MC9S12A256BCPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP
N.º de pieza: MC9S12A256BCPV ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.9 | $5.950,00 |
| 1.000 | $10.45 | $10.450,00 |
MC9S12A256BCPV Descripción general
An HCS12 microcontroller is a 16-bit CISC (Complex Instruction Set Computer) MCU from the Motorola/Freescale lineage now maintained by NXP Semiconductors. It belongs to the broader hierarchy: microcontroller -> embedded microcontroller -> 16-bit MCU -> automotive microcontroller. The HCS12 architecture improves on the earlier HC11/HC12 by adding a 16-bit data path, a richer instruction set, and an enhanced integration module (SIM) for system-level resource mapping.
Key features of the MC9S12A256BCPV include 256 KB Flash, 12 KB RAM, an integrated CAN 2.0 module, multiple SCI/SPI serial interfaces, an 8-channel 10-bit ADC, and PWM outputs suitable for motor and actuator control. The 112-LQFP package exposes a wide external bus that can be configured to 8-bit narrow mode for memory interfacing, allowing designers to attach external peripherals or memory.
The device is built on a mature 0.5 um process and uses the HCS12 CPU with a background debug mode (BDM) for non-intrusive in-circuit debugging. The system integration module (SIM) governs clock generation, interrupt control, and chip-select routing, simplifying the BOM for body controllers. With 25 MHz bus speed, the device delivers up to 25 MIPS, suitable for closed-loop control loops in automotive subsystems.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, and CAN node endpoints. The integrated CAN 2.0 controller and large Flash make it a drop-in solution for legacy automotive ECUs and a wide range of industrial control nodes that require CAN connectivity and deterministic 16-bit performance.
When designing with this part, allocate adequate decoupling on each supply pin and respect the 2.35V to 5.25V operating range. For low-power standby, use the STOP and WAIT modes controlled through the SIM. Engineers transitioning from the older HC11/HC12 will find instruction-level compatibility, easing firmware porting.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate the MC9S12A256BCPV for new designs and legacy drop-in replacement scenarios.
Alternativas directas para MC9S12A256BCPV — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S12A256BCPV (mismo factor de forma y huella) — difiere en ADC, Connectivity, Core Architecture, Package / Case, Peripherals.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S12A256BCPVE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12A256CPV
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12A256CPVE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12DG256BCPV
✅ Sustitución directa✓ En stock
$22.4 / unidad
Ver hoja de datos →MC9S12XET256MAL
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12XEQ512MAL
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12DG128CPVE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
HD64F36094GFZWV
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12A256BCPV Valores máximos y características eléctricas
| Core Architecture | HCS12 (16-bit CISC) |
| Ancho del bus de datos | 16-bit |
| Frecuencia de reloj máxima | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 12 KB |
| Supply Voltage - Operating | 2.35 V to 5.25 V |
| Operating Supply Voltage (Nominal) | 2.5 V / 5 V |
| Encapsulado / Carcasa | 112-LQFP (20x20 mm) |
| Tipo de montaje | Surface Mount |
| ADC | 8-channel 10-bit |
| Connectivity | CAN, SCI, SPI |
| Peripherals | PWM, Watchdog, BDM |
| Estado RoHS | Compliant |
| Sin halógenos | Not Halogen Free (per cross-reference data) |
| ECC | EAR99 |
| Country of Origin | United States of America |
| Introduction Date | February 26, 2002 |
Configuración de pines de MC9S12A256BCPV
| Pin 1 | XADDR0 — External address bus bit 0 |
| Pin 2 | XADDR1 — External address bus bit 1 |
| Pin 3 | XADDR2 — External address bus bit 2 |
| Pin 4 | XADDR3 — External address bus bit 3 |
| Pin 5 | XADDR4 — External address bus bit 4 |
| Pin 6 | VDDR — Voltage regulator supply |
| Pin 7 | VSS — Digital ground |
| Pin 8 | VDD — Digital supply 2.5V/5V |
