MC9S08GT32ACFDE - 40MHz 32KB 8-Bit MCU | NXP | Embedded
N.º de pieza: MC9S08GT32ACFDE ✗ Fin de vida| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
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MC9S08GT32ACFDE Descripción general
An S08 microcontroller is an 8-bit embedded controller combining a processor core, program memory, data memory, I/O, interrupts, timers, and communication peripherals on one semiconductor die. It belongs to the MCU hierarchy: microcontroller -> embedded processor -> semiconductor. The enhanced S08 instruction set supports efficient control-oriented firmware, while on-chip flash permits field-updatable application code without an external memory device.
Key verified features include a 40 MHz maximum clock, 32 KB of flash, 4 KB of RAM, 34 I/O ports, and support for up to 32 interrupt or reset sources. The 1.8 V to 3.6 V supply range accommodates low-voltage digital systems, while software-selectable input pullups support robust digital interfaces. The 48-QFN-EP package supports surface-mount assembly and uses an exposed pad for board-level thermal management.
The MCU combines conventional parallel GPIO with embedded serial and timing resources, making it suitable for control boards, human-interface systems, communication modules, and compact industrial products. Exact peripheral assignments, interrupt vectors, electrical limits, and timer details should be confirmed in the manufacturer data sheet before schematic or firmware release.
Typical uses include motor and actuator sequencing, panel controls, sensor aggregation, keypad interfaces, programmable logic controllers, and communication equipment. At 40 MHz, the device offers useful processing headroom for interrupt servicing, protocol handling, and simultaneous control tasks without requiring a higher-bit architecture.
PCB design should route the exposed thermal pad to a solderable copper plane and follow the manufacturer's land pattern, decoupling, and assembly guidance. Confirm the exact exposed-pad dimensions and pin mapping from the official package drawing; those details were not included in the supplied search extracts.
This page consolidates NXP lifecycle information, distributor specifications, available sourcing links, and drop-in replacement research. It distinguishes verified facts from unverified package, pin-level, pricing, and compliance details so engineers can make an informed sourcing decision.
Alternativas directas para MC9S08GT32ACFDE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S08GT32ACFDE (mismo factor de forma y huella) — difiere en Package, Flash Memory, Lifecycle Status, Core Processor, Instruction Set.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S08GT32CFDE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT32ACFBE
✅ Sustitución directa✓ En stock
$2.75 / unidad
Ver hoja de datos →MC9S08GT60ACFDER
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT32ACFDE Valores máximos y características eléctricas
| Product Type | 8-bit general-purpose microcontroller |
| Processor Family | S08 |
| Maximum Clock Speed | 40 MHz |
| Flash Memory | 32 KB |
| RAM | 4 KB |
| Supply Voltage Range | 1.8 V to 3.6 V |
| I/O Ports | 34 |
| Interrupt and Reset Sources | Up to 32 sources |
| Architecture | Enhanced 8-bit S08 core |
| Program Memory Type | Flash |
| Encapsulado | 48-pin QFN with exposed pad |
| Package Family | QFN |
| Tipo de montaje | Surface mount |
| Nominal Rail | 2.5 V or 3.3 V |
| Estado del ciclo de vida | NRND |
Guía de configuración de pines de MC9S08GT32ACFDE qfn
Configuración de pines para MC9S08GT32ACFDE (encapsulado qfn). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC9S08GT32ACFDE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC9S08GT32ACFDE es adecuado para 6 aplicacións: Compact Industrial Control Board, Human-Interface and Panel Control, Sensor Aggregation and Conditioning, Motor Sequencing and Actuator Control, Programmable Communication Gateway, Battery-Powered Monitoring Device.
Compact Industrial Control Board
The MC9S08GT32ACFDE fits compact industrial-control logic because its verified 40 MHz S08 core provides processing margin for interrupt-driven tasks, while 32 KB of flash holds application code and 4 KB of RAM supports state variables and communication buffers. Its 34 I/O ports can distribute digital control and status signals without requiring a larger package. The 1.8 V to 3.6 V operating range also supports low-voltage industrial peripherals, subject to individual pin limits. Before schematic release, verify the exact peripheral assignments, pin types, timing ratings, and exposed-pad net from the official NXP documentation. Because the device is NRND, production use should include lifecycle monitoring and a reviewed second source rather than an unverified automatic substitution.
Recomendado
Human-Interface and Panel Control
For keypads, status indicators, and local operator panels, the MC9S08GT32ACFDE combines 34 I/O ports with a 40 MHz core and 4 KB of RAM. The I/O count can support buttons, LEDs, and multiple discrete control lines, while software-selectable input pullups can simplify passive switch inputs when the selected ports provide that feature. The 32 KB flash capacity is sufficient for compact menu logic, debounce routines, and event handling. Designers should still budget code and RAM for the actual protocol stack and user interface. Validate signal polarity, pin muxing, electrical limits, and interrupt sources against the manufacturer data sheet; the search excerpts confirm the aggregate I/O count but do not enumerate every peripheral function by pin.
