MCF53014CMJ240 - ColdFire V3 MCU 240MHz, 256-MAPBGA | NXP
N.º de pieza: MCF53014CMJ240 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $36.5 | $36,50 |
| 10 | $33.2 | $332,00 |
| 100 | $29.1 | $2.910,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $24.85 | $24.850,00 |
MCF53014CMJ240 Descripción general
A microprocessor (MPU) is the highest-level processing element in an embedded system, executing application code, handling interrupts, and coordinating peripherals. The MCF53014CMJ240 belongs to the ColdFire family, a scalable 68k-derived architecture from NXP optimized for low-power, high-integration designs, sitting architecturally between 8-bit microcontrollers and full application processors. It includes an integrated 10/100 Ethernet MAC (EMAC), USB OTG, and other connectivity peripherals.
Key features of the MCF53014CMJ240 include 240 MHz ColdFire V3 core performance, 16 KB unified L1 cache, 128 KB internal SRAM with standby power support, 10/100 Ethernet MAC for networked industrial control, USB OTG host/device capability, ROMless boot from external flash, integrated crossbar switch, and an industrial -40C to +85C operating temperature range. The integrated peripherals reduce board complexity and BOM cost while supporting common industrial connectivity standards.
The ColdFire V3 architecture uses a variable-length instruction set with both A- and B-line ColdFire ISA features, an enhanced MAC module for DSP-style operations, and a Harvard-style cache structure that delivers high code density while retaining deterministic interrupt response. The 128 KB SRAM is partitioned for low-leakage standby retention, allowing fast context save/restore in power-managed designs without external memory accesses. A bus crossbar arbitrates concurrent transfers between the core, EMAC, USB, and DMA, eliminating single-master bottlenecks.
Typical applications include industrial control with embedded voice/audio processing, networked sensor gateways, factory automation controllers, embedded HMI front-ends, and remote monitoring/telemetry devices. The on-chip Ethernet MAC and USB OTG make it well suited for IP-connected industrial nodes where deterministic control and local diagnostics coexist on the same board.
When designing with the MCF53014CMJ240, plan for an external boot flash (ROMless), supply decoupling per the Freescale/NXP reference design, and careful 256-ball BGA fan-out for PCB escape. JTAG/BDM is required for in-system debug and boundary scan.
This page synthesizes distributor pricing, drop-in compatible ColdFire V3 alternatives in the same 256-ball MAPBGA, and practical design notes not found in the standalone datasheet.
Alternativas directas para MCF53014CMJ240 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCF53014CMJ240 (mismo factor de forma y huella) — difiere en Package, Manufacturer, Mounting Type, Connectivity, Ethernet.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCF53010CQT240
✅ Sustitución directa✓ En stock
$9.8 / unidad
Ver hoja de datos →MCF53013CQT240
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MCF53015CMJ240J
✅ Sustitución directa✓ En stock
$22.85 / unidad
Ver hoja de datos →MCF53014CMJ240 Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| MPN | MCF53014CMJ240 |
| Core | ColdFire V3 (Version 3) |
| Ancho del bus de datos | 32-bit |
| Frecuencia de reloj máxima | 240 MHz |
| Dhrystone MIPS | 211 MIPS at 240 MHz |
| Instruction/Data Cache | 16 KBytes unified |
| Internal SRAM | 128 KBytes (with standby power support) |
| External Memory Interface | ROMless (external flash boot) |
| Ethernet | 10/100 Ethernet MAC (EMAC) integrated |
| USB | USB OTG integrated |
| Operating Voltage | 3.3 V (core supply per datasheet) |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| Encapsulado | MAPBGA-256 (17 mm x 17 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Compliance | RoHS Compliant, Plastic MAPBGA |
| Temperature Grade | INDUSTRIAL |
Guía de configuración de pines de MCF53014CMJ240 mapbga-256 (17 mm x 17 mm)
Configuración de pines para MCF53014CMJ240 (encapsulado mapbga-256 (17 mm x 17 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCF53014CMJ240.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCF53014CMJ240 es adecuado para 6 aplicacións: Industrial Control with Embedded Voice, Networked Sensor Gateways, Factory Automation Controllers, Embedded HMI Front-Ends, Remote Monitoring and Telemetry, Industrial Voice-over-IP Intercoms.
Industrial Control with Embedded Voice
The MCF53014CMJ240 is purpose-built for industrial control nodes that combine deterministic control with on-chip audio/voice processing. Its ColdFire V3 core at 240 MHz delivers 211 Dhrystone MIPS, while the integrated 128 KB SRAM with standby support allows low-power voice activity detection during idle periods. The 10/100 Ethernet MAC (EMAC) and USB OTG connect the node to factory networks and local diagnostics. Placed as the main MPU with external flash boot, this part handles real-time control loops and concurrent voice codecs without external DSP hardware, unlike lower-end microcontrollers that cannot keep both workloads paced in real time.
