MC9S08GT16AMFDE - 8-bit S08 MCU, 16KB Flash, 40MHz, QFN-48 | NXP
N.º de pieza: MC9S08GT16AMFDE ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MC9S08GT16AMFDE Descripción general
An 8-bit microcontroller is an integrated circuit that contains a processor core, memory, and peripherals on a single chip, executing one byte of data per instruction cycle. Within the power-management and embedded-control hierarchy, the MC9S08GT16A belongs to the MC9S08GT family of cost-effective, high-performance S08 general-purpose MCUs from NXP (formerly Freescale Semiconductor), positioned above smaller 8K devices and below larger 32K/60K family members.
Key features include the 40 MHz HCS08 CPU with HC08 instruction set compatibility plus an added BGND instruction, support for up to 32 interrupt/reset sources, software-selectable pullups on ports when used as inputs, and a wide 1.8V to 3.6V single-supply operating range. The 16 KB Flash supports in-application reprogramming, and the 48-QFN-EP package with exposed pad provides good thermal and grounding performance in a compact 7x7 mm footprint.
Architecturally, the S08 core is an enhanced derivative of the HC08 core, offering backward code compatibility while improving interrupt handling and adding debug instructions. The device integrates Flash, RAM, and standard S08 peripheral modules on a single die, reducing system BOM count for cost-sensitive embedded designs. The automotive temperature grade (per Partstack package data: HVQCCN square no-lead package) extends use into harsher environments.
Typical applications include automotive body electronics and accessories, industrial control panels, consumer appliance control, low-cost motor control, and system monitoring where an 8-bit MCU with modest Flash (16 KB) is sufficient.
When designing with this device, plan the supply network for the 1.8V to 3.6V range and verify Flash density against code growth, since 16 KB is fixed per orderable part number. The exposed pad should be soldered to a ground pour for best electrical and thermal performance.
This page synthesizes distributor stock data, cross-reference comparisons, drop-in alternatives, and practical design guidance not found in any single datasheet or distributor listing.
Alternativas directas para MC9S08GT16AMFDE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S08GT16AMFDE (mismo factor de forma y huella) — difiere en Package, Core Processor, Temperature Grade, RAM Size, Maximum Clock Frequency.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S08GT16ACFDE
✅ Sustitución directa✓ En stock
$9.3 / unidad
Ver hoja de datos →MC9S08GT16ACFDER
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT16CFBE
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.65 / unidad
Ver hoja de datos →MC9S08GT16AMFDE Valores máximos y características eléctricas
| Core Processor | S08 (HCS08) 8-bit |
| Core Size | 8-bit |
| Frecuencia de reloj máxima | 40 MHz |
| Flash Memory | 16 KB (16K x 8) |
| RAM Size | 2 KB |
| Supply Voltage Range | 1.8 V to 3.6 V |
| I/O Ports | 34 |
| Interrupt/Reset Sources | Up to 32 |
| Instruction Set | HC08-compatible with added BGND instruction |
| Pullups | Software selectable on ports when used as inputs |
| Encapsulado | 48-VFQFN Exposed Pad (7x7 mm), HVQCCN |
| Tipo de montaje | Surface Mount |
| Terminal Form | No Lead |
| Temperature Grade | Automotive (per distributor package data) |
| Estado del ciclo de vida | Active |
Guía de configuración de pines de MC9S08GT16AMFDE 48-vfqfn exposed pad (7x7 mm), hvqccn
Configuración de pines para MC9S08GT16AMFDE (encapsulado 48-vfqfn exposed pad (7x7 mm), hvqccn). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC9S08GT16AMFDE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC9S08GT16AMFDE es adecuado para 6 aplicacións: Automotive Body Electronics, Industrial Control Panels, Home Appliance Control, Low-Cost Motor Control, System Monitoring and Telemetry, Legacy HC08/S08 System Continuity.
Automotive Body Electronics
The MC9S08GT16AMFDE fits automotive body-control functions such as door modules, seat controllers, lighting switches, and mirror control because distributor package data classifies it with an automotive temperature grade, and its 34 software-pullup I/O lines directly interface switches, relays, and lamp drivers without external pull resistors. In a typical design the MCU runs from a regulated 3.3V or 5V-derived supply within its 1.8V to 3.6V range (use a pre-regulator for 5V rails), monitors switch inputs via the internal pullups, and drives loads through high-side drivers or relays. The 40 MHz S08 core delivers enough headroom for LIN-style polling loops and diagnostic routines, while 16 KB Flash stores application code plus calibration data. The 48-QFN-EP exposed pad gives a low-impedance ground that helps EMC performance, which is critical in the electrically noisy automotive environment.
Recomendado
Industrial Control Panels
In industrial control panels, the MC9S08GT16AMFDE serves as a low-cost logic controller for sequence control, interlock monitoring, and operator interface scanning. Its 40 MHz HCS08 core executes HC08-compatible code, letting teams reuse proven HC08 firmware, and the added BGND instruction supports background debugging during commissioning. The 1.8V to 3.6V supply range allows operation directly from a 3.3V rail, while 34 I/O with software-selectable pullups handle pushbuttons, limit switches, and relay-driving outputs with minimal external parts. The 16 KB Flash supports in-system reprogramming for field updates of control logic, and up to 32 interrupt/reset sources allow responsive handling of safety interlocks. The 7x7 mm 48-QFN-EP package with exposed ground pad aids thermal dissipation and noise immunity inside enclosures containing contactors and switching power supplies.
