MCIMX6L8DVN10SA - i.MX6 1GHz ARM Cortex-A9 SoC | NXP
部品番号: MCIMX6L8DVN10SA ✓ 生産中MCIMX6L8DVN10SA 概要
An application processor is a high-integration system-on-chip (SoC) that combines one or more CPU cores with on-chip peripherals, memory controllers, graphics accelerators, and connectivity IP into a single device. The MCIMX6L8DVN10SA sits within the hierarchy: ARM Cortex-A9 -> 32-bit application processor -> multi-core SoC -> embedded microprocessor -> integrated circuit. Compared with discrete host CPU + companion chip designs, this integration reduces board area, BOM count, and power dissipation while exposing Linux/Android-ready heterogeneous compute through a standardized peripheral set.
Key features include a single ARM Cortex-A9 core running up to 1 GHz with 32 KB L1 instruction cache, 32 KB L1 data cache, and 256 KB unified L2 cache. The device integrates hardware video codecs supporting 1080p30 multi-standard decoding, dual-display LCD controllers with HDMI 1.4/3-lane LVDS, a Gigabit Ethernet MAC, USB 2.0 with PHY, PCIe Gen 2.0, SATA II, and multiple SD/MMC/eMMC controllers. Operating voltage is supplied through an internal power management IC supporting 0.9 V core plus 1.8 V/3.3 V I/O rails.
The architecture pairs an ARMv7 Cortex-A9 superscalar pipeline with a Vivante 2D/3D GPU (the exact GPU configuration depends on the i.MX6 sub-variant) and dedicated hardware accelerators for video encode/decode, image processing, and security (including ARM TrustZone, secure boot, and cryptographic accelerators). Memory bandwidth is delivered through a 32-bit LPDDR2/DDR3/LVDDR3 controller with inline ECC support for safety-critical use cases.
Typical applications include industrial HMI panels, automotive infotainment and telematics, smart home gateways, medical patient-monitoring terminals, retail point-of-sale systems, digital signage media players, and ruggedized handheld terminals. The wide peripheral mix makes it suitable wherever a single-board computer is required to drive a touch display, decode video, and connect to industrial buses over a single Linux/Android software stack.
When designing with this device, allocate a 4-layer (minimum) PCB with continuous ground planes under the BGA, follow NXP hardware reference manual recommendations for decoupling and DDR routing (matched-length, impedance-controlled traces), and respect the 1.0 mm BGA pitch with proper via-in-pad or microvia stack-up. Thermal management requires either a heatsink or a minimum copper spreader area to keep junction temperature within the operating range.
This page synthesizes distributor pricing, drop-in i.MX6 family alternatives, and practical board-design notes not found in the manufacturer reference manual, helping sourcing engineers quickly evaluate whether the MCIMX6L8DVN10SA fits their application's CPU throughput, peripheral set, and power budget.
ドロップイン代替品: MCIMX6L8DVN10SA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MCIMX6L8DVN10SA （同一形状・フットプリント） — 相違点: Operating Temperature.
MCIMX6L7DVN10SA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6L5DVN10SA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6U8DVN10SA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6S8DVN10SA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6Q8DVN10SA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6D5DVN10SA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MCIMX6L8DVN10SA 最大定格＆電気的特性
| Architecture | ARM Cortex-A9 (single core) |
| Core Count | 1 |
| データバス幅 | 32-bit |
| Maximum CPU Clock | 1 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 256 KB unified |
| 動作温度 | -40C to +85C (commercial extended) |
| パッケージ | 432-MAPBGA (13x13 mm) |
| 実装タイプ | Surface Mount |
| BGA Pitch | 0.8 mm |
| Memory Controller | 32-bit LPDDR2/DDR3/DDR3L |
| Display Interface | Dual LCD controller, HDMI 1.4, LVDS |
| Connