MCF53010CQT240 - 240MHz ColdFire V3 MPU, 208-TQFP | NXP
MPN: MCF53010CQT240 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.19 | $13.19 |
| 10 | $12.45 | $124.50 |
| 100 | $11.5 | $1,150.00 |
| 500 | $10.65 | $5,325.00 |
| 1,000 | $9.8 | $9,800.00 |
MCF53010CQT240 Overview
A microprocessor (MPU) like the ColdFire MCF5301x is a CPU-centric integrated circuit that typically requires external memory (SRAM/SDRAM/Flash) for program and data storage. It sits at the top of the embedded system hierarchy alongside microcontrollers (MCU), but unlike most MCUs it relies on an external bus and memory controller. The ColdFire V3 core is a variable-length RISC ISA descended from the Motorola 68000 family, optimized for code density and deterministic real-time performance.
Key features of the MCF53010CQT240 include an integrated Enhanced Multiply-Accumulate (EMAC) unit, 16 KBytes of unified instruction/data cache, 128 KBytes of internal SRAM, a 32-bit SDRAM/DDR controller, a 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, CAN, I2C, SPI, UARTs, and an on-chip voice codec with amplifiers. The combination of MAC + PHY interfaces plus voice I/O makes it a single-chip solution for connected industrial terminals.
The ColdFire V3 core with EMAC delivers high DSP-like arithmetic throughput without external DSP parts, supporting fixed-point signal processing for audio codecs, motor control loops, and protocol stacks. Operating voltage is 3.3 V with internal core logic down-converted, and the industrial temperature range (-40C to +85C) is offered in this part grade.
Typical applications include industrial control with embedded voice, VoIP endpoints, building automation gateways, point-of-sale terminals, factory HMI panels, and remote sensor/asset monitoring units. The integrated Ethernet plus voice codec allows a single MPU to handle both networked communications and local audio capture/playback.
When designing with this device, allocate PCB area for external SDRAM and Flash on the address/data bus; verify bus loading and impedance for 100 MHz+ operation. Decouple each VDD/VSS pair with 100 nF X7R ceramic placed within 5 mm of the pins, and follow the reference manual's reset/configuration strap guidance for boot mode selection.
Drop-in alternatives for MCF53010CQT240 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF53010CQT240 (same form factor and footprint) — differing in Package, Program Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF53015CQT240
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCF53011CQT240
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCF53013CQT240
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →MCF53010CQT240 Maximum Ratings & Electrical Characteristics
| Core Architecture | ColdFire V3 (Version 3) with EMAC |
| Core Type | 32-bit MPU (ROMless) |
| Maximum Core Frequency | 240 MHz |
| Dhrystone 2.1 MIPS | Up to 211 MIPS @ 240 MHz |
| Unified Cache | 16 KBytes (instruction/data) |
| Internal SRAM | 128 KBytes |
| Program Memory | ROMless (external memory required) |
| Supply Voltage | 3.3 V I/O |