Recomendado
Sensor Aggregation and Conditioning
The MC9S08GT32ACFDE can serve as the central controller in a small sensor node that must sample switches, condition digital inputs, and coordinate measurements. Its 34 I/O ports offer substantial parallel connectivity, while the 40 MHz S08 core can service interrupts and protocol transactions concurrently with the measurement task. The 1.8 V to 3.6 V supply range simplifies integration with compatible low-voltage sensors. Firmware should include filtering, timeout handling, calibration storage, and fault reporting rather than relying on raw sensor values. Before release, confirm the required analog functions, ADC availability, communication peripherals, and pin multiplex details in the official data sheet because those specifications were not present in the supplied search excerpts.
Recomendado
Motor Sequencing and Actuator Control
For relay, valve, stepper-sequencing, or actuator-control subsystems, the MC9S08GT32ACFDE offers a 40 MHz control core, 32 KB flash, and 4 KB RAM for state machines, timing, and diagnostics. Its 34 I/O ports can be allocated across command outputs, position inputs, and status feedback. The design must account for inductive loads, motor-driver transients, protection networks, and safe defaults because the MCU itself is not a power stage. Use timers and interrupts for deterministic sequencing where supported, and isolate noisy motor buses from sensitive signal paths. Exact timer channels, drive strengths, and electrical limits require confirmation from the NXP data sheet, while an NRND lifecycle classification calls for careful long-term sourcing review.
Recomendado
Programmable Communication Gateway
The MC9S08GT32ACFDE is a candidate for protocol bridging or a low-speed embedded communications node because the 40 MHz core can handle framing, timers, and state management while 32 KB of flash stores firmware. Available I/O can support status indicators, configuration lines, and a serial interface after the exact multiplexing is confirmed. The design should define protocol timeouts, CRC handling, buffer limits, and recovery behavior so that partial reception cannot lock up the controller. If firmware references memory addresses, interrupt vectors, or peripheral registers associated with another MCU, binary compatibility must be established rather than inferred from the shared S08 name. The NRND status should be raised with product management because future availability may depend on last-time-buy or approved ongoing-use decisions.
Recomendado
Battery-Powered Monitoring Device
For a battery-powered monitor or simple environmental-control node, the MC9S08GT32ACFDE's 1.8 V minimum listed operating voltage enables integration with low-voltage digital rails, while 32 KB flash and 4 KB RAM support compact application code. Its GPIO resources can monitor switches or digital sensors and drive low-current status paths. A sleep-mode power budget, regulator efficiency, and battery-discharge analysis are required because the verified search data does not provide active or standby current. Firmware should use the lowest safe clock and bus settings during idle periods, then wake through supported interrupt sources. Validate brownout behavior, I/O retention, and low-voltage limits directly from the manufacturer data sheet before defining battery endurance.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S08GT32ACFDE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S08GT32CFDE | MC9S08GT32ACFBE | MC9S08GT60ACFDER |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
Diferenciadores clave
- Higher verified clock speed than the identified GT60 comparison candidate (frente a MC9S08GT60ACFDER)
- Direct manufacturer product record (frente a MC9S08GT32CFDE)
- Verified memory configuration for compact embedded firmware (frente a MC9S08GT60ACFDER)
Notas de diseño
Use the official NXP 48-QFN exposed-pad drawing for land pattern, solder-mask clearance, and exposed-pad connection. The search excerpts confirm an exposed-pad package but do not identify the pad net; never assume it is ground or VDD. Confirm pin 1 orientation and paste pattern during schematic and PCB review, then use the manufacturer's assembly guidance to avoid solder bridging between the QFN leads and central pad.
Design the supply rail to remain inside the verified 1.8 V to 3.6 V device range under startup, load transients, and temperature. Place required bypass capacitors at the device power pins according to the manufacturer layout guidance. Exact capacitance, ESR, current limits, and sequencing requirements were not supplied and must be taken from the official data sheet rather than inferred from general MCU practice.
Do not approve MC9S08GT32CFDE, MC9S08GT32ACFBE, or MC9S08GT60ACFDER solely because their names and packages appear similar. MC9S08GT60ACFDER is listed at 20 MHz versus 40 MHz for the target, while the other candidates lack verified pin and electrical comparisons. For an MCU replacement, check the complete pin table, memory map, peripheral muxing, interrupt vectors, clock tree, supply limits, temperature grade, toolchain support, and exposed-pad connection.
The exposed pad is an important thermal and electrical feature of the QFN package, but the supplied data does not provide the pad area, thermal resistance, or maximum power dissipation. Use the official package information to size the pad and copper pour. Estimated: if device power dissipation is P watts and junction-to-ambient thermal resistance is theta_JA, the approximate rise is P multiplied by theta_JA; no numerical estimate is made because those inputs are unavailable.
Información de cumplimiento
The supplied search excerpts mention environmental-quality information on NXP but provide no explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements.
