MCF5329CVM240J - 240MHz ColdFire V3 MPU 32-Bit ROMless 256-MAPBGA | NXP
N.º de pieza: MCF5329CVM240J ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.52 | $38,52 |
| 10 | $35.1 | $351,00 |
| 100 | $31.85 | $3.185,00 |
| 500 | $28.4 | $14.200,00 |
| 1.000 | $25.95 | $25.950,00 |
MCF5329CVM240J Descripción general
An MPU (microprocessor unit) is a CPU-centric integrated circuit that relies on external memory for both program and data storage, in contrast to a microcontroller (MCU) which integrates flash and SRAM on-chip. The ColdFire V3 architecture is a 32-bit variable-length RISC ISA derived from the original m68k family, optimized for embedded systems that require deterministic performance, low power, and high code density. MPUs like the MCF5329CVM240J typically sit above MCUs in the embedded hierarchy (MPU -> microcontroller -> embedded processor -> semiconductor IC), targeting applications that need external memory expansion, large address spaces, or high-throughput peripherals such as Ethernet and USB.
Key features of the MCF5329CVM240J include a 240 MHz ColdFire V3 core with EMAC (enhanced multiply-accumulate) for DSP-style operations, integrated Fast Ethernet MAC, USB On-The-Go (OTG) controller, 32 KB SRAM, eSDHC (enhanced Secure Digital Host Controller), FlexCAN, and multiple serial interfaces (UART, SPI, I2C). It supports DDR SDRAM, NAND flash, and SRAM external memories through its system bus, with flexible chip-select configuration for glueless memory expansion.
The architecture combines a Harvard-style internal bus with a unified external bus, and it is supported by NXP's CodeWarrior and Eclipse-based development tools. The 256-MAPBGA package with 1 mm pitch enables dense PCB designs suitable for industrial control, point-of-sale terminals, and connected appliances requiring Ethernet plus USB connectivity in a single chip.
Typical applications include industrial automation controllers, networked point-of-sale (POS) terminals, factory-floor Ethernet gateways, and consumer connected appliances such as smart-home hubs and networked printers. The ROMless design allows OEMs to select their preferred external flash density and supplier.
When designing with the MCF5329CVM240J, ensure proper power-rail decoupling with 100 nF ceramic capacitors placed close to each supply ball, and follow NXP's reference PCB layout for the 17 mm × 17 mm MAPBGA to avoid signal-integrity issues on the DDR memory bus. The JTAG signals require a 4-wire TAP plus optional reset for boundary-scan debugging.
This page synthesizes current distributor pricing, drop-in same-package alternatives (including JAK Electronics comparison data), and practical PCB-layout guidance not assembled in a single location by the manufacturer datasheet.
Alternativas directas para MCF5329CVM240J — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCF5329CVM240J (mismo factor de forma y huella) — difiere en Core Architecture, Program Memory Type, Package, Debug Interface, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCF5329CVM240
✅ Sustitución directa✓ En stock
$25.6 / unidad
Ver hoja de datos →MCF53281CVM240
✅ Sustitución directa✓ En stock
$25.2 / unidad
Ver hoja de datos →MCF5328CVM240
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$35 / unidad
Ver hoja de datos →MCF5327CVM240
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCF53281CVM160
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCF5329CVM240J Valores máximos y características eléctricas
| Core Architecture | ColdFire V3 (Version 3) variable-length RISC |
| Ancho del bus de datos | 32 bit |
| Frecuencia de reloj máxima | 240 MHz |
| Program Memory Type | ROMless (external flash required) |
| Encapsulado | 256-MAPBGA 17 mm × 17 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount (BGA) |
| Ethernet | Integrated Fast Ethernet MAC (10/100) |
| USB | USB On-The-Go (OTG) controller |
| SD Host Controller | eSDHC (enhanced SDHC) |
| CAN | FlexCAN |
| Serial Interfaces | UART, SPI, I2C |
| External Memory Support | DDR SDRAM, NAND flash, NOR flash, SRAM |
| JTAG Debug | Yes (IEEE 1149.1 boundary-scan + BDM) |
| Processor Series | MCF532xx |
| Estado RoHS | ROHS3 Compliant |
Guía de configuración de pines de MCF5329CVM240J 256-mapbga 17 mm × 17 mm, 1.0 mm pitch
Configuración de pines para MCF5329CVM240J (encapsulado 256-mapbga 17 mm × 17 mm, 1.0 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCF5329CVM240J.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCF5329CVM240J es adecuado para 6 aplicacións: Industrial Ethernet Gateway, Point-of-Sale (POS) Terminal, Connected Printer / MFP Controller, Factory Automation PLC, Smart Home Hub / Connected Appliance, Medical Instrument Controller.
Industrial Ethernet Gateway
The MCF5329CVM240J fits industrial Ethernet gateway designs because its integrated 10/100 MAC plus 240 MHz ColdFire V3 core provide deterministic TCP/IP throughput for protocols like Modbus TCP and PROFINET. The 256-MAPBGA package enables compact DIN-rail gateway enclosures while leaving headroom for application-level packet processing. The 32-bit ColdFire EMAC accelerates CRC and checksum operations that would otherwise burden a slower MCU; unlike discrete Ethernet controllers, on-chip MAC reduces BOM and PCB area.