Recomendado
Home Appliance Control
Appliance control boards for washers, dishwashers, fans, and small cooking appliances benefit from the MC9S08GT16AMFDE's combination of adequate Flash (16 KB) and generous I/O (34 lines) at an economical 8-bit price point. The MCU scans a membrane keypad using internal pullups, drives LEDs and buzzer outputs, and sequences motor relays or triac drivers according to cycle state machines stored in Flash. The 40 MHz internal clock supports timing-critical zero-cross detection for triac phase control. Because the 48-QFN-EP package is leadless (HVQCCN, 7x7 mm), it assembles reliably on standard reflow lines and its exposed pad anchors ground for noisy motor-switching environments. The 1.8V to 3.6V operating range allows a simple shunt or linear pre-regulator from the appliance's 5V standby rail, keeping the power bill of materials minimal.
Recomendado
Low-Cost Motor Control
For fan, pump, and small BLDC or brushed-DC motor applications, the MC9S08GT16AMFDE provides the timing resources of the 40 MHz S08 bus to generate PWM outputs and execute commutation or speed-loop software. The 34 I/O include timer-capable pins for PWM generation and hall-sensor or tachometer input capture; up to 32 interrupt/reset sources ensure fast response to commutation events. Firmware fits comfortably in 16 KB Flash with room for protection routines such as overcurrent and stall detection. The 2 KB RAM supports modest control-loop variables and filtering buffers. Operating from 1.8V to 3.6V, the MCU interfaces directly with gate-driver ICs level-shifted to the motor rail. The exposed-pad QFN-48 package dissipates controller heat into the PCB ground plane, which matters inside sealed motor housings with limited airflow.
Recomendado
System Monitoring and Telemetry
The MC9S08GT16AMFDE is well suited to board-level monitoring tasks such as temperature, voltage, and door/enclosure status polling, then reporting over a simple serial link. The S08 core at 40 MHz handles sensor polling schedules and checksummed message framing with ease, while 16 KB Flash retains configuration tables and event logs across power cycles. Software-selectable pullups on the 34 input-capable I/O lines simplify interfacing to open-collector alarm outputs. Its 1.8V to 3.6V supply window matches 3.3V sensor rails directly, avoiding level shifters. In automotive and industrial variants, the automotive temperature grade noted in distributor data extends deployment into harsher cabinets. The 7x7 mm no-lead footprint lets a full monitor node fit on the host board's spare area rather than a separate module, trimming system cost.
Recomendado
Legacy HC08/S08 System Continuity
A major practical application of the MC9S08GT16AMFDE is sustaining mature products originally built around HC08 or early S08 devices. Because the HCS08 core executes the HC08 instruction set with added BGND, existing assembly and C code ports with minimal change, protecting years of validated firmware investment. The GT16A sits in the middle of the MC9S08GT family that NXP explicitly extended downward from higher-end parts, so migration paths to GT32/GT60 exist if code grows. With the base part sourced through Rochester Electronics and DigiKey Marketplace legacy channels, manufacturers can keep shipping to fleets of installed systems while the 48-QFN-EP footprint preserves existing PCB layouts. This makes the device a continuity anchor for long-lifecycle industrial, appliance, and automotive accessory platforms still in production support.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S08GT16AMFDE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S08GT16ACFDE | MC9S08GT16ACFDER | MC9S08GT8ACFDE |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Clock | S08, 40 MHz | S08, 40 MHz | S08, 40 MHz | S08, 40 MHz |
| Flash Memory | 16 KB | 16 KB | 16 KB | 8 KB |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
Diferenciadores clave
- 16 KB Flash with active lifecycle status (frente a MC9S08GT8ACFDE)
- Compact 7x7 mm no-lead footprint (frente a MC9S08GT16ACFDE)
- HC08 code compatibility (frente a MC9S08GT16ACFDER)
Notas de diseño
Solder the 48-QFN-EP exposed pad to a dedicated ground pad on the PCB with an array of 5x5 or similar via pattern connecting to the ground plane. This provides the low-impedance ground return required for EMC performance and the primary thermal path for the die. Follow the land pattern in the NXP mechanical drawing exactly - no-lead packages tolerate little rework, so verify stencil aperture design (typically 50-70% coverage on the exposed pad) before first production run.
The device operates from a 1.8V to 3.6V single supply. In systems with a 5V rail (common in automotive and appliance designs), add a 3.3V LDO pre-regulator and decouple the MCU VDD pins with 100 nF ceramic capacitors placed within a few millimeters of each supply pin, plus bulk 4.7-10 uF at the regulator. Do not feed 5V directly to any I/O pin; the absolute maximum ratings are defined in the NXP datasheet and exceed the operating range only marginally.
Verify lifecycle and footprint before committing to substitutions: the MC9S08GT16ACFDE variant is listed by NXP as end-of-life while the MFDE orderable remains active, and cross-reference sources describe CF-suffix parts as QFN-48 while NXP nomenclature often assigns CF to QFP packages. Always confirm the package from the official NXP mechanical drawing for the exact full orderable number, and qualify legacy-stock sources (Rochester Electronics) for date-code and authenticity requirements.
Información de cumplimiento
Compliance data was not included in the retrieved web data. The device carries an automotive temperature grade per distributor package data, but formal AEC-Q100 qualification status is not stated in the provided sources - confirm on the official NXP product page.