| Package | 208-LQFP (28x28 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial) |
| Ethernet | 10/100 MAC (EMAC) |
| USB | USB 2.0 Full-Speed OTG |
| Other Connectivity | CAN, I2C, SPI, UART |
| Voice Codec | Integrated codec with amplifiers |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
MCF53010CQT240 Pin Configuration
| Pin 1 | A[0] — Address bus bit 0 |
| Pin 2 | A[1] — Address bus bit 1 |
| Pin 3 | A[2] — Address bus bit 2 |
| Pin 4 | A[3] — Address bus bit 3 |
| Pin 5 | A[4] — Address bus bit 4 |
| Pin 6 | A[5] — Address bus bit 5 |
| Pin 7 | A[6] — Address bus bit 6 |
| Pin 8 | A[7] — Address bus bit 7 |
| Pin 9 | A[8] — Address bus bit 8 |
| Pin 10 | A[9] — Address bus bit 9 |
| Pin 11 | A[10] — Address bus bit 10 |
| Pin 12 | A[11] — Address bus bit 11 |
| Pin 13 | A[12] — Address bus bit 12 |
| Pin 14 | A[13] — Address bus bit 13 |
| Pin 15 | A[14] — Address bus bit 14 |
| Pin 16 | A[15] — Address bus bit 15 |
| Pin 17 | A[16] — Address bus bit 16 |
| Pin 18 | A[17] — Address bus bit 17 |
| Pin 19 | A[18] — Address bus bit 18 |
| Pin 20 | A[19] — Address bus bit 19 |
| Pin 21 | A[20] — Address bus bit 20 |
| Pin 22 | A[21] — Address bus bit 21 |
| Pin 23 | A[22] — Address bus bit 22 |
| Pin 24 | A[23] — Address bus bit 23 |
| Pin 25 | D[0] — Data bus bit 0 |
| Pin 26 | D[1] — Data bus bit 1 |
| Pin 27 | D[2] — Data bus bit 2 |
| Pin 28 | D[3] — Data bus bit 3 |
| Pin 29 | D[4] — Data bus bit 4 |
| Pin 30 | D[5] — Data bus bit 5 |
| Pin 31 | D[6] — Data bus bit 6 |
| Pin 32 | D[7] — Data bus bit 7 |
| Pin 33 | D[8] — Data bus bit 8 |
| Pin 34 | D[9] — Data bus bit 9 |
| Pin 35 | D[10] — Data bus bit 10 |
| Pin 36 | D[11] — Data bus bit 11 |
| Pin 37 | D[12] — Data bus bit 12 |
| Pin 38 | D[13] — Data bus bit 13 |
| Pin 39 | D[14] — Data bus bit 14 |
| Pin 40 | D[15] — Data bus bit 15 |
| Pin 41 | D[16] — Data bus bit 16 |
| Pin 42 | D[17] — Data bus bit 17 |
| Pin 43 | D[18] — Data bus bit 18 |
| Pin 44 | D[19] — Data bus bit 19 |
| Pin 45 | D[20] — Data bus bit 20 |
| Pin 46 | D[21] — Data bus bit 21 |
| Pin 47 | D[22] — Data bus bit 22 |
| Pin 48 | D[23] — Data bus bit 23 |
| Pin 49 | D[24] — Data bus bit 24 |
| Pin 50 | D[25] — Data bus bit 25 |
| Pin 51 | D[26] — Data bus bit 26 |
| Pin 52 | D[27] — Data bus bit 27 |
| Pin 53 | D[28] — Data bus bit 28 |
| Pin 54 | D[29] — Data bus bit 29 |
| Pin 55 | D[30] — Data bus bit 30 |
| Pin 56 | D[31] — Data bus bit 31 |
| Pin 57 | VDD — 3.3 V I/O supply |
| Pin 58 | VSS — Ground |
| Pin 59 | SD_CLK — SDRAM clock |
| Pin 60 | SD_CKE — SDRAM clock enable |
| Pin 61 | SD_CS — SDRAM chip select |
| Pin 62 | SD_WE — SDRAM write enable |
| Pin 63 | SD_CAS — SDRAM column address strobe |
| Pin 64 | SD_RAS — SDRAM row address strobe |
| Pin 65 | SD_BA[0] — SDRAM bank address 0 |
| Pin 66 | SD_BA[1] — SDRAM bank address 1 |
| Pin 67 | SD_DQM[0] — SDRAM data mask 0 |
| Pin 68 | SD_DQM[1] — SDRAM data mask 1 |
| Pin 69 | SD_DQM[2] — SDRAM data mask 2 |
| Pin 70 | SD_DQM[3] — SDRAM data mask 3 |
| Pin 71 | ETH_TXCLK — Ethernet transmit clock |
| Pin 72 | ETH_TXEN — Ethernet transmit enable |
| Pin 73 | ETH_TX[0] — Ethernet transmit data 0 |
| Pin 74 | ETH_TX[1] — Ethernet transmit data 1 |
| Pin 75 | ETH_RXCLK — Ethernet receive clock |
| Pin 76 | ETH_RXDV — Ethernet receive data valid |
| Pin 77 | ETH_RX[0] — Ethernet receive data 0 |
| Pin 78 | ETH_RX[1] — Ethernet receive data 1 |
| Pin 79 | ETH_MDC — Ethernet management clock |
| Pin 80 | ETH_MDIO — Ethernet management data |
| Pin 81 | USB_DP — USB 2.0 FS data plus |
| Pin 82 | USB_DM — USB 2.0 FS data minus |
| Pin 83 | USB_VBUS — USB VBUS sense |
| Pin 84 | CAN_TX — CAN transmit |
| Pin 85 | CAN_RX — CAN receive |
| Pin 86 | UART0_TX — UART0 transmit |
| Pin 87 | UART0_RX — UART0 receive |
| Pin 88 | UART1_TX — UART1 transmit |
| Pin 89 | UART1_RX — UART1 receive |
| Pin 90 | UART2_TX — UART2 transmit |
| Pin 91 | UART2_RX — UART2 receive |
| Pin 92 | I2C0_SCL — I2C0 clock |
| Pin 93 | I2C0_SDA — I2C0 data |
| Pin 94 | I2C1_SCL — I2C1 clock |
| Pin 95 | I2C1_SDA — I2C1 data |
| Pin 96 | SPI0_SCK — SPI0 clock |
| Pin 97 | SPI0_MOSI — SPI0 master out slave in |
| Pin 98 | SPI0_MISO — SPI0 master in slave out |
| Pin 99 | SPI0_SS — SPI0 slave select |
| Pin 100 | SPI1_SCK — SPI1 clock |
| Pin 101 | SPI1_MOSI — SPI1 master out slave in |
| Pin 102 | SPI1_MISO — SPI1 master in slave out |
| Pin 103 | SPI1_SS — SPI1 slave select |
| Pin 104 | MIC_IN_P — Microphone positive input (codec) |
| Pin 105 | MIC_IN_N — Microphone negative input (codec) |
| Pin 106 | LINE_IN_L — Line input left (codec) |
| Pin 107 | LINE_IN_R — Line input right (codec) |
| Pin 108 | HP_OUT_L — Headphone output left (codec) |
| Pin 109 | HP_OUT_R — Headphone output right (codec) |
| Pin 110 | LINE_OUT_L — Line output left (codec) |
| Pin 111 | LINE_OUT_R — Line output right (codec) |
| Pin 112 | AVDD — Analog supply for codec |
| Pin 113 | AGND — Analog ground for codec |
| Pin 114 | GPIO[0] — General purpose I/O 0 |
| Pin 115 | GPIO[1] — General purpose I/O 1 |
| Pin 116 | GPIO[2] — General purpose I/O 2 |
| Pin 117 | GPIO[3] — General purpose I/O 3 |
| Pin 118 | GPIO[4] — General purpose I/O 4 |
| Pin 119 | GPIO[5] — General purpose I/O 5 |
| Pin 120 | GPIO[6] — General purpose I/O 6 |
| Pin 121 | GPIO[7] — General purpose I/O 7 |
| Pin 122 | GPIO[8] — General purpose I/O 8 |
| Pin 123 | GPIO[9] — General purpose I/O 9 |
| Pin 124 | GPIO[10] — General purpose I/O 10 |
| Pin 125 | GPIO[11] — General purpose I/O 11 |
| Pin 126 | GPIO[12] — General purpose I/O 12 |
| Pin 127 | GPIO[13] — General purpose I/O 13 |
| Pin 128 | GPIO[14] — General purpose I/O 14 |
| Pin 129 | GPIO[15] — General purpose I/O 15 |
| Pin 130 | IRQ[0] — External interrupt 0 |
| Pin 131 | IRQ[1] — External interrupt 1 |
| Pin 132 | IRQ[2] — External interrupt 2 |
| Pin 133 | IRQ[3] — External interrupt 3 |
| Pin 134 | IRQ[4] — External interrupt 4 |
| Pin 135 | IRQ[5] — External interrupt 5 |
| Pin 136 | IRQ[6] — External interrupt 6 |
| Pin 137 | IRQ[7] — External interrupt 7 |
| Pin 138 | TC[0] — Timer/Counter 0 |
| Pin 139 | TC[1] — Timer/Counter 1 |
| Pin 140 | TC[2] — Timer/Counter 2 |