Recomendado
Point-of-Sale (POS) Terminal
POS terminals benefit from the MCF5329CVM240J's combination of USB OTG for peripherals (barcode scanners, receipt printers), eSDHC for storage cards, and the Fast Ethernet MAC for IP-based payment terminals. The 240 MHz core runs payment-application stacks and TLS encryption with adequate margin, while the ROMless design lets OEMs lock firmware in certified external flash. The MAPBGA-256 footprint fits slim POS terminal enclosures and supports DDR SDRAM for transaction buffering.
Recomendado
Connected Printer / MFP Controller
Connected printers and multifunction peripherals use the MCF5329CVM240J as the main controller because the Ethernet MAC plus USB OTG support both wired LAN and direct PC connectivity, while the eSDHC accepts user SD cards. The ColdFire V3 core's EMAC accelerates raster image processing; unlike smaller Cortex-M MCUs, this MPU's 32-bit address space allows large print buffers in external DDR SDRAM. NXP's CodeWarrior IDE supports reference designs for printer-class USB stacks.
Recomendado
Factory Automation PLC
Factory-floor PLCs leverage the MCF5329CVM240J's FlexCAN interface for industrial CANopen and DeviceNet fieldbus connectivity alongside the Ethernet MAC for PROFINET/EtherNet-IP. The 240 MHz ColdFire V3 executes IEC 61131-3 logic with deterministic cycle times, and the 256-MAPBGA package's 1.0 mm pitch is suitable for industrial-temperature PCB designs. Compared to smaller MCUs, this MPU's external DDR SDRAM support enables large I/O image tables without bus bandwidth bottlenecks.
Recomendado
Smart Home Hub / Connected Appliance
Smart-home gateways and connected appliances benefit from the MCF5329CVM240J's mix of Ethernet, USB, and FlexCAN, which covers most residential protocol bridges. The 240 MHz ColdFire V3 runs lightweight Linux/uClinux stacks for Wi-Fi-BLE gateway bridging, and the ROMless design lets OEMs ship OTA-updatable firmware. The 256-MAPBGA 17 × 17 mm package fits behind appliance display panels; unlike MCUs without Ethernet, this part eliminates an external MAC+PHY pair.
Recomendado
Medical Instrument Controller
Medical instrument controllers with Ethernet connectivity use the MCF5329CVM240J for its deterministic ColdFire V3 core running safety-critical firmware in external flash. The integrated Ethernet MAC enables HL7/DICOM network stacks, while the eSDHC logs patient data to removable SD cards. The 256-MAPBGA package and external DDR support suit portable diagnostic carts; the J suffix designation supports NXP's industrial temperature screening for regulated environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCF5329CVM240J — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCF5329CVM240 | MCF53281CVM240 | MCF5328CVM240 | MCF5327CVM240 | MCF53281CVM160 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17) | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same |
| Core Clock | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 160 MHz (-33%) |
| Core Architecture | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| USB OTG | Yes | Yes | Yes | Yes | No | Yes |
| FlexCAN | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle | Active | NRND | Active | Active | Active | Active |
Diferenciadores clave
- Active production lifecycle with full peripheral set (frente a MCF5329CVM240)
- Retains USB OTG while maintaining 240 MHz (frente a MCF5327CVM240)
- Same core speed with reduced BOM risk (frente a MCF53281CVM160)
Notas de diseño
The 256-MAPBGA uses 1.0 mm ball pitch on a 17 × 17 mm grid. Per NXP reference designs, place 100 nF decoupling capacitors as close as possible to each power/ground ball pair (typically every 3-4 balls). Use a 4-layer PCB with continuous ground plane under the BGA; avoid signal traces under the package. Microvia or via-in-pad is recommended for inner balls to route out cleanly. Keep DDR traces matched within ±25 mil and length-matched within ±50 ps for reliable SDRAM operation.
Estimated: at 240 MHz with full peripheral activity, the ColdFire V3 core dissipates approximately 0.5-0.8 W. The 256-MAPBGA package has theta_JA around 25-30 C/W on a 4-layer JEDEC test board. For industrial-temperature operation up to 85°C ambient, ensure 1 oz copper pours on outer layers and thermal vias under the center power balls to keep junction temperature below 100°C. Add a small heatsink only if sealed enclosure airflow is poor.
The DDR SDRAM interface runs at up to 120 MHz with DDR. Use source-terminated clock signals (series resistor 22-33 ohm) and maintain a 50 ohm single-ended impedance on the data/address bus. Route DQS in parallel with the DQ byte group with <50 mil length mismatch. Place a reference 100 ohm differential impedance for USB OTG DP/DM pairs. JTAG TCK should be buffered if the cable exceeds 6 inches to avoid debug-probe noise coupling into the TAP state machine.
Do not assume the J suffix denotes 'industrial temperature' — check the NXP datasheet for the exact temperature grade. Verify boot mode strap pins (BM[1:0]) are pulled to the correct logic level at reset; incorrect strapping leaves the chip in serial-bootstrap mode instead of fetching from external flash. The ROMless design means no internal firmware recovery — always include a serial bootloader accessible via UART or USB for field recovery.
Información de cumplimiento
ROHS3 compliant per ICComponents distributor data and NXP product page. AEC-Q100 not applicable - this is an industrial MPU, not an automotive-qualified part. Lead-free reflow required per JEDEC J-STD-020.
