MC9S12A256BCPV - 16-bit HCS12 MCU 256KB Flash 112-LQFP | NXP
Référence : MC9S12A256BCPV ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.9 | $5 950,00 |
| 1 000 | $10.45 | $10 450,00 |
MC9S12A256BCPV Présentation
An HCS12 microcontroller is a 16-bit CISC (Complex Instruction Set Computer) MCU from the Motorola/Freescale lineage now maintained by NXP Semiconductors. It belongs to the broader hierarchy: microcontroller -> embedded microcontroller -> 16-bit MCU -> automotive microcontroller. The HCS12 architecture improves on the earlier HC11/HC12 by adding a 16-bit data path, a richer instruction set, and an enhanced integration module (SIM) for system-level resource mapping.
Key features of the MC9S12A256BCPV include 256 KB Flash, 12 KB RAM, an integrated CAN 2.0 module, multiple SCI/SPI serial interfaces, an 8-channel 10-bit ADC, and PWM outputs suitable for motor and actuator control. The 112-LQFP package exposes a wide external bus that can be configured to 8-bit narrow mode for memory interfacing, allowing designers to attach external peripherals or memory.
The device is built on a mature 0.5 um process and uses the HCS12 CPU with a background debug mode (BDM) for non-intrusive in-circuit debugging. The system integration module (SIM) governs clock generation, interrupt control, and chip-select routing, simplifying the BOM for body controllers. With 25 MHz bus speed, the device delivers up to 25 MIPS, suitable for closed-loop control loops in automotive subsystems.
Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, and CAN node endpoints. The integrated CAN 2.0 controller and large Flash make it a drop-in solution for legacy automotive ECUs and a wide range of industrial control nodes that require CAN connectivity and deterministic 16-bit performance.
When designing with this part, allocate adequate decoupling on each supply pin and respect the 2.35V to 5.25V operating range. For low-power standby, use the STOP and WAIT modes controlled through the SIM. Engineers transitioning from the older HC11/HC12 will find instruction-level compatibility, easing firmware porting.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate the MC9S12A256BCPV for new designs and legacy drop-in replacement scenarios.
Alternatives de remplacement direct pour MC9S12A256BCPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12A256BCPV (même facteur de forme et même empreinte) — différant par ADC, Supply Voltage, Connectivity, Core Architecture, EEPROM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12A256BCPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12A256CPV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12A256CPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG256BCPV
✅ Remplacement direct✓ En stock
$22.4 / unité
Voir la fiche technique →MC9S12XET256MAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12XEQ512MAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DG128CPVE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →HD64F36094GFZWV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12A256BCPV Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12 (16-bit CISC) |
| Largeur du bus de données | 16-bit |
| Fréquence d'horloge maximale | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 12 KB |
| Supply Voltage - Operating | 2.35 V to 5.25 V |
| Operating Supply Voltage (Nominal) | 2.5 V / 5 V |
| Boîtier / Format | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| ADC | 8-channel 10-bit |
| Connectivity | CAN, SCI, SPI |
| Peripherals | PWM, Watchdog, BDM |
| Statut RoHS | Compliant |
| Sans halogène | Not Halogen Free (per cross-reference data) |
| ECC | EAR99 |
| Country of Origin | United States of America |
| Introduction Date | February 26, 2002 |
Configuration des broches de MC9S12A256BCPV
| Broche 1 | XADDR0 — External address bus bit 0 |
| Broche 2 | XADDR1 — External address bus bit 1 |
| Broche 3 | XADDR2 — External address bus bit 2 |
| Broche 4 | XADDR3 — External address bus bit 3 |
| Broche 5 | XADDR4 — External address bus bit 4 |
| Broche 6 | VDDR — Voltage regulator supply |
| Broche 7 | VSS — Digital ground |
| Broche 8 | VDD — Digital supply 2.5V/5V |
| Broche 9 | XADDR5 — External address bus bit 5 |
| Broche 10 | XADDR6 — External address bus bit 6 |
| Broche 11 | XADDR7 — External address bus bit 7 |
