MCF52235CVM60 - 32-bit ColdFire V2 MCU, 256KB Flash, 60MHz | NXP
N.º de pieza: MCF52235CVM60 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.69 | $12,69 |
| 10 | $11.85 | $118,50 |
| 100 | $10.75 | $1.075,00 |
| 500 | $9.95 | $4.975,00 |
| 1.000 | $9.1 | $9.100,00 |
MCF52235CVM60 Descripción general
A ColdFire V2 microcontroller belongs to the RISC (Reduced Instruction Set Computing) microcontroller family, itself a sub-family of microcontrollers and embedded processors. ColdFire V2 devices combine a 32-bit variable-length instruction set with deterministic interrupt latency and peripheral integration suitable for connected embedded designs. The MCF52235CVM60 integrates Ethernet MAC and PHY on-chip, distinguishing it from general-purpose 32-bit MCUs that require external Ethernet controllers.
Key features include 256 KB Flash program memory, 32 KB SRAM, a 10/100 Mbps Ethernet MAC with MII/RMII interface and integrated PHY, multiple timers (including a 4-channel DMA), CAN 2.0B controller, three UARTs, two I2C ports, and a queued SPI peripheral. The device operates from a 3.0 V to 3.6 V supply and supports industrial operating temperatures from -40 C to +85 C.
The MCF52235CVM60 is built on a Harvard-style ColdFire V2 core with hardware multiply/accumulate and a unified peripheral bus architecture. The integrated Ethernet PHY eliminates the need for an external transceiver, reducing BOM cost and PCB footprint in connected designs. Hardware encryption and a random number generator on compatible family variants support secure communication.
Typical applications include industrial Ethernet gateways, factory automation controllers, building automation nodes, smart grid concentrators, and embedded web servers. The integrated 10/100 Ethernet MAC+PHY enables compact designs without external transceivers.
When designing with this part, pay attention to the 3.0 V to 3.6 V supply constraint, MAPBGA thermal management, and proper Ethernet PHY analog layout for EMI compliance. Refer to the MCF52235 reference manual for DMA and interrupt vector configuration.
This page synthesizes distributor pricing, lifecycle data, drop-in alternatives from the MCF5223x family, and design notes not found on the manufacturer product page alone.
Alternativas directas para MCF52235CVM60 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCF52235CVM60 (mismo factor de forma y huella) — difiere en Package, Ethernet, Operating Temperature, UART, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCF52236CVM60
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCF52234CVM60
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$12.55 / unidad
Ver hoja de datos →MCF52233CVM60
✅ Sustitución directa✓ En stock
$14.85 / unidad
Ver hoja de datos →MCF52232CVM60
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCF52231CVM60
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCF52235CVM60 Valores máximos y características eléctricas
| Core Architecture | ColdFire V2 (32-bit RISC) |
| Core Frequency | 60 MHz |
| Program Memory | 256 KB Flash |
| RAM | 32 KB SRAM |
| Tensión de alimentación | 3.0 V to 3.6 V |
| Encapsulado | 121-MAPBGA (12 x 12 mm) |
| Ethernet | 10/100 Mbps MAC with integrated PHY (EPHY) |
| CAN | 1 x CAN 2.0B |
| UART | 3 x UART |
| I2C | 2 x I2C |
| SPI | 1 x QSPI |
| DMA | 4-channel DMA |
| Temperatura de funcionamiento | -40 C to +85 C |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) |
Guía de configuración de pines de MCF52235CVM60 121-mapbga (12 x 12 mm)
Configuración de pines para MCF52235CVM60 (encapsulado 121-mapbga (12 x 12 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCF52235CVM60.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCF52235CVM60 es adecuado para 6 aplicacións: Industrial Ethernet Gateway, Building Automation Controller, Factory Automation Node, Smart Grid Concentrator, Embedded Web Server, Point-of-Sale Terminal Controller.
Industrial Ethernet Gateway
The MCF52235CVM60 fits industrial Ethernet gateway designs because its integrated 10/100 MAC plus on-chip PHY eliminates external transceiver circuitry, reducing BOM count in DIN-rail mounted nodes. The 60 MHz ColdFire V2 core handles TCP/IP stack, Modbus TCP, and EtherNet/IP simultaneously. With 256 KB Flash and 32 KB SRAM, sufficient headroom exists for protocol libraries plus custom application logic. The 3.3 V single-supply operation simplifies power tree design, and the MAPBGA-121 footprint supports compact form factors. Engineers should use the integrated PHY's analog ground isolation and follow NXP's reference layout for EMI compliance under industrial noise conditions.
Recomendado
Building Automation Controller
Building automation controllers benefit from the MCF52235CVM60's integrated Ethernet PHY, multiple UARTs (3x), and CAN 2.0B interface for HVAC, lighting, and access control subsystems. The 60 MHz ColdFire V2 core runs BACnet or LonWorks protocol stacks while the 4-channel DMA offloads sensor polling. Operating temperature range of -40 C to +85 C supports unheated equipment rooms. The MAPBGA-121 package requires careful thermal design under sustained load. For new designs, NXP recommends Kinetis K60 series, but existing BACnet installations can extend product life with this proven part.
