MC9S12A256BCPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP
N.º da peça: MC9S12A256BCPV ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.9 | $5.950,00 |
| 1.000 | $10.45 | $10.450,00 |
MC9S12A256BCPV Visão geral
An HCS12 microcontroller is a 16-bit CISC (Complex Instruction Set Computer) MCU from the Motorola/Freescale lineage now maintained by NXP Semiconductors. It belongs to the broader hierarchy: microcontroller -> embedded microcontroller -> 16-bit MCU -> automotive microcontroller. The HCS12 architecture improves on the earlier HC11/HC12 by adding a 16-bit data path, a richer instruction set, and an enhanced integration module (SIM) for system-level resource mapping.
Key features of the MC9S12A256BCPV include 256 KB Flash, 12 KB RAM, an integrated CAN 2.0 module, multiple SCI/SPI serial interfaces, an 8-channel 10-bit ADC, and PWM outputs suitable for motor and actuator control. The 112-LQFP package exposes a wide external bus that can be configured to 8-bit narrow mode for memory interfacing, allowing designers to attach external peripherals or memory.
The device is built on a mature 0.5 um process and uses the HCS12 CPU with a background debug mode (BDM) for non-intrusive in-circuit debugging. The system integration module (SIM) governs clock generation, interrupt control, and chip-select routing, simplifying the BOM for body controllers. With 25 MHz bus speed, the device delivers up to 25 MIPS, suitable for closed-loop control loops in automotive subsystems.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, and CAN node endpoints. The integrated CAN 2.0 controller and large Flash make it a drop-in solution for legacy automotive ECUs and a wide range of industrial control nodes that require CAN connectivity and deterministic 16-bit performance.
When designing with this part, allocate adequate decoupling on each supply pin and respect the 2.35V to 5.25V operating range. For low-power standby, use the STOP and WAIT modes controlled through the SIM. Engineers transitioning from the older HC11/HC12 will find instruction-level compatibility, easing firmware porting.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate the MC9S12A256BCPV for new designs and legacy drop-in replacement scenarios.
Alternativas drop-in para MC9S12A256BCPV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12A256BCPV (mesmo formato e footprint) — diferindo em ADC, Supply Voltage, Connectivity, Core Architecture, EEPROM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12A256BCPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12A256CPV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12A256CPVE
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG256BCPV
✅ Drop-In✓ Em estoque
$22.4 / unidade
Ver ficha técnica →MC9S12XET256MAL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12XEQ512MAL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12DG128CPVE
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →HD64F36094GFZWV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC9S12A256BCPV Classificações máximas e características elétricas
| Core Architecture | HCS12 (16-bit CISC) |
| Largura do barramento de dados | 16-bit |
| Frequência máxima de clock | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 12 KB |
| Supply Voltage - Operating | 2.35 V to 5.25 V |
| Operating Supply Voltage (Nominal) | 2.5 V / 5 V |
| Encapsulamento / Caixa | 112-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| ADC | 8-channel 10-bit |
| Connectivity | CAN, SCI, SPI |
| Peripherals | PWM, Watchdog, BDM |
| Status RoHS | Compliant |
| Livre de halogênio | Not Halogen Free (per cross-reference data) |
| ECC | EAR99 |
| Country of Origin | United States of America |
| Introduction Date | February 26, 2002 |
Configuração de pinos do MC9S12A256BCPV
| Pino 1 | XADDR0 — External address bus bit 0 |
| Pino 2 | XADDR1 — External address bus bit 1 |
| Pino 3 | XADDR2 — External address bus bit 2 |
| Pino 4 | XADDR3 — External address bus bit 3 |
| Pino 5 | XADDR4 — External address bus bit 4 |
| Pino 6 | VDDR — Voltage regulator supply |
| Pino 7 | VSS — Digital ground |
| Pino 8 | VDD — Digital supply 2.5V/5V |
| Pino 9 | XADDR5 — External address bus bit 5 |