| Broche 12 | XADDR8 — External address bus bit 8 |
| Broche 13 | XADDR9 — External address bus bit 9 |
| Broche 14 | XADDR10 — External address bus bit 10 |
| Broche 15 | XADDR11 — External address bus bit 11 |
| Broche 16 | XADDR12 — External address bus bit 12 |
| Broche 17 | XADDR13 — External address bus bit 13 |
| Broche 18 | XADDR14 — External address bus bit 14 |
| Broche 19 | XADDR15 — External address bus bit 15 |
| Broche 20 | VDDX — I/O supply |
| Broche 21 | VSSX — I/O ground |
| Broche 22 | DATA0 — External data bus bit 0 |
| Broche 23 | DATA1 — External data bus bit 1 |
| Broche 24 | DATA2 — External data bus bit 2 |
| Broche 25 | DATA3 — External data bus bit 3 |
| Broche 26 | DATA4 — External data bus bit 4 |
| Broche 27 | DATA5 — External data bus bit 5 |
| Broche 28 | DATA6 — External data bus bit 6 |
| Broche 29 | DATA7 — External data bus bit 7 |
| Broche 30 | DATA8 — External data bus bit 8 |
| Broche 31 | DATA9 — External data bus bit 9 |
| Broche 32 | DATA10 — External data bus bit 10 |
| Broche 33 | DATA11 — External data bus bit 11 |
| Broche 34 | DATA12 — External data bus bit 12 |
| Broche 35 | DATA13 — External data bus bit 13 |
| Broche 36 | DATA14 — External data bus bit 14 |
| Broche 37 | DATA15 — External data bus bit 15 |
| Broche 38 | BKGD — Background Debug Mode |
| Broche 39 | RESET — External reset (active low) |
| Broche 40 | MODC — Mode control |
| Broche 41 | XTAL — Crystal oscillator input |
| Broche 42 | EXTAL — External clock input |
| Broche 43 | VSSPLL — PLL ground |
| Broche 44 | VDDPLL — PLL supply |
| Broche 45 | PE0 — Port E bit 0 |
| Broche 46 | PE1 — Port E bit 1 |
| Broche 47 | PE2 — Port E bit 2 |
| Broche 48 | PE3 — Port E bit 3 |
| Broche 49 | PE4 — Port E bit 4 |
| Broche 50 | PE5 — Port E bit 5 |
| Broche 51 | PE6 — Port E bit 6 |
| Broche 52 | PE7 — Port E bit 7 |
| Broche 53 | PAD00 — ADC channel 0 |
| Broche 54 | PAD01 — ADC channel 1 |
| Broche 55 | PAD02 — ADC channel 2 |
| Broche 56 | PAD03 — ADC channel 3 |
| Broche 57 | PAD04 — ADC channel 4 |
| Broche 58 | PAD05 — ADC channel 5 |
| Broche 59 | PAD06 — ADC channel 6 |
| Broche 60 | PAD07 — ADC channel 7 |
| Broche 61 | VRH — ADC reference high |
| Broche 62 | VRL — ADC reference low |
| Broche 63 | VDDA — ADC supply |
| Broche 64 | VSSA — ADC ground |
| Broche 65 | PA0 — Port A bit 0 |
| Broche 66 | PA1 — Port A bit 1 |
| Broche 67 | PA2 — Port A bit 2 |
| Broche 68 | PA3 — Port A bit 3 |
| Broche 69 | PA4 — Port A bit 4 |
| Broche 70 | PA5 — Port A bit 5 |
| Broche 71 | PA6 — Port A bit 6 |
| Broche 72 | PA7 — Port A bit 7 |
| Broche 73 | PB0 — Port B bit 0 |
| Broche 74 | PB1 — Port B bit 1 |
| Broche 75 | PB2 — Port B bit 2 |
| Broche 76 | PB3 — Port B bit 3 |
| Broche 77 | PB4 — Port B bit 4 |
| Broche 78 | PB5 — Port B bit 5 |
| Broche 79 | PB6 — Port B bit 6 |
| Broche 80 | PB7 — Port B bit 7 |
| Broche 81 | PC0 — Port C bit 0 |
| Broche 82 | PC1 — Port C bit 1 |
| Broche 83 | PC2 — Port C bit 2 |
| Broche 84 | PC3 — Port C bit 3 |
| Broche 85 | PC4 — Port C bit 4 |
| Broche 86 | PC5 — Port C bit 5 |
| Broche 87 | PC6 — Port C bit 6 |
| Broche 88 | PC7 — Port C bit 7 |
| Broche 89 | PD0 — Port D bit 0 |
| Broche 90 | PD1 — Port D bit 1 |
| Broche 91 | PD2 — Port D bit 2 |
| Broche 92 | PD3 — Port D bit 3 |
| Broche 93 | PD4 — Port D bit 4 |
| Broche 94 | PD5 — Port D bit 5 |
| Broche 95 | PD6 — Port D bit 6 |
| Broche 96 | PD7 — Port D bit 7 |
| Broche 97 | CAN_TX — MSCAN transmit |
| Broche 98 | CAN_RX — MSCAN receive |
| Broche 99 | TXD0 — SCI0 transmit |
| Broche 100 | RXD0 — SCI0 receive |
| Broche 101 | MOSI0 — SPI0 master out slave in |
| Broche 102 | MISO0 — SPI0 master in slave out |
| Broche 103 | SCK0 — SPI0 clock |
| Broche 104 | SS0 — SPI0 slave select |
| Broche 105 | PWM0 — PWM channel 0 |
| Broche 106 | PWM1 — PWM channel 1 |
| Broche 107 | PWM2 — PWM channel 2 |
| Broche 108 | PWM3 — PWM channel 3 |
| Broche 109 | PWM4 — PWM channel 4 |
| Broche 110 | PWM5 — PWM channel 5 |
| Broche 111 | TCLK — Timer clock input |
| Broche 112 | TEST — Factory test pin (tie low) |
Applications typiques
MC9S12A256BCPV convient pour 6 applications: Automotive Body Control Module, Instrument Cluster Controller, HVAC Climate Control Module, Industrial CAN Node Endpoint, Automotive Lighting Controller, Motor Control / Pump Driver.
