MCIMX6L8DVN10SA - i.MX6 1GHz ARM Cortex-A9 SoC | NXP
N.º de pieza: MCIMX6L8DVN10SA ✓ ActivoMCIMX6L8DVN10SA Descripción general
An application processor is a high-integration system-on-chip (SoC) that combines one or more CPU cores with on-chip peripherals, memory controllers, graphics accelerators, and connectivity IP into a single device. The MCIMX6L8DVN10SA sits within the hierarchy: ARM Cortex-A9 -> 32-bit application processor -> multi-core SoC -> embedded microprocessor -> integrated circuit. Compared with discrete host CPU + companion chip designs, this integration reduces board area, BOM count, and power dissipation while exposing Linux/Android-ready heterogeneous compute through a standardized peripheral set.
Key features include a single ARM Cortex-A9 core running up to 1 GHz with 32 KB L1 instruction cache, 32 KB L1 data cache, and 256 KB unified L2 cache. The device integrates hardware video codecs supporting 1080p30 multi-standard decoding, dual-display LCD controllers with HDMI 1.4/3-lane LVDS, a Gigabit Ethernet MAC, USB 2.0 with PHY, PCIe Gen 2.0, SATA II, and multiple SD/MMC/eMMC controllers. Operating voltage is supplied through an internal power management IC supporting 0.9 V core plus 1.8 V/3.3 V I/O rails.
The architecture pairs an ARMv7 Cortex-A9 superscalar pipeline with a Vivante 2D/3D GPU (the exact GPU configuration depends on the i.MX6 sub-variant) and dedicated hardware accelerators for video encode/decode, image processing, and security (including ARM TrustZone, secure boot, and cryptographic accelerators). Memory bandwidth is delivered through a 32-bit LPDDR2/DDR3/LVDDR3 controller with inline ECC support for safety-critical use cases.
Typical applications include industrial HMI panels, automotive infotainment and telematics, smart home gateways, medical patient-monitoring terminals, retail point-of-sale systems, digital signage media players, and ruggedized handheld terminals. The wide peripheral mix makes it suitable wherever a single-board computer is required to drive a touch display, decode video, and connect to industrial buses over a single Linux/Android software stack.
When designing with this device, allocate a 4-layer (minimum) PCB with continuous ground planes under the BGA, follow NXP hardware reference manual recommendations for decoupling and DDR routing (matched-length, impedance-controlled traces), and respect the 1.0 mm BGA pitch with proper via-in-pad or microvia stack-up. Thermal management requires either a heatsink or a minimum copper spreader area to keep junction temperature within the operating range.
This page synthesizes distributor pricing, drop-in i.MX6 family alternatives, and practical board-design notes not found in the manufacturer reference manual, helping sourcing engineers quickly evaluate whether the MCIMX6L8DVN10SA fits their application's CPU throughput, peripheral set, and power budget.
Alternativas directas para MCIMX6L8DVN10SA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX6L8DVN10SA (mismo factor de forma y huella) — difiere en Operating Temperature.
MCIMX6L7DVN10SA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6L5DVN10SA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6U8DVN10SA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S8DVN10SA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6Q8DVN10SA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6D5DVN10SA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6L8DVN10SA Valores máximos y características eléctricas
| Architecture | ARM Cortex-A9 (single core) |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum CPU Clock | 1 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 256 KB unified |
| Temperatura de funcionamiento | -40C to +85C (commercial extended) |
| Encapsulado | 432-MAPBGA (13x13 mm) |
| Tipo de montaje | Surface Mount |
| BGA Pitch | 0.8 mm |
| Memory Controller | 32-bit LPDDR2/DDR3/DDR3L |
| Display Interface | Dual LCD controller, HDMI 1.4, LVDS |
| Connectivity | Gigabit Ethernet, USB 2.0, PCIe Gen 2.0, SATA II |
| Estado RoHS | Compliant |
Guía de configuración de pines de MCIMX6L8DVN10SA 432-mapbga (13x13 mm)
Configuración de pines para MCIMX6L8DVN10SA (encapsulado 432-mapbga (13x13 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX6L8DVN10SA.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX6L8DVN10SA es adecuado para 7 aplicacións: Industrial HMI Panels, Digital Signage Media Players, Medical Patient Monitoring Terminals, Automotive Infotainment and Telematics, Smart Home and IoT Gateways, Retail Point-of-Sale Terminals, Industrial Ruggedized Handheld Terminals.