Recomendado
Factory Automation Node
Factory floor controllers using the MCF52235CVM60 leverage the integrated Ethernet MAC+PHY for PROFINET or EtherCAT slave communication without external transceivers. The 256 KB Flash accommodates PROFINET stack and motion-control firmware, while the CAN 2.0B interface drives sensor/actuator networks. Hardware encryption acceleration supports secure industrial IoT protocols. The 60 MHz ColdFire V2 deterministic interrupt latency is suitable for real-time control loops. Engineers must respect MAPBGA PCB layout rules for the integrated PHY analog section to pass industrial EMC standards.
Recomendado
Smart Grid Concentrator
Smart grid concentrator designs use the MCF52235CVM60's Ethernet MAC+PHY for backhaul communication to utility head-end systems while CAN or UART connects to local meters. The hardware encryption accelerator on compatible family variants secures DLMS/COSEM traffic. Wide -40 C to +85 C operating range supports outdoor cabinet installations. 32 KB SRAM is sufficient for DLMS buffer pools. For metering aggregation nodes, the integrated PHY simplifies EMC compliance and reduces certification cost per meter cluster.
Recomendado
Embedded Web Server
Compact embedded web servers based on the MCF52235CVM60 use the integrated Ethernet MAC+PHY to provide HTTP/HTTPS access without external transceivers. The 60 MHz ColdFire V2 with hardware encryption handles TLS handshake and small web page rendering for device configuration portals. 256 KB Flash stores web assets, CGI scripts, and HTTPS certificates. Three UARTs allow bridging multiple serial devices to web interfaces. The MAPBGA-121 footprint supports compact modules under 30 x 30 mm for installation inside equipment enclosures.
Recomendado
Point-of-Sale Terminal Controller
POS terminal controllers leverage the MCF52235CVM60's Ethernet MAC+PHY for IP-based payment processing alongside UART connections to PIN pads, receipt printers, and barcode scanners. The ColdFire V2 core runs the payment application and TLS stack, while the QSPI connects to external secure elements for PCI compliance. Hardware acceleration reduces transaction latency. Integrated PHY eliminates external Ethernet components in space-constrained counter-top terminals. Choose MAPBGA-121 layout per NXP reference design to pass FCC/CE EMI certification.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCF52235CVM60 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCF52236CVM60 | MCF52234CVM60 | MCF52233CVM60 | MCF52232CVM60 | MCF52231CVM60 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (12x12 mm) | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same |
| Core Architecture | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) |
| Core Frequency | 60 MHz | 60 MHz | 60 MHz | 60 MHz | 60 MHz | 60 MHz |
| Program Memory | 256 KB Flash | 256 KB Flash | 256 KB Flash | 256 KB Flash | 128 KB Flash | 128 KB Flash |
| Ethernet MAC | 10/100 + integrated PHY | 10/100 + integrated PHY | 10/100 + integrated PHY | 10/100 + integrated PHY | 10/100 + integrated PHY | 10/100 + integrated PHY |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Integrated 10/100 Ethernet PHY eliminates external transceiver (frente a External PHY + general-purpose MCU designs)
- Industrial operating temperature range -40 to +85 C (frente a Consumer-grade 32-bit MCUs)
- Full MCF5223x family compatibility within same MAPBGA-121 footprint (frente a Discrete MCU + external MAC architecture)
Notas de diseño
The MCF52235CVM60 requires a clean 3.3 V supply within 3.0 V to 3.6 V per the NXP datasheet. Place a 10 uF bulk capacitor plus 0.1 uF decoupling near each VDD pin. The integrated Ethernet PHY draws additional current during link activity; budget at least 200 mA for the MCU core plus PHY. Use a low-noise LDO (e.g., TPS7A4533) rather than a switching regulator to minimize PHY analog supply noise.
MAPBGA-121 packages have theta_JA around 35 C/W typical for 4-layer boards. At full 60 MHz operation with Ethernet PHY active, expect junction temperatures around 60 C in 25 C ambient. For high-temperature industrial environments (-40 C to +85 C), follow NXP's thermal via recommendations under the BGA thermal pad to maintain junction temperature within the 125 C maximum. Use copper pours with thermal vias to spread heat.
MAPBGA-121 requires 4-layer or higher PCB with microvia or via-in-pad for the center balls. Isolate the integrated Ethernet PHY analog ground using a moat and bridge with a single point connection to digital ground. Follow NXP's reference layout exactly for the EPHY analog section to achieve published EMI performance. Trace lengths for Ethernet differential pairs must be impedance-controlled at 100 ohms differential per IEEE 802.3.
Do not migrate to a non-MAPBGA package without verifying pin compatibility. The MCF52235 family is offered only in MAPBGA-121; LQFP versions are not available. Ensure your firmware supports background debug mode (BDM) for production programming. Verify Flash write endurance (typically 10K cycles) and retention (10 years) when designing for firmware update scenarios. The NRND status means production planning should include last-time-buy forecasts.
Información de cumplimiento
RoHS compliant per NXP product page. AEC-Q100 not applicable - this is a general industrial MCU, not automotive qualified. For automotive applications, select Kinetis K60 or i.MX RT AEC-Q100 qualified parts.