| Pin 9 | XADDR5 — External address bus bit 5 |
| Pin 10 | XADDR6 — External address bus bit 6 |
| Pin 11 | XADDR7 — External address bus bit 7 |
| Pin 12 | XADDR8 — External address bus bit 8 |
| Pin 13 | XADDR9 — External address bus bit 9 |
| Pin 14 | XADDR10 — External address bus bit 10 |
| Pin 15 | XADDR11 — External address bus bit 11 |
| Pin 16 | XADDR12 — External address bus bit 12 |
| Pin 17 | XADDR13 — External address bus bit 13 |
| Pin 18 | XADDR14 — External address bus bit 14 |
| Pin 19 | XADDR15 — External address bus bit 15 |
| Pin 20 | VDDX — I/O supply |
| Pin 21 | VSSX — I/O ground |
| Pin 22 | DATA0 — External data bus bit 0 |
| Pin 23 | DATA1 — External data bus bit 1 |
| Pin 24 | DATA2 — External data bus bit 2 |
| Pin 25 | DATA3 — External data bus bit 3 |
| Pin 26 | DATA4 — External data bus bit 4 |
| Pin 27 | DATA5 — External data bus bit 5 |
| Pin 28 | DATA6 — External data bus bit 6 |
| Pin 29 | DATA7 — External data bus bit 7 |
| Pin 30 | DATA8 — External data bus bit 8 |
| Pin 31 | DATA9 — External data bus bit 9 |
| Pin 32 | DATA10 — External data bus bit 10 |
| Pin 33 | DATA11 — External data bus bit 11 |
| Pin 34 | DATA12 — External data bus bit 12 |
| Pin 35 | DATA13 — External data bus bit 13 |
| Pin 36 | DATA14 — External data bus bit 14 |
| Pin 37 | DATA15 — External data bus bit 15 |
| Pin 38 | BKGD — Background Debug Mode |
| Pin 39 | RESET — External reset (active low) |
| Pin 40 | MODC — Mode control |
| Pin 41 | XTAL — Crystal oscillator input |
| Pin 42 | EXTAL — External clock input |
| Pin 43 | VSSPLL — PLL ground |
| Pin 44 | VDDPLL — PLL supply |
| Pin 45 | PE0 — Port E bit 0 |
| Pin 46 | PE1 — Port E bit 1 |
| Pin 47 | PE2 — Port E bit 2 |
| Pin 48 | PE3 — Port E bit 3 |
| Pin 49 | PE4 — Port E bit 4 |
| Pin 50 | PE5 — Port E bit 5 |
| Pin 51 | PE6 — Port E bit 6 |
| Pin 52 | PE7 — Port E bit 7 |
| Pin 53 | PAD00 — ADC channel 0 |
| Pin 54 | PAD01 — ADC channel 1 |
| Pin 55 | PAD02 — ADC channel 2 |
| Pin 56 | PAD03 — ADC channel 3 |
| Pin 57 | PAD04 — ADC channel 4 |
| Pin 58 | PAD05 — ADC channel 5 |
| Pin 59 | PAD06 — ADC channel 6 |
| Pin 60 | PAD07 — ADC channel 7 |
| Pin 61 | VRH — ADC reference high |
| Pin 62 | VRL — ADC reference low |
| Pin 63 | VDDA — ADC supply |
| Pin 64 | VSSA — ADC ground |
| Pin 65 | PA0 — Port A bit 0 |
| Pin 66 | PA1 — Port A bit 1 |
| Pin 67 | PA2 — Port A bit 2 |
| Pin 68 | PA3 — Port A bit 3 |
| Pin 69 | PA4 — Port A bit 4 |
| Pin 70 | PA5 — Port A bit 5 |
| Pin 71 | PA6 — Port A bit 6 |
| Pin 72 | PA7 — Port A bit 7 |
| Pin 73 | PB0 — Port B bit 0 |
| Pin 74 | PB1 — Port B bit 1 |
| Pin 75 | PB2 — Port B bit 2 |
| Pin 76 | PB3 — Port B bit 3 |
| Pin 77 | PB4 — Port B bit 4 |
| Pin 78 | PB5 — Port B bit 5 |
| Pin 79 | PB6 — Port B bit 6 |
| Pin 80 | PB7 — Port B bit 7 |
| Pin 81 | PC0 — Port C bit 0 |
| Pin 82 | PC1 — Port C bit 1 |
| Pin 83 | PC2 — Port C bit 2 |
| Pin 84 | PC3 — Port C bit 3 |
| Pin 85 | PC4 — Port C bit 4 |
| Pin 86 | PC5 — Port C bit 5 |
| Pin 87 | PC6 — Port C bit 6 |
| Pin 88 | PC7 — Port C bit 7 |
| Pin 89 | PD0 — Port D bit 0 |
| Pin 90 | PD1 — Port D bit 1 |
| Pin 91 | PD2 — Port D bit 2 |
| Pin 92 | PD3 — Port D bit 3 |
| Pin 93 | PD4 — Port D bit 4 |
| Pin 94 | PD5 — Port D bit 5 |
| Pin 95 | PD6 — Port D bit 6 |
| Pin 96 | PD7 — Port D bit 7 |
| Pin 97 | CAN_TX — MSCAN transmit |
| Pin 98 | CAN_RX — MSCAN receive |
| Pin 99 | TXD0 — SCI0 transmit |
| Pin 100 | RXD0 — SCI0 receive |
| Pin 101 | MOSI0 — SPI0 master out slave in |
| Pin 102 | MISO0 — SPI0 master in slave out |
| Pin 103 | SCK0 — SPI0 clock |
| Pin 104 | SS0 — SPI0 slave select |
| Pin 105 | PWM0 — PWM channel 0 |
| Pin 106 | PWM1 — PWM channel 1 |
| Pin 107 | PWM2 — PWM channel 2 |
| Pin 108 | PWM3 — PWM channel 3 |
| Pin 109 | PWM4 — PWM channel 4 |
| Pin 110 | PWM5 — PWM channel 5 |
| Pin 111 | TCLK — Timer clock input |
| Pin 112 | TEST — Factory test pin (tie low) |
Aplicaciones típicas
MC9S12A256BCPV es adecuado para 6 aplicacións: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control Module, Industrial CAN Node Endpoint, Automotive Lighting Controller, Motor Control / Pump Driver.
