MC9S08GT60ACFDE - 8-Bit 40MHz MCU, 60KB Flash | NXP
N.º de pieza: MC9S08GT60ACFDE ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.5702 | $6,57 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MC9S08GT60ACFDE Descripción general
A microcontroller is a compact embedded-computing device that integrates a CPU, nonvolatile program memory, volatile data memory, peripherals, and input/output interfaces on one semiconductor die. The S08 core uses a CISC instruction set and belongs to the HCS08 family of general-purpose 8-bit controllers. The MC9S08GT family targets cost-sensitive control systems requiring more processing and memory capacity than the smallest 8-bit devices.
The verified device data identifies 60 KB of Flash program memory, 4 KB of RAM, an 8-bit architecture, and operation up to 40 MHz. A secondary distributor listing describes the package as a 7 x 7 mm 48-QFN with exposed pad, while the suffix indicates tray packaging. Flash memory supports in-system programming and allows firmware updates without replacing the MCU, while RAM supports working variables, stack operations, and peripheral data handling.
The S08 platform integrates communication, timing, analog, and control peripherals, but the verified excerpt does not enumerate their channel counts or block configurations. Detailed peripheral requirements, pin functions, clock options, electrical limits, and thermal ratings should therefore be checked against the manufacturer data sheet before schematic capture or firmware development.
Typical uses for this controller class include industrial monitoring, building and appliance controls, motor-control assistance, general embedded products, and compact consumer devices where an 8-bit architecture, 60 KB of program storage, and a QFN footprint are appropriate. Its exposed-pad package also requires deliberate PCB thermal-pad layout and manufacturing planning.
The most important design consideration is lifecycle risk. Because NXP lists MC9S08GT60ACFDE as NRND, engineers should avoid committing it to new designs unless NXP confirms availability and lifecycle support. Existing production equipment may continue to use the part subject to supply-channel verification.
This page consolidates distributor listings, package information, lifecycle status, sourcing data, and application guidance. It also distinguishes verified drop-in alternatives from related S08 devices that are not automatically pin-compatible, helping engineers assess replacement risk without changing the embedded architecture unnecessarily.
Alternativas directas para MC9S08GT60ACFDE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S08GT60ACFDE (mismo factor de forma y huella) — difiere en Package, Architecture, Flash Memory, Lifecycle Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S08GT60CFDE
✅ Sustitución directa✓ En stock
$8.75 / unidad
Ver hoja de datos →MC9S08GT60ACFDER
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GB60ACFDE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT32ACFDE
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MC9S08GT8ACFDE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT60ACFDE Valores máximos y características eléctricas
| Microcontroller Type | 8-bit general-purpose MCU |
| Processor Core | Enhanced S08 core |
| Architecture | CISC |
| Frecuencia de reloj máxima | 40 MHz |
| Flash Memory | 60 KB (60K x 8) |
| RAM | 4 KB |
| Operating Voltage | 2.5 V to 3.3 V |
| Encapsulado | 48-pin QFN with exposed pad, 7 x 7 mm |
| Tipo de montaje | Surface mount |
| Shipping Form | Tray |
| Product Status | NRND |
Guía de configuración de pines de MC9S08GT60ACFDE 48-pin qfn with exposed pad, 7 x 7 mm
Configuración de pines para MC9S08GT60ACFDE (encapsulado 48-pin qfn with exposed pad, 7 x 7 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC9S08GT60ACFDE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC9S08GT60ACFDE es adecuado para 6 aplicacións: Industrial Monitoring and Control, Building and Appliance Control, Motor and Actuator Control, Battery-Powered Embedded Products, Communication Gateway and HMI Controller, Legacy Equipment Sustaining.
Industrial Monitoring and Control
The MC9S08GT60ACFDE suits compact monitoring controllers that need more program storage than an 8 KB-class MCU. Its 60 KB Flash and 4 KB RAM provide room for acquisition logic, state machines, diagnostics, communications, and local data handling, while the 40 MHz S08 core supports responsive control tasks. The device can sit between sensors and communication transceivers on a compact 2.5 V or 3.3 V board. Before schematic release, verify the required ADC, timer, serial-interface, and I/O resources in the current NXP data sheet.
Recomendado
Building and Appliance Control
The 60 KB Flash capacity makes the MC9S08GT60ACFDE appropriate for configurable appliance and building-control logic where multiple operating modes, safety checks, and interface routines must coexist. Its 4 KB RAM supports task state, timers, and communication buffers, and the 2.5 V to 3.3 V supply range aligns with many embedded boards. The exposed-pad QFN requires careful thermal-pad layout. Confirm peripheral assignments, package pins, and operating-temperature requirements before using it in powered household or environmental equipment.
Recomendado
Motor and Actuator Control
The MC9S08GT60ACFDE can support cost-sensitive actuator controllers when its available timer, PWM, communications, and I/O resources match the motor-control topology. The 40 MHz class core and 60 KB Flash provide capacity for closed-loop sequencing, protection logic, and diagnostic firmware, while 4 KB RAM can hold control variables. The verified excerpts do not confirm PWM channel count or control-loop performance, so those specifications must be checked before selecting the MCU for a motor drive.
Recomendado
Battery-Powered Embedded Products
The 2.5 V to 3.3 V operating range and 60 KB of Flash make the MC9S08GT60ACFDE relevant to compact battery-powered products that need moderate logic storage and runtime memory. Firmware can organize sleep states, sensor acquisition, user-interface logic, and low-power monitoring within a single 8-bit controller. Actual battery-life suitability cannot be inferred from the verified data because active and sleep current figures are absent. Measure those parameters from the manufacturer data sheet and the selected peripheral configuration.
Recomendado
Communication Gateway and HMI Controller
The MC9S08GT60ACFDE can serve as a protocol gateway or local human-interface controller when firmware must combine serial handling, display updates, input scanning, and configuration storage. Its 60 KB Flash provides substantially more code space than the 8 KB and 32 KB related options identified in the comparison data, while 4 KB RAM supports active protocol and interface buffers. Exact UART, SPI, I2C, or other interface resources are not stated in the verified excerpts and must be confirmed before board design.
Recomendado
Legacy Equipment Sustaining
The MC9S08GT60ACFDE is most defensible in equipment already designed around its S08 core and memory map, particularly when NXP marks it NRND but channel inventory remains available. Holding an approved board configuration can reduce the certification and software-validation burden compared with changing MCU architecture. Procurement should secure remaining inventory, record lot traceability, and confirm programming-tool support. New variants of the machine should be reviewed for active MCU migration because the verified sources do not establish a guaranteed lifecycle successor.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S08GT60ACFDE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S08GT60CFDE | MC9S08GT60ACFDER | MC9S08GB60ACFDE | MC9S08GT32ACFDE | MC9S08GT8ACFDE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-pin QFN with exposed pad, 7 x 7 mm | 48-pin QFN exposed pad | 48-pin QFN exposed pad | Similar package; exact format requires confirmation | 48-pin QFN exposed pad | 48-pin QFN exposed pad |
| Core | Enhanced S08, 8-bit | S08, 8-bit | S08, 8-bit | S08 family | S08, 8-bit | S08, 8-bit |
Diferenciadores clave
- Larger Flash capacity than two related S08 package options (frente a MC9S08GT32ACFDE)
- Seven-and-a-half times the listed Flash of the 8 KB related device (frente a MC9S08GT8ACFDE)
- Same documented core, speed, and memory class as the reel-suffix listing (frente a MC9S08GT60ACFDER)
- Documented tray option avoids reel-handling changes for compatible assembly flow (frente a MC9S08GT60CFDE)
Notas de diseño
The MC9S08GT60ACFDE uses a 48-pin QFN with an exposed pad. Follow the manufacturer's land pattern, solder-mask, paste, and thermal-via recommendations exactly; the supplied excerpts do not provide dimensions. A 7 x 7 mm footprint is too small to infer pad geometry from the body size alone. Validate assembly using the official package drawing and consider exposed-pad voiding or stencil changes only under supplier and assembly guidance.
Design the 2.5 V or 3.3 V supply rail with local decoupling and verify startup, transient, and I/O-current requirements from the current manufacturer electrical characteristics. The verified data does not include supply-current limits or pin-drive capabilities. Do not base a power budget on the 40 MHz CPU rating alone because switching speed does not define regulator dissipation. Validate the complete board under worst-case clock, I/O, analog, and peripheral loading.
Do not treat a related S08 name as an automatic drop-in replacement. MC9S08GT32ACFDE and MC9S08GT8ACFDE provide 32 KB and 8 KB Flash, respectively, versus 60 KB for the target, so an existing firmware image may not fit. Compare memory maps, pin functions, peripheral resources, oscillator options, electrical limits, and package drawings. Preserve the verified 40 MHz and 60 KB assumptions only where the candidate's official documentation confirms them.
Keep sensitive analog and communication routes away from high-current switching paths, and place decoupling close to supply pins using the official reference layout. The exposed thermal pad can carry heat but must not be treated as an unrestricted analog ground unless the datasheet assigns it that way. Because no verified pin map is available in the source excerpts, freeze signal assignments only after reviewing the official 48-pin drawing and package connection table.
The NRND lifecycle state is a sourcing and lifecycle risk, not proof that inventory is unavailable. Existing designs may continue using MC9S08GT60ACFDE, but avoid uncontrolled substitutions and unqualified suppliers. Record authorized-channel status, lot traceability, firmware compatibility, and date code. For new products, obtain an NXP lifecycle statement or recommended migration path before schematic release.
Información de cumplimiento
The supplied manufacturer and distributor excerpts do not provide environmental or material-compliance declarations for the exact ordering code.