Industrial HMI Panels
Drives capacitive touch panels and multi-stream GUI rendering for factory automation. The MCIMX6L8DVN10SA's 1 GHz Cortex-A9 plus hardware 1080p video engine and dual-display controller suit HMI designs showing live process graphics, alarm logs, and SCADA dashboards from a single Linux stack. Typical build pairs the SoM with 4-8 inch LVDS/HDMI LCD and runs Qt or Chromium-based GUIs over a resistive/capacitive touch controller; the integrated Gigabit Ethernet MAC reduces component count versus discrete MAC + PHY designs and supports deterministic EtherCAT/PROFINET latency when paired with a soft-PLC RT-patch.
Recomendado
Digital Signage Media Players
Decodes and outputs 1080p30 H.264/MPEG streams to commercial displays via HDMI 1.4 or LVDS. The MCIMX6L8DVN10SA's hardware video engine offloads decode from the CPU, leaving the 1 GHz core available for content scheduling, networking, and cloud telemetry. A reference design uses 1 GB DDR3 + eMMC 5.0 boot, with the integrated SATA II port attaching an internal SSD for offline content library; this topology keeps fan-out minimum for slim enclosures rated for 24/7 operation.
Recomendado
Medical Patient Monitoring Terminals
Hosts Linux/Qt application layer for bedside vital-signs terminals, integrating touchscreen graphics and secure Ethernet backhaul. The MCIMX6L8DVN10SA's Cortex-A9 with TrustZone and secure-boot enablement supports authenticated firmware loads required for medical device cybersecurity guidance. The integrated DDR3/LPDDR2 controller with optional ECC over single rank helps detect single-bit memory faults; combined with hardware crypto accelerators (AES/SHA) the SoC handles encrypted telemetry without CPU overhead.
Recomendado
Automotive Infotainment and Telematics
Powers entry-level head units, rear-seat entertainment, and telematics control units. The MCIMX6L8DVN10SA drives an LVDS display for HVAC/climate readouts plus secondary screen for media, with the CAN bus controllers exposed via the SoC's flexible I/O muxing for body-network connectivity. Note: this MPN is the commercial/extended grade - automotive deployments requiring AEC-Q100 must select the i.MX6 auto-grade variant; verify the temperature grade with NXP's automotive part-number decoder before ECU integration.
Recomendado
Smart Home and IoT Gateways
Aggregates Zigbee/Z-Wave/Wi-Fi backhaul into a Linux-based hub orchestrating cloud APIs, local automations, and user-facing touchscreens. The MCIMX6L8DVN10SA's CPU headroom runs Docker-style containerized services (Home Assistant, Node-RED) while the integrated Ethernet MAC and USB 2.0 ports provide upstream/downstream connectivity. Power is typically delivered via PoE or 5V DC adapter; PMIC companion rail sequencing reduces eMMC and DDR corruption risk during brownouts.
Recomendado
Retail Point-of-Sale Terminals
Runs the cash-register application, payment stack, and dual-display (operator + customer) GUI on a single MCIMX6L8DVN10SA. The integrated LCD controllers drive two independent panels simultaneously, while the SATA II port hosts the encrypted transaction log; USB 2.0 connects the magnetic-stripe/PIN-pad reader peripherals. Security-sensitive code paths leverage the SoC's secure-boot and hardware RNG to satisfy PCI-PTS expectations at the platform level.
