | 16 KB (16K x 8) |
| RAM Size | 2 KB |
| Encapsulado | 48-QFN-EP (7x7 mm) |
| Tipo de montaje | Surface Mount |
| Número de pines | 48 |
| Program Memory Type | FLASH |
| Estado del ciclo de vida | End of Life (EOL) |
| Family | MC9S08GT |
Guía de configuración de pines de MC9S08GT16ACFDE 48-qfn-ep (7x7 mm)
Configuración de pines para MC9S08GT16ACFDE (encapsulado 48-qfn-ep (7x7 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC9S08GT16ACFDE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC9S08GT16ACFDE es adecuado para 6 aplicacións: Consumer Appliance Control, Battery Charger and Power Management Control, Lighting Control Systems, Industrial Sensor Nodes, Human Interface and Display Control, Low-Cost Motor Control.
Consumer Appliance Control
The MC9S08GT16ACFDE fits appliance control boards such as washing machine, microwave, and small kitchen appliance controllers where the design needs a modest 40MHz 8-bit core, 16KB of code space for the control state machine, and 2KB RAM for sensor buffers. The S08 core's interrupt structure handles key scanning, display multiplexing, and relay/SSR actuation deterministically. Because the entire GT family shares modules and pinout across the QFN-48 package, appliance OEMs can scale firmware between the 8KB GT8A and 32KB GT32A on one PCB. Designers should budget flash for a bootloader reserve to enable field firmware updates in deployed units.
Recomendado
Battery Charger and Power Management Control
In smart battery chargers, the MC9S08GT16ACFDE executes charge-termination algorithms, monitors voltage/current feedback through its on-chip ADC, and drives PWM or status outputs at up to 40MHz bus speed - ample for CC/CV charging loops sampled at kHz rates. The 16KB Flash holds multi-chemistry charge profiles and safety fault logs in the 2KB RAM. The exposed-pad QFN-48 dissipates controller heat effectively inside sealed charger enclosures. Engineers should implement independent hardware watchdog supervision and keep the ADC reference decoupled from the noisy switching node to preserve measurement accuracy in flyback or buck charger topologies.
Recomendado
Lighting Control Systems
For LED driver and fluorescent ballast control, the MC9S08GT16ACFDE generates PWM dimming signals, processes dimmer-interface inputs, and manages protection sequencing (over-current, over-temperature) with its S08 core at 40MHz. The 16KB Flash accommodates DALI/1-10V style protocol stacks in compact form, while 2KB RAM buffers telemetry. Its general-purpose GT family positioning makes it a proven low-cost choice for luminaire OEMs, and pin-compatible GT8A/GT32A variants let one lamp PCB serve product tiers. Since the part is EOL, lighting designers with long product lifecycles should secure last-time-buy stock or qualify the GT32A drop-in now.
Recomendado
Industrial Sensor Nodes
Distributed factory sensor nodes - temperature, pressure, and limit-switch monitors - use the MC9S08GT16ACFDE to sample analog channels, filter readings in the 2KB RAM, and report over serial links. The 40MHz S08 core executes fixed-point averaging and threshold logic with deterministic latency, and 16KB Flash stores calibration tables and a compact communication stack. The 7x7 mm QFN-48 keeps node PCBs small for DIN-rail and machine-mounted form factors. Designers should add transient protection on field-wired I/O and verify the S08's industrial temperature grade in the datasheet against the installation environment before deployment.
Recomendado
Human Interface and Display Control
Keypad, rotary-encoder, and segment-LCD front panels benefit from the MC9S08GT16ACFDE's combination of 40MHz core speed for fast key-scan debouncing, 16KB Flash for menu logic and font tables, and abundant QFN-48 I/O for direct matrix scanning. The 2KB RAM holds display frame buffers for multiplexed segment or small dot-matrix panels. The exposed-pad package aids thermal relief in enclosed user-interface bezels. Because the GT family keeps identical pinout across memory variants, one front-panel PCB can serve base (GT8A) and feature-rich (GT32A) product lines with a single firmware codebase and different link-time memory maps.
Recomendado
Low-Cost Motor Control
Small BLDC and universal-motor drives - fans, pumps, power tools - use the MC9S08GT16ACFDE to run commutation state machines, process hall-sensor or BEMF feedback, and generate PWM outputs at the 40MHz bus rate, which supports the 16-20kHz PWM frequencies typical of quiet motor control. The 16KB Flash holds the commutation table, startup sequencer, and fault protection code; 2KB RAM handles current-loop scratch data. The GT16A suits single-shunt sensorless schemes, while the drop-in GT32A allows field-oriented control firmware expansion. Ensure gate-driver dead-time insertion in hardware, and gate PWM outputs away from the ADC sampling window to reduce switching noise.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S08GT16ACFDE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S08GT32ACFDE | MC9S08GT8ACFDE | MC9S08GT8AMFDE | MC9S08GT16ACFDER |
|---|---|---|---|---|---|
| Package | 48-QFN-EP (7x7 mm) | QFN-48 (7x7 mm, EP) - same | QFN-48 (7x7 mm, EP) - same | QFN-48 (7x7 mm, EP) - same | QFN-48 (7x7 mm, EP) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 16 KB (16K x 8) | 32 KB | 8 KB | 8 KB | 16 KB |
| Core / Speed | S08, 8-Bit, 40 MHz | S08, 8-Bit, 40 MHz | S08, 8-Bit, 40 MHz | S08, 8-Bit, 40 MHz | S08, 8-Bit, 40 MHz |
| Pins | 48 | 48 | 48 | 48 | 48 |
Diferenciadores clave
- Best flash-size balance in the GT QFN-48 family (frente a MC9S08GT8ACFDE)
- Upgrade path without PCB change (frente a MC9S08GT32ACFDE)
- Proven volume part with multi-distributor residual stock (frente a MC9S08GT16ACFDER)
Notas de diseño
The MC9S08GT16ACFDE is End of Life per the NXP product page. Before releasing any new or modified PCB using this part, verify current stock (LCSC and DigiKey showed availability as of 2026-10-18) and file a last-time-buy if production extends beyond existing inventory. Rochester Electronics offers licensed aftermarket supply for EOL Freescale/NXP parts. For greenfield designs, qualify the pin-compatible MC9S08GT32ACFDE or an active S08 successor family instead.
The 48-QFN-EP (7x7 mm) package has an exposed pad on the underside that must be soldered to a ground via array on the PCB - this is the primary thermal and ground return path. Follow NXP's QFN land-pattern recommendations: solder-mask-defined pads slightly larger than the lead tips and a thermal via array (typically 5x5) under the exposed pad connected to the ground plane. No-clean flux residue under the QFN can impair inspection; use sufficient paste with stencil apertures per IPC-7093 class guidance for bottom-termination packages.
Decouple the VDD pins with 0.1 uF ceramic capacitors placed within 2-3 mm of each supply pin, plus one bulk 4.7-10 uF capacitor near the MCU. S08 MCUs are sensitive to supply ripple during flash programming and erase operations, so ensure VDD stays within the datasheet operating range under all load transients - an under-decoupled rail is the most common cause of flash corruption reported in S08 designs. Use NXP's application notes on S08 power supply design for regulator sequencing and brown-out detector configuration.
Información de cumplimiento
Compliance data not present in the provided web data; consult the NXP product page 'Environmental Quality' section for RoHS/REACH status of this specific ordering code.