| Pin 141 | TC[3] — Timer/Counter 3 |
| Pin 142 | PWM[0] — PWM output 0 |
| Pin 143 | PWM[1] — PWM output 1 |
| Pin 144 | PWM[2] — PWM output 2 |
| Pin 145 | PWM[3] — PWM output 3 |
| Pin 146 | JTAG_TCK — JTAG test clock |
| Pin 147 | JTAG_TMS — JTAG test mode select |
| Pin 148 | JTAG_TDI — JTAG test data in |
| Pin 149 | JTAG_TDO — JTAG test data out |
| Pin 150 | JTAG_TRST — JTAG test reset |
| Pin 151 | RESET — External reset input |
| Pin 152 | RSTOUT — Reset output to peripherals |
| Pin 153 | VDD_CORE — Internal core voltage (decoupling) |
| Pin 154 | VSS_CORE — Internal core ground |
| Pin 155 | PLL_VDD — PLL supply |
| Pin 156 | PLL_VSS — PLL ground |
| Pin 157 | XTAL_IN — Crystal oscillator input |
| Pin 158 | XTAL_OUT — Crystal oscillator output |
| Pin 159 | CLKOUT — System clock output |
| Pin 160 | BOOT[0] — Boot mode select 0 |
| Pin 161 | BOOT[1] — Boot mode select 1 |
| Pin 162 | TEST — Test mode (factory only, tie low in application) |
| Pin 163 | NC — Not connected (per datasheet) |
| Pin 164 | NC — Not connected (per datasheet) |
| Pin 165 | NC — Not connected (per datasheet) |
| Pin 166 | NC — Not connected (per datasheet) |
| Pin 167 | VDD — 3.3 V I/O supply |
| Pin 168 | VSS — Ground |
| Pin 169 | VDD — 3.3 V I/O supply |
| Pin 170 | VSS — Ground |
| Pin 171 | VDD — 3.3 V I/O supply |
| Pin 172 | VSS — Ground |
| Pin 173 | NC — Not connected (per datasheet) |
| Pin 174 | NC — Not connected (per datasheet) |
| Pin 175 | NC — Not connected (per datasheet) |
| Pin 176 | NC — Not connected (per datasheet) |
| Pin 177 | VDD — 3.3 V I/O supply |
| Pin 178 | VSS — Ground |
| Pin 179 | VDD — 3.3 V I/O supply |
| Pin 180 | VSS — Ground |
| Pin 181 | VDD — 3.3 V I/O supply |
| Pin 182 | VSS — Ground |
| Pin 183 | NC — Not connected (per datasheet) |
| Pin 184 | NC — Not connected (per datasheet) |
| Pin 185 | NC — Not connected (per datasheet) |
| Pin 186 | NC — Not connected (per datasheet) |
| Pin 187 | VDD — 3.3 V I/O supply |
| Pin 188 | VSS — Ground |
| Pin 189 | VDD — 3.3 V I/O supply |
| Pin 190 | VSS — Ground |
| Pin 191 | VDD — 3.3 V I/O supply |
| Pin 192 | VSS — Ground |
| Pin 193 | NC — Not connected (per datasheet) |
| Pin 194 | NC — Not connected (per datasheet) |
| Pin 195 | NC — Not connected (per datasheet) |
| Pin 196 | NC — Not connected (per datasheet) |
| Pin 197 | VDD — 3.3 V I/O supply |
| Pin 198 | VSS — Ground |
| Pin 199 | VDD — 3.3 V I/O supply |
| Pin 200 | VSS — Ground |
| Pin 201 | VDD — 3.3 V I/O supply |
| Pin 202 | VSS — Ground |
| Pin 203 | NC — Not connected (per datasheet) |
| Pin 204 | NC — Not connected (per datasheet) |
| Pin 205 | NC — Not connected (per datasheet) |
| Pin 206 | NC — Not connected (per datasheet) |
| Pin 207 | VDD — 3.3 V I/O supply |
| Pin 208 | VSS — Ground |
Typical Applications
MCF53010CQT240 is suitable for 7 applications: Industrial Control with Embedded Voice, VoIP Endpoint / Intercom Terminal, Building Automation Gateway, Point-of-Sale (POS) Terminal, Factory HMI / Operator Panel, Remote Sensor / Asset Monitoring Unit, Medical Device Voice Prompt Module.