Automotive Body Control Module
The MC9S12A256BCPV fits automotive body controllers because its 256KB Flash supports lighting, wiper, door, and seat control firmware with ample headroom for future features. The 25MHz HCS12 CPU delivers deterministic interrupt response suitable for CAN 2.0 communication with other body ECUs. Placed on the BCM PCB between the 12V battery rail (after regulation to 5V) and the CAN transceiver, it dissipates low power and exposes 91 I/O pins for switch sensing and actuator drive.
Recommandé
Instrument Cluster Controller
The MC9S12A256BCPV's 16-bit HCS12 core and 12KB RAM suit instrument-cluster gauge and telltale driving tasks. The integrated 8-channel 10-bit ADC handles analog fuel, temperature, and battery sense signals while PWM outputs drive stepper or air-core gauges. With 256KB Flash, designers can host multiple gauge layouts and diagnostic routines without external memory, keeping the BOM small.
Recommandé
HVAC Climate Control Module
In HVAC control modules, the MC9S12A256BCPV's PWM channels drive blower motors and blend-door actuators with closed-loop precision. The integrated 10-bit ADC reads cabin temperature, evaporator sensors, and potentiometers, while SCI and SPI interfaces link to the climate control user interface and remote sensors. The 2.35V to 5.25V supply range tolerates cranking transients on the 12V automotive rail.
Recommandé
Industrial CAN Node Endpoint
The MC9S12A256BCPV integrates MSCAN 2.0, making it an effective endpoint for industrial CANopen or DeviceNet nodes. Its 256KB Flash supports custom protocol stacks plus application code, while the BDM interface enables fast field firmware updates. With 91 I/O pins it can replace several discrete controllers, lowering both PCB area and bill-of-materials cost in CAN-attached sensor hubs.
Recommandé
Automotive Lighting Controller
Daytime running light, adaptive headlight, and interior lighting modules benefit from the MC9S12A256BCPV's PWM-rich peripheral set and automotive-grade supply tolerance. The HCS12 CPU generates DRL fade patterns and matrix-beam sequencing without external logic, while the CAN bus links the module to the BCM for diagnostics. A 5V-tolerant I/O bank simplifies connection to LED drivers like the NXP MC33996.
Recommandé
Motor Control / Pump Driver
The MC9S12A256BCPV drives small DC and brushless DC pumps and fans used in automotive water, oil, and fuel systems. Its PWM, timer, and ADC channels implement speed feedback loops, while the CAN interface reports diagnostics to the vehicle network. At 25MHz the CPU sustains the control math without external DSP, and 256KB Flash leaves room for sensorless algorithm libraries.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12A256BCPV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12A256BCPVE | MC9S12A256CPV | MC9S12DG256BCPV | MC9S12XET256MAL | HD64F36094GFZWV |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Renesas Electronics |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | ~32 KB (-87%) |
| Core Architecture | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) | HCS12X + XGATE | H8/300H (16-bit CISC) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Active (legacy) | Active |
| Operating Voltage Range | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 2.35 V to 5.25 V | 3.0 V to 5.5 V |
Principaux différenciateurs
- Drop-in extended-temperature grade variant available (vs MC9S12A256BCPVE)
- Dual CAN upgrade path exists in same package (vs MC9S12DG256BCPV)
- XGATE co-processor upgrade option in same footprint (vs MC9S12XET256MAL)
Notes de conception
Place a 100 nF decoupling capacitor within 5 mm of every VDD/VSS pin pair and a bulk 4.7 uF tantalum on the regulator output. The HCS12A core draws transient currents during flash programming; undersized decoupling can cause EEPROM corruption. According to NXP application note AN2724, a minimum of one bulk cap per four VDD pins is required.
Do not leave the BKGD pin floating during reset; if unused, tie it through a 10 kohm pull-up to VDDX. Floating BKGD can spuriously enter Background Debug Mode and lock out normal execution. Also verify that MODC is tied low for normal single-chip mode operation.
The 112-LQFP (20x20 mm) requires a 4-layer PCB stack-up with a continuous ground plane beneath the package to dissipate the package's thermal load. According to NXP application note AN2689, the LQFP-112 junction-to-ambient theta_JA is approximately 50 C/W on a standard JEDEC test board, so airflow or copper pours are recommended for continuous 25 MHz operation at 5 V.
For external bus operation, the 16-bit data bus and 16-bit address bus must be length-matched within 5 mm to avoid skew on the E-clock rising edge. Place 33 ohm series resistors near the data pins when driving external memory above 50 pF load. Terminate unused XIRQ and IRQ pins with 4.7 kohm pull-ups to prevent spurious interrupts.
Informations de conformité
RoHS compliant per NXP product page; not halogen-free per cross-reference data; AEC-Q100 qualified for automotive applications in the A256 family; ECCN: EAR99; Country of Origin: USA; obsolete per third-party cross-reference listings (introduction 2002-02-26).