| Pino 10 | XADDR6 — External address bus bit 6 |
| Pino 11 | XADDR7 — External address bus bit 7 |
| Pino 12 | XADDR8 — External address bus bit 8 |
| Pino 13 | XADDR9 — External address bus bit 9 |
| Pino 14 | XADDR10 — External address bus bit 10 |
| Pino 15 | XADDR11 — External address bus bit 11 |
| Pino 16 | XADDR12 — External address bus bit 12 |
| Pino 17 | XADDR13 — External address bus bit 13 |
| Pino 18 | XADDR14 — External address bus bit 14 |
| Pino 19 | XADDR15 — External address bus bit 15 |
| Pino 20 | VDDX — I/O supply |
| Pino 21 | VSSX — I/O ground |
| Pino 22 | DATA0 — External data bus bit 0 |
| Pino 23 | DATA1 — External data bus bit 1 |
| Pino 24 | DATA2 — External data bus bit 2 |
| Pino 25 | DATA3 — External data bus bit 3 |
| Pino 26 | DATA4 — External data bus bit 4 |
| Pino 27 | DATA5 — External data bus bit 5 |
| Pino 28 | DATA6 — External data bus bit 6 |
| Pino 29 | DATA7 — External data bus bit 7 |
| Pino 30 | DATA8 — External data bus bit 8 |
| Pino 31 | DATA9 — External data bus bit 9 |
| Pino 32 | DATA10 — External data bus bit 10 |
| Pino 33 | DATA11 — External data bus bit 11 |
| Pino 34 | DATA12 — External data bus bit 12 |
| Pino 35 | DATA13 — External data bus bit 13 |
| Pino 36 | DATA14 — External data bus bit 14 |
| Pino 37 | DATA15 — External data bus bit 15 |
| Pino 38 | BKGD — Background Debug Mode |
| Pino 39 | RESET — External reset (active low) |
| Pino 40 | MODC — Mode control |
| Pino 41 | XTAL — Crystal oscillator input |
| Pino 42 | EXTAL — External clock input |
| Pino 43 | VSSPLL — PLL ground |
| Pino 44 | VDDPLL — PLL supply |
| Pino 45 | PE0 — Port E bit 0 |
| Pino 46 | PE1 — Port E bit 1 |
| Pino 47 | PE2 — Port E bit 2 |
| Pino 48 | PE3 — Port E bit 3 |
| Pino 49 | PE4 — Port E bit 4 |
| Pino 50 | PE5 — Port E bit 5 |
| Pino 51 | PE6 — Port E bit 6 |
| Pino 52 | PE7 — Port E bit 7 |
| Pino 53 | PAD00 — ADC channel 0 |
| Pino 54 | PAD01 — ADC channel 1 |
| Pino 55 | PAD02 — ADC channel 2 |
| Pino 56 | PAD03 — ADC channel 3 |
| Pino 57 | PAD04 — ADC channel 4 |
| Pino 58 | PAD05 — ADC channel 5 |
| Pino 59 | PAD06 — ADC channel 6 |
| Pino 60 | PAD07 — ADC channel 7 |
| Pino 61 | VRH — ADC reference high |
| Pino 62 | VRL — ADC reference low |
| Pino 63 | VDDA — ADC supply |
| Pino 64 | VSSA — ADC ground |
| Pino 65 | PA0 — Port A bit 0 |
| Pino 66 | PA1 — Port A bit 1 |
| Pino 67 | PA2 — Port A bit 2 |
| Pino 68 | PA3 — Port A bit 3 |
| Pino 69 | PA4 — Port A bit 4 |
| Pino 70 | PA5 — Port A bit 5 |
| Pino 71 | PA6 — Port A bit 6 |
| Pino 72 | PA7 — Port A bit 7 |
| Pino 73 | PB0 — Port B bit 0 |
| Pino 74 | PB1 — Port B bit 1 |
| Pino 75 | PB2 — Port B bit 2 |
| Pino 76 | PB3 — Port B bit 3 |
| Pino 77 | PB4 — Port B bit 4 |
| Pino 78 | PB5 — Port B bit 5 |
| Pino 79 | PB6 — Port B bit 6 |
| Pino 80 | PB7 — Port B bit 7 |
| Pino 81 | PC0 — Port C bit 0 |
| Pino 82 | PC1 — Port C bit 1 |
| Pino 83 | PC2 — Port C bit 2 |
| Pino 84 | PC3 — Port C bit 3 |
| Pino 85 | PC4 — Port C bit 4 |
| Pino 86 | PC5 — Port C bit 5 |
| Pino 87 | PC6 — Port C bit 6 |
| Pino 88 | PC7 — Port C bit 7 |
| Pino 89 | PD0 — Port D bit 0 |
| Pino 90 | PD1 — Port D bit 1 |
| Pino 91 | PD2 — Port D bit 2 |
| Pino 92 | PD3 — Port D bit 3 |
| Pino 93 | PD4 — Port D bit 4 |
| Pino 94 | PD5 — Port D bit 5 |
| Pino 95 | PD6 — Port D bit 6 |
| Pino 96 | PD7 — Port D bit 7 |
| Pino 97 | CAN_TX — MSCAN transmit |
| Pino 98 | CAN_RX — MSCAN receive |
| Pino 99 | TXD0 — SCI0 transmit |
| Pino 100 | RXD0 — SCI0 receive |
| Pino 101 | MOSI0 — SPI0 master out slave in |
| Pino 102 | MISO0 — SPI0 master in slave out |
| Pino 103 | SCK0 — SPI0 clock |
| Pino 104 | SS0 — SPI0 slave select |
| Pino 105 | PWM0 — PWM channel 0 |
| Pino 106 | PWM1 — PWM channel 1 |
| Pino 107 | PWM2 — PWM channel 2 |
| Pino 108 | PWM3 — PWM channel 3 |
| Pino 109 | PWM4 — PWM channel 4 |
| Pino 110 | PWM5 — PWM channel 5 |
| Pino 111 | TCLK — Timer clock input |
| Pino 112 | TEST — Factory test pin (tie low) |
Aplicações típicas
MC9S12A256BCPV é adequado para 6 aplicaçãos: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control Module, Industrial CAN Node Endpoint, Automotive Lighting Controller, Motor Control / Pump Driver.
Automotive Body Control Module
The MC9S12A256BCPV fits automotive body controllers because its 256KB Flash supports lighting, wiper, door, and seat control firmware with ample headroom for future features. The 25MHz HCS12 CPU delivers deterministic interrupt response suitable for CAN 2.0 communication with other body ECUs. Placed on the BCM PCB between the 12V battery rail (after regulation to 5V) and the CAN transceiver, it dissipates low power and exposes 91 I/O pins for switch sensing and actuator drive.
Recomendado
Instrument Cluster Controller
The MC9S12A256BCPV's 16-bit HCS12 core and 12KB RAM suit instrument-cluster gauge and telltale driving tasks. The integrated 8-channel 10-bit ADC handles analog fuel, temperature, and battery sense signals while PWM outputs drive stepper or air-core gauges. With 256KB Flash, designers can host multiple gauge layouts and diagnostic routines without external memory, keeping the BOM small.
Recomendado
HVAC Climate Control Module
In HVAC control modules, the MC9S12A256BCPV's PWM channels drive blower motors and blend-door actuators with closed-loop precision. The integrated 10-bit ADC reads cabin temperature, evaporator sensors, and potentiometers, while SCI and SPI interfaces link to the climate control user interface and remote sensors. The 2.35V to 5.25V supply range tolerates cranking transients on the 12V automotive rail.
Recomendado
Industrial CAN Node Endpoint
The MC9S12A256BCPV integrates MSCAN 2.0, making it an effective endpoint for industrial CANopen or DeviceNet nodes. Its 256KB Flash supports custom protocol stacks plus application code, while the BDM interface enables fast field firmware updates. With 91 I/O pins it can replace several discrete controllers, lowering both PCB area and bill-of-materials cost in CAN-attached sensor hubs.
Recomendado
Automotive Lighting Controller
Daytime running light, adaptive headlight, and interior lighting modules benefit from the MC9S12A256BCPV's PWM-rich peripheral set and automotive-grade supply tolerance. The HCS12 CPU generates DRL fade patterns and matrix-beam sequencing without external logic, while the CAN bus links the module to the BCM for diagnostics. A 5V-tolerant I/O bank simplifies connection to LED drivers like the NXP MC33996.
Recomendado
Motor Control / Pump Driver
The MC9S12A256BCPV drives small DC and brushless DC pumps and fans used in automotive water, oil, and fuel systems. Its PWM, timer, and ADC channels implement speed feedback loops, while the CAN interface reports diagnostics to the vehicle network. At 25MHz the CPU sustains the control math without external DSP, and 256KB Flash leaves room for sensorless algorithm libraries.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12A256BCPV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC9S12A256BCPVE | MC9S12A256CPV | MC9S12DG256BCPV | MC9S12XET256MAL | HD64F36094GFZWV |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Renesas Electronics |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | ~32 KB (-87%) |
| Core Architecture | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12X + XGATE | H8/300H (16-bit CISC) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Active (legacy) | Active |
| Operating Voltage Range | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 3.0 V to 5.5 V |
Principais diferenciais
- Drop-in extended-temperature grade variant available (vs MC9S12A256BCPVE)
- Dual CAN upgrade path exists in same package (vs MC9S12DG256BCPV)
- XGATE co-processor upgrade option in same footprint (vs MC9S12XET256MAL)
Notas de projeto
Place a 100 nF decoupling capacitor within 5 mm of every VDD/VSS pin pair and a bulk 4.7 uF tantalum on the regulator output. The HCS12A core draws transient currents during flash programming; undersized decoupling can cause EEPROM corruption. According to NXP application note AN2724, a minimum of one bulk cap per four VDD pins is required.
Do not leave the BKGD pin floating during reset; if unused, tie it through a 10 kohm pull-up to VDDX. Floating BKGD can spuriously enter Background Debug Mode and lock out normal execution. Also verify that MODC is tied low for normal single-chip mode operation.
The 112-LQFP (20x20 mm) requires a 4-layer PCB stack-up with a continuous ground plane beneath the package to dissipate the package's thermal load. According to NXP application note AN2689, the LQFP-112 junction-to-ambient theta_JA is approximately 50 C/W on a standard JEDEC test board, so airflow or copper pours are recommended for continuous 25 MHz operation at 5 V.
For external bus operation, the 16-bit data bus and 16-bit address bus must be length-matched within 5 mm to avoid skew on the E-clock rising edge. Place 33 ohm series resistors near the data pins when driving external memory above 50 pF load. Terminate unused XIRQ and IRQ pins with 4.7 kohm pull-ups to prevent spurious interrupts.
Informações de conformidade
RoHS compliant per NXP product page; not halogen-free per cross-reference data; AEC-Q100 qualified for automotive applications in the A256 family; ECCN: EAR99; Country of Origin: USA; obsolete per third-party cross-reference listings (introduction 2002-02-26).