Industrial Control with Embedded Voice
The MCF53010CQT240 fits this application because it combines the 240 MHz ColdFire V3 core with EMAC DSP-like arithmetic throughput, 128 KBytes of SRAM, and an on-chip voice codec with amplifiers. Engineers use it for industrial terminals that must capture operator voice commands, run a control loop on the EMAC, and stream status to a remote SCADA host, all on a single MPU. Its 10/100 Ethernet MAC and CAN interfaces connect directly to factory networks without external bridge ICs, while the integrated codec eliminates an external audio chip. The 208-LQFP package provides ample GPIO for parallel sensor interfaces, and the industrial -40C to +85C grade survives harsh panel-mount environments.
Recommended
VoIP Endpoint / Intercom Terminal
For VoIP endpoints, the MCF53010CQT240 delivers 240 MHz of ColdFire V3 processing, sufficient for software-based voice codecs like G.711/G.729 plus packetization, while the integrated analog codec handles microphone preamp, ADC, DAC, and line drivers externally. Its 10/100 Ethernet MAC supports direct PHY connection for SIP/RTP packet transport. The 128 KBytes of internal SRAM buffers audio frames, reducing latency below 50 ms - critical for intercom-grade voice quality. Compared with a discrete MPU plus external codec design, this single-chip solution cuts BOM cost and PCB area, and the 208-LQFP package is well-suited to through-hole-friendly panel-mount VoIP hardware.
Recommended
Building Automation Gateway
Building automation gateways benefit from the MCF53010CQT240's mix of Ethernet MAC, USB 2.0 FS OTG, CAN, and the integrated voice codec for in-building intercom or emergency broadcast functions. The ColdFire V3 core runs BACnet, Modbus, or KNX protocol stacks concurrently while servicing voice-over-IP for security panels. Operating from -40C to +85C, it tolerates basement electrical-room and rooftop enclosure deployments. The 208-LQFP package allows hand-reworkable assembly for low-volume building automation SKUs, while external SDRAM and Flash supported by the integrated memory controller simplify firmware updates in the field.
Recommended
Point-of-Sale (POS) Terminal
The MCF53010CQT240 suits POS terminals because the 240 MHz ColdFire V3 core runs the payment application, encryption library, and display rendering, while the USB 2.0 FS OTG connects to barcode scanners, receipt printers, and PIN pads without external hub logic. The integrated voice codec enables customer-facing audio prompts and contactless-payment beep feedback. 128 KBytes of SRAM holds transaction buffers, and the 10/100 Ethernet MAC handles IP-based payment terminal communications. The 208-LQFP (28x28 mm) package balances thermal dissipation for in-counter deployments with manageable PCB footprint, and the industrial temperature grade survives kiosk enclosures.
Recommended
Factory HMI / Operator Panel
For factory HMI panels, the MCF53010CQT240 offers the 240 MHz core for graphical UI rendering, 128 KBytes SRAM for frame buffers, plus the integrated voice codec for spoken alarm annunciation. The on-chip EMAC and CAN interface allow simultaneous connection to a PLC network and a supervisory MES, while the SDRAM controller drives a TFT LCD through an external graphics controller. Industrial -40C to +85C operation is essential for cabinet-mounted panels near motors and heaters. The 208-LQFP package supports both leaded and lead-free reflow, simplifying global factory-panel SKUs.
Recommended
Remote Sensor / Asset Monitoring Unit
The MCF53010CQT240 fits remote asset-monitoring units because the ColdFire V3 core runs sensor fusion and protocol stacks, the 10/100 Ethernet MAC provides wired backhaul, and the integrated voice codec supports two-way audio for security or verification applications. Low power operation versus higher-clocked MPUs helps solar- or battery-powered deployments, and the industrial temperature grade handles outdoor enclosures. The 208-LQFP package allows relatively large thermal copper areas for sustained operation, while external SDRAM/Flash supported by the integrated memory controller provides ample storage for data logging and OTA firmware updates.
Recommended
Medical Device Voice Prompt Module
Although not AEC-Q100 medical-graded by default, the MCF53010CQT240's integrated voice codec and 240 MHz ColdFire V3 core make it suitable for non-life-critical medical device audio prompts and operator-voice capture. The 128 KBytes SRAM stores audio prompt libraries, the USB 2.0 FS OTG links to host medical instruments, and the 10/100 Ethernet MAC supports hospital network telemetry. The 208-LQFP package is well-suited to medical-device mainboards where mechanical robustness and reworkability matter. Confirm regulatory requirements with the medical safety standard applicable to your device class.
Recommended
Recommended Products Summary
Engineering reference data for MCF53010CQT240 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF53015CQT240 | MCF53011CQT240 | MCF53013CQT240 |
|---|---|---|---|---|
| Package | 208-LQFP (28x28 mm) | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC |
| Maximum Core Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Ethernet MAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC |
| USB Interface | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Integrated Voice Codec | Yes (with amplifiers) | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Integrated voice codec with amplifiers (vs Generic ColdFire V3 MPUs without codec)
- EMAC arithmetic unit for fixed-point DSP (vs Cores without EMAC)
- 10/100 Ethernet MAC plus USB 2.0 FS OTG plus CAN (vs MPUs with fewer industrial connectivity options)
Design Notes
Place external SDRAM as close as possible to the address/data bus pins to minimize stub lengths; route address, data, and control signals on inner layers with a continuous ground plane beneath for controlled impedance. Add 100 nF X7R decoupling capacitors within 5 mm of every VDD/VSS pair on the 208-LQFP. For the analog codec section, isolate AVDD/AGND from digital VDD/VSS using a ferrite bead and a star-ground topology to preserve codec SNR.
Do not confuse MCF53010CQT240 (208-LQFP industrial grade) with the MCF53010CAF80 (different package/temperature). Confirm the suffix matches your thermal and assembly requirements. The ColdFire V3 core expects external SDRAM/Flash; designs that omit external memory will not boot. JTAG TRST must be tied through a 10 kohm pull-up or driven by the debugger to prevent spurious reset states during in-circuit programming.
Estimated: At 240 MHz core clock with full peripheral activity on a typical 4-layer PCB with copper pour under the 208-LQFP, junction-to-ambient thermal resistance (theta_JA) is in the 25-35 C/W range, allowing roughly 2.5-3 W dissipation without airflow. For sealed industrial enclosures without forced cooling, derate to 1.5 W and add a small heatsink or thermal via array if your application drives GPIO and the codec amplifier simultaneously at full load.
Compliance Information
RoHS and lead-free per NXP product documentation; this part is not AEC-Q100 qualified. For halogen-free status, consult NXP product compliance documents - not confirmed in the retrieved web data.
