MCF52233CVM60 - ColdFire V2 32-bit MCU 60MHz 256KB Flash 121-MAPBGA | NXP
MPN: MCF52233CVM60 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.25 | $202.50 |
| 100 | $18 | $1,800.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $14.85 | $14,850.00 |
MCF52233CVM60 Overview
Background Knowledge: A microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (RAM), and peripherals (timers, ADCs, communication interfaces) into one package. Microcontrollers are classified by core architecture (8-bit, 16-bit, 32-bit), instruction set (RISC vs CISC), and on-board peripherals. The ColdFire V2 architecture from NXP (originally Freescale) is a 32-bit RISC ISA derived from the Motorola 68000 family, optimized for low-cost, low-power embedded applications where deterministic real-time behavior matters.
Key features include an integrated 10/100 Ethernet MAC with MII/RMII PHY interface, USB 2.0 full-speed device/host with on-chip transceiver, CAN 2.0B controller, three UARTs (one with IrDA), two I2C ports, one QSPI, a 12-bit ADC (8 channels), four 32-bit timers, plus a 4-channel DMA. The device operates from a single 3.0V to 3.6V supply and is specified over the industrial -40C to +85C temperature range.
The MAPBGA-121 package uses a 0.8mm ball pitch in a 12x12mm outline. While compact, the BGA package requires reflow assembly with X-ray inspection for quality control and typically uses a 4-layer PCB with via-in-pad or dog-bone fanouts for reliable solder joint formation.
Typical applications include industrial Ethernet gateways, building automation controllers, CAN-based factory nodes, point-of-sale (POS) terminals, and networked sensor hubs that require deterministic real-time control with on-chip wired connectivity. Designers pair this MCU with external PHYs (e.g., DP83848 for Ethernet), CAN transceivers (e.g., TJA1050), and voltage regulators such as the NXP MC34717 or NCP1117 for the 3.3V core rail.
Design consideration: When using the on-chip Ethernet MAC, route the MII/RMII traces as 50-ohm controlled-impedance lines with length matching within 50 mils. Place the external PHY within 6 inches of the MAC to keep MII signal integrity within IEEE 802.3 specification. Decouple each VDD ball pair with 100nF X7R ceramic plus a bulk 4.7uF tantalum, located within 2mm of the package.
This page synthesizes NXP datasheet specifications, distributor pricing, drop-in alternatives within the MCF5223x family, and practical design notes not consolidated in any single manufacturer document.
Drop-in alternatives for MCF52233CVM60 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF52233CVM60 (same form factor and footprint) — differing in Ethernet, Package, Core Architecture, Mounting Type, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF52235CVM60
✅ Drop-In✓ In Stock
$9.1 / Unit
View Datasheet →MCF52223CVM60
✅ Drop-In📋 Reference alternative (not in catalog)
MCF52234CVM60
✅ Drop-In✓ In Stock
$12.55 / Unit
View Datasheet →MCF52233CVM60 Maximum Ratings & Electrical Characteristics
| Core Architecture | ColdFire V2 (CFV2) 32-bit RISC |
| Maximum Clock Frequency | 60 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (industrial) |
| Package | 121-MAPBGA (12x12 mm, 0.8 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Ethernet | 10/100 MAC with MII/RMII interface |
| USB | USB 2.0 Full-Speed Device/Host/OTG with on-chip transceiver |
| CAN | 1x CAN 2.0B controller |
| UART | 3 (one with IrDA) |
| I2C | 2 |
| QSPI | 1 |
| ADC | 12-bit, 8 channels |
| DMA Channels | 16 (eDMA) |
| Timers | 4 x 32-bit (plus PIT/RTC) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
MCF52233CVM60 121-mapbga (12x12 mm, 0.8 mm pitch) Pin Configuration Guide
Pin configuration for MCF52233CVM60 (121-mapbga (12x12 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF52233CVM60.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF52233CVM60 is suitable for 6 applications: Industrial Ethernet Gateway, Building Automation Controller, Point-of-Sale (POS) Terminal, CAN-Based Factory Sensor Hub, Networked Embedded Sensor Hub, Motor Control Auxiliary Processor.
Industrial Ethernet Gateway
The MCF52233CVM60's integrated 10/100 Ethernet MAC with MII/RMII interface makes it ideal for industrial protocol gateways that bridge Modbus TCP, EtherNet/IP, or PROFINET to legacy fieldbuses. The 60 MHz ColdFire V2 core and 256 KB Flash can host lwIP plus an industrial protocol stack with deterministic real-time behavior, while the integrated DMA offloads packet handling. Pair it with an external DP83848 PHY and use the on-chip 32 KB SRAM for socket buffers; unlike a Cortex-M3 gateway with no integrated MAC, this part eliminates an external Ethernet controller and reduces BOM cost.
Recommended
Building Automation Controller
Building automation systems (HVAC, lighting, access control) benefit from the MCF52233CVM60's combination of Ethernet, CAN, and multiple UARTs on a single chip. The 60 MHz CFV2 core executes BACnet or LonWorks application logic with sub-millisecond scheduling, while the 32 KB SRAM holds real-time control tables. Designers can reduce component count by using both Ethernet (for BMS backbone) and CAN (for distributed I/O) without external bridging ICs. The industrial -40 C to +85 C temperature range covers unheated equipment rooms and outdoor enclosures.