Recomendado
Industrial Ruggedized Handheld Terminals
Powers barcode scanner handhelds and warehouse tablets with the Cortex-A9 running Android or embedded Linux. The MCIMX6L8DVN10SA's wide operating-temperature range, hardware video engine for camera preview, and USB 2.0 for scanner sleds suit field-deployable battery-powered designs. Power-profile management uses the SoC's dynamic voltage/frequency scaling plus PMIC companion to extend shift-life between charges while keeping the touch UI responsive for keyboard-less entry.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX6L8DVN10SA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX6L7DVN10SA | MCIMX6L5DVN10SA | MCIMX6U8DVN10SA | MCIMX6S8DVN10SA | MCIMX6Q8DVN10SA | MCIMX6D5DVN10SA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 432-MAPBGA (13x13) | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same |
| Architecture | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core | ARM Cortex-A9 dual-core | ARM Cortex-A9 single-core | ARM Cortex-A9 quad-core | ARM Cortex-A9 dual-core |
| Maximum CPU Clock | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Core Count | 1 | 1 | 1 | 2 | 1 | 4 | 2 |
| Memory Controller | 32-bit LPDDR2/DDR3 | 32-bit LPDDR2/DDR3 | 32-bit LPDDR2/DDR3 | 64-bit LPDDR2/DDR3 | 32-bit LPDDR2/DDR3 | 64-bit LPDDR2/DDR3 | 64-bit LPDDR2/DDR3 |
| Peripheral Tier (typical) | Full i.MX6L feature set | Slightly reduced | Reduced | Full (dual-core) | Sub-variant | Full (quad-core) | Reduced (dual-core) |
| Pin-Compatible | Reference | Yes | Yes | Yes (higher power) | Yes | Yes (higher power) | Yes |
Diferenciadores clave
- Cost-optimized single-core Cortex-A9 in the i.MX6 family (frente a MCIMX6U8DVN10SA)
- Family-uniform 432-MAPBGA footprint across the i.MX6 series (frente a i.MX7/i.MX8)
- Mature Linux/Android BSP ecosystem (frente a Newer SoCs)
Notas de diseño
The 432-MAPBGA (13x13 mm) at 0.8 mm pitch requires a 4-layer (minimum) PCB stack-up with via-in-pad or microvia technology for BGA breakout. Estimated: typical 1.6 mm total board thickness using FR-4 with 1 oz Cu outer layers yields acceptable DDR3 signal integrity at 533 MT/s; high-speed SATA II and PCIe Gen 2.0 demand controlled-impedance (90 ohm differential) and length-matched traces per NXP i.MX6 hardware reference manual guidelines.
Pair the MCIMX6L8DVN10SA with the NXP TPS65217 or TPS65910 PMIC for proper power-up rail sequencing (core 1.0V first, then 1.8V I/O, then 3.3V peripherals). Estimated: total power envelope at 1 GHz / full activity is approximately 2.5-3.0 W; at idle with display suspended it drops below 0.3 W, suitable for battery-backed operation. Adding bulk decoupling (22 uF) plus 0.1 uF/1 nF local bypass near each BGA power pin is mandatory.
Estimated: at 2.5-3.0 W active power in a 432-MAPBGA with theta_JA roughly 20-25 C/W (with 4-layer PCB and minimal copper spreading), junction temperature rise is 50-75 C above ambient. For sealed enclosures without airflow, attach a small heatsink or spread copper on inner layers; for fanless industrial enclosures validate thermals in a chamber at the upper operating limit.
Do not attempt to substitute MCIMX6L8DVN10SA with i.MX7 or i.MX8 family parts - they have different packages and pinouts. The i.MX6 family shares the 432-MAPBGA footprint across L/D/Q/S/U sub-variants, but always re-validate the boot-mode strapping and peripheral mux settings after substitution; failure to update u-boot/kernel device trees is the most common cause of 'dead' boards after a variant swap.
Información de cumplimiento
RoHS compliant and lead-free per NXP product page. Not AEC-Q100 qualified - select the i.MX6 automotive-grade ordering code for vehicular applications. MSL3 moisture-sensitive handling required during PCB assembly.