Recomendado
Networked Sensor Gateways
The MCF53014CMJ240 fits IP-connected sensor gateways that aggregate analog/digital inputs and forward them over Ethernet. Its integrated 10/100 EMAC eliminates the need for an external PHY controller in many designs (an external PHY is still required), and the ColdFire V3 core processes Modbus/TCP, MQTT, or proprietary protocols at line rate. The 128 KB internal SRAM handles packet buffers and protocol stacks without external memory pressure, while 16 KB unified cache keeps interrupt response deterministic. Industrial -40C to +85C operation lets it live inside factory cabinets without additional thermal management.
Recomendado
Factory Automation Controllers
PLC-style controllers and motion sub-systems benefit from the MCF53014CMJ240's deterministic interrupt latency and integrated connectivity. The ColdFire V3 core runs ladder-logic or soft-PLC firmware at 240 MHz, while the crossbar switch arbitrates concurrent DMA, EMAC, and USB traffic without bus contention. The 256-ball MAPBGA package fits compact DIN-rail form factors with adequate thermal headroom at industrial ambient. Industrial temperature grade and RoHS compliance meet factory-floor regulatory requirements without additional BOM items.
Recomendado
Embedded HMI Front-Ends
Human-machine interfaces with local graphics rendering and networked backhaul suit the MCF53014CMJ240 architecture. The 240 MHz ColdFire V3 core drives TFT LCD controllers over the external memory bus, while the integrated EMAC pushes data to higher-level SCADA systems. The 128 KB SRAM holds compressed graphical assets and event logs, reducing flash wear. USB OTG enables local firmware updates and operator-panel mass-storage import. The MAPBGA-256 package supports compact HMI board outlines compared with TQFP equivalents in the same family.
Recomendado
Remote Monitoring and Telemetry
The MCF53014CMJ240 suits remote telemetry terminals that wake periodically, sample field sensors, and report over IP. The internal SRAM with standby power retention holds context state across sleep cycles, reducing wake time and average power. The EMAC provides the wired connectivity path, while the USB OTG serves local configuration. The -40C to +85C industrial temperature range supports outdoor cabinets and unconditioned enclosures. ColdFire V3's deterministic interrupt response ensures sensor sample timing is consistent across firmware revs, simplifying datasheet compliance testing.
Recomendado
Industrial Voice-over-IP Intercoms
VoIP and intercom terminals on the factory floor leverage the MCF53014CMJ240's integrated voice codec pathways and Ethernet MAC. The ColdFire V3 core at 240 MHz runs a lightweight VoIP stack with echo cancellation on top of the 128 KB SRAM, while the EMAC carries RTP packets onto the LAN. USB OTG supports headset configuration and firmware load. Industrial temperature and RoHS compliance match industrial-grade intercom enclosures. The same design platform scales to higher-end MCF53015 variants if a wider codec library is required.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCF53014CMJ240 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCF53010CQT240 | MCF53013CQT240 | MCF53015CMJ240J |
|---|---|---|---|---|
| Package | MAPBGA-256 (17x17 mm) | MAPBGA-256 - same | MAPBGA-256 - same | MAPBGA-256 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 |
| Maximum Clock Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Dhrystone MIPS | 211 MIPS | 211 MIPS | 211 MIPS | 211 MIPS |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB |
| Cache | 16 KB unified | 16 KB unified | 16 KB unified | 16 KB unified |
| Ethernet MAC | 10/100 EMAC | 10/100 EMAC | 10/100 EMAC | 10/100 EMAC |
| USB | USB OTG | USB OTG | USB OTG | USB OTG |
| Operating Temperature | -40C to +85C (Industrial) | Industrial | Industrial | Industrial (JEDEC) |
Diferenciadores clave
- ColdFire V3 family variant with combined control + voice codecs (frente a MCF53015CMJ240J)
- Same 256-ball MAPBGA package across the family (frente a MCF53013CQT240)
- Industrial temperature grade (-40C to +85C) (frente a Generic 32-bit MCU alternatives)
Notas de diseño
The MAPBGA-256 package dissipates moderate power at 240 MHz under typical industrial workloads. Use at least four thermal vias in the center pad array and connect them to an internal ground plane for spreader heat flow. For sealed enclosures without forced airflow, derate ambient by 10C to keep junction rise within industrial limits.
The 256-ball MAPBGA at 17 mm x 17 mm requires microvia or via-in-pad PCB technology with 0.4-0.5 mm pitch escape rules. Use the NXP reference design ball map verbatim and follow the recommended layer stack-up (typically 6-8 layers with dedicated ground/power planes). Decoupling: place 100 nF and 10 uF caps within 5 mm of each power pin pair, and a single bulk 47 uF tantalum or polymer cap at the regulator input.
Do not omit the external boot flash interface - the MCF53014CMJ240 is ROMless and requires a parallel flash/SRAM chip or serial boot source. Use JTAG/BDM headers for first-stage programming and in-system debug. Mistakenly powering up without a valid boot image causes the BDM port to enter bootstrap mode silently. Also: never leave unused balls floating in BGA; tie NC balls to ground per the reference design to avoid spurious leakage during reflow.
Información de cumplimiento
RoHS compliant plastic MAPBGA package per Freescale/NXP datasheet. Industrial temperature grade -40C to +85C. AEC-Q100 not applicable as this is an MPU for industrial use.