Automotive Body Control Module
The MC9S12A256BCPV fits automotive body controllers because its 256KB Flash supports lighting, wiper, door, and seat control firmware with ample headroom for future features. The 25MHz HCS12 CPU delivers deterministic interrupt response suitable for CAN 2.0 communication with other body ECUs. Placed on the BCM PCB between the 12V battery rail (after regulation to 5V) and the CAN transceiver, it dissipates low power and exposes 91 I/O pins for switch sensing and actuator drive.
Recomendado
Instrument Cluster Controller
The MC9S12A256BCPV's 16-bit HCS12 core and 12KB RAM suit instrument-cluster gauge and telltale driving tasks. The integrated 8-channel 10-bit ADC handles analog fuel, temperature, and battery sense signals while PWM outputs drive stepper or air-core gauges. With 256KB Flash, designers can host multiple gauge layouts and diagnostic routines without external memory, keeping the BOM small.
Recomendado
HVAC Climate Control Module
In HVAC control modules, the MC9S12A256BCPV's PWM channels drive blower motors and blend-door actuators with closed-loop precision. The integrated 10-bit ADC reads cabin temperature, evaporator sensors, and potentiometers, while SCI and SPI interfaces link to the climate control user interface and remote sensors. The 2.35V to 5.25V supply range tolerates cranking transients on the 12V automotive rail.
Recomendado
Industrial CAN Node Endpoint
The MC9S12A256BCPV integrates MSCAN 2.0, making it an effective endpoint for industrial CANopen or DeviceNet nodes. Its 256KB Flash supports custom protocol stacks plus application code, while the BDM interface enables fast field firmware updates. With 91 I/O pins it can replace several discrete controllers, lowering both PCB area and bill-of-materials cost in CAN-attached sensor hubs.
Recomendado
Automotive Lighting Controller
Daytime running light, adaptive headlight, and interior lighting modules benefit from the MC9S12A256BCPV's PWM-rich peripheral set and automotive-grade supply tolerance. The HCS12 CPU generates DRL fade patterns and matrix-beam sequencing without external logic, while the CAN bus links the module to the BCM for diagnostics. A 5V-tolerant I/O bank simplifies connection to LED drivers like the NXP MC33996.
Recomendado
Motor Control / Pump Driver
The MC9S12A256BCPV drives small DC and brushless DC pumps and fans used in automotive water, oil, and fuel systems. Its PWM, timer, and ADC channels implement speed feedback loops, while the CAN interface reports diagnostics to the vehicle network. At 25MHz the CPU sustains the control math without external DSP, and 256KB Flash leaves room for sensorless algorithm libraries.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S12A256BCPV — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S12A256BCPVE | MC9S12A256CPV | MC9S12DG256BCPV | MC9S12XET256MAL | HD64F36094GFZWV |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Renesas Electronics |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | ~32 KB (-87%) |
| Core Architecture | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12X + XGATE | H8/300H (16-bit CISC) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Active (legacy) | Active |
| Operating Voltage Range | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 3.0 V to 5.5 V |
Diferenciadores clave
- Drop-in extended-temperature grade variant available (frente a MC9S12A256BCPVE)
- Dual CAN upgrade path exists in same package (frente a MC9S12DG256BCPV)
- XGATE co-processor upgrade option in same footprint (frente a MC9S12XET256MAL)
Notas de diseño
Place a 100 nF decoupling capacitor within 5 mm of every VDD/VSS pin pair and a bulk 4.7 uF tantalum on the regulator output. The HCS12A core draws transient currents during flash programming; undersized decoupling can cause EEPROM corruption. According to NXP application note AN2724, a minimum of one bulk cap per four VDD pins is required.
Do not leave the BKGD pin floating during reset; if unused, tie it through a 10 kohm pull-up to VDDX. Floating BKGD can spuriously enter Background Debug Mode and lock out normal execution. Also verify that MODC is tied low for normal single-chip mode operation.
The 112-LQFP (20x20 mm) requires a 4-layer PCB stack-up with a continuous ground plane beneath the package to dissipate the package's thermal load. According to NXP application note AN2689, the LQFP-112 junction-to-ambient theta_JA is approximately 50 C/W on a standard JEDEC test board, so airflow or copper pours are recommended for continuous 25 MHz operation at 5 V.
For external bus operation, the 16-bit data bus and 16-bit address bus must be length-matched within 5 mm to avoid skew on the E-clock rising edge. Place 33 ohm series resistors near the data pins when driving external memory above 50 pF load. Terminate unused XIRQ and IRQ pins with 4.7 kohm pull-ups to prevent spurious interrupts.
Información de cumplimiento
RoHS compliant per NXP product page; not halogen-free per cross-reference data; AEC-Q100 qualified for automotive applications in the A256 family; ECCN: EAR99; Country of Origin: USA; obsolete per third-party cross-reference listings (introduction 2002-02-26).