Recommended
Point-of-Sale (POS) Terminal
POS terminals require Ethernet connectivity for transaction uploads, USB for peripherals (barcode scanner, receipt printer), and a robust MCU for payment processing. The MCF52233CVM60 integrates all three on-chip: Ethernet MAC, USB 2.0 Full-Speed OTG, and three UARTs for legacy peripherals. The 256 KB Flash hosts the payment application and TLS stack with secure boot, while the 12-bit ADC reads battery monitoring and temperature sensors. Compared to a discrete Ethernet+USB MCU solution, this single-chip approach reduces PCB area and BOM cost for compact countertop terminals.
Recommended
CAN-Based Factory Sensor Hub
The MCF52233CVM60's CAN 2.0B controller and 16-channel eDMA make it well-suited to distributed factory sensor hubs that aggregate analog and digital inputs onto a CANopen or DeviceNet backbone. The 12-bit 8-channel ADC reads process variables (pressure, flow, temperature) with hardware-triggered DMA transfers that minimize CPU load. The 60 MHz ColdFire V2 can sustain 1 Mbps CAN traffic while running application logic and storing calibration data in the 256 KB Flash, eliminating the need for an external EEPROM in many designs.
Recommended
Networked Embedded Sensor Hub
IoT edge nodes that require wired Ethernet (rather than Wi-Fi) for reliability in industrial environments can use the MCF52233CVM60 as a low-power MCU with on-chip TCP/IP support. The integrated Ethernet MAC and 256 KB Flash can host an MQTT or CoAP client with TLS, while the 32 KB SRAM holds TLS session state and sensor buffers. The ColdFire V2's deterministic interrupt latency and low-power modes (Wait/Stop) support battery-backed operation. Compared to a Cortex-M0 + external Ethernet controller, this part reduces component count and BOM cost.
Recommended
Motor Control Auxiliary Processor
The MCF52233CVM60 can serve as an auxiliary communication and supervisory processor alongside a dedicated motor controller in industrial drives and robotics. Its Ethernet and CAN interfaces provide fieldbus connectivity (EtherCAT, CANopen) while the host motor controller handles real-time PWM generation. The ColdFire V2's 60 MIPS throughput easily manages protocol stacks, diagnostics, and parameter storage in the 256 KB Flash, while the 32 KB SRAM holds non-real-time buffers. The 121-MAPBGA package enables compact integration into space-constrained drive enclosures.
Recommended
Recommended Products Summary
Engineering reference data for MCF52233CVM60 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF52235CVM60 | MCF52223CVM60 | MCF52234CVM60 |
|---|---|---|---|---|
| Package | 121-MAPBGA (12x12 mm) | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same | 121-MAPBGA (12x12 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Architecture | ColdFire V2 (CFV2) 32-bit | ColdFire V2 (CFV2) 32-bit - same | ColdFire V2 (CFV2) 32-bit - same | ColdFire V2 (CFV2) 32-bit - same |
| Max Clock Frequency | 60 MHz | 60 MHz - same | 60 MHz - same | 60 MHz - same |
| Flash Memory | 256 KB | 512 KB (+100%) | 128 KB (-50%) | 256 KB - same |
| SRAM | 32 KB | 32 KB - same | 32 KB - same | 32 KB - same |
| Ethernet MAC | 10/100 with MII/RMII | 10/100 with MII/RMII - same | 10/100 with MII/RMII - same | 10/100 with MII/RMII - same |
| USB | USB 2.0 FS OTG with on-chip PHY | USB 2.0 FS OTG with on-chip PHY - same | USB 2.0 FS OTG with on-chip PHY - same | USB 2.0 FS OTG with on-chip PHY - same |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest Flash density in MCF52223/34/35 family at 60 MHz in this specific variant (vs MCF52223CVM60)
- Cost-effective Flash density relative to MCF52235 variant (vs MCF52235CVM60)
- Integrated 10/100 Ethernet MAC eliminates external controller (vs External Ethernet IC designs (e.g., ENC28J60 + Cortex-M0))
Design Notes
The 121-MAPBGA package uses a 0.8 mm ball pitch and requires 4 or more PCB layers with microvia or via-in-pad fanouts for reliable solder joints. Per IPC-7351 and NXP design guidelines, place 100nF X7R ceramic decoupling capacitors within 2 mm of each VDD/VSS ball pair, plus one 4.7uF bulk tantalum per voltage rail. Use 50-ohm controlled-impedance traces for MII/RMII Ethernet signals and length-match within 50 mils to maintain signal integrity.
At 60 MHz the CFV2 core dissipates approximately 0.5W under typical conditions per the NXP datasheet. The MAPBGA-121 package has a junction-to-ambient thermal resistance of approximately 35 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 17 C above ambient. Industrial designs in enclosed housings should still include thermal vias under the central GND balls to maintain the device within the -40 C to +85 C operating range.
Do not exceed the 3.6V absolute maximum supply voltage on VDD - even brief transients above 3.6V can permanently damage the on-chip Flash and peripherals. Place a TVS diode (e.g., SMAJ5.0A) and a 10uF bulk capacitor at the regulator output to suppress ESD and load-dump events. Also, ensure the RSTOUT pin is pulled up with a 10k resistor if not driven externally, and configure the PLL filter components exactly per the NXP reference design to avoid jitter.
Compliance Information
RoHS and REACH compliant per NXP product page. Lead-free (Pb-free) ball terminations compatible with JEDEC J-STD-020 MSL-3 reflow. Not AEC-Q100 qualified - not suitable for automotive under-hood applications.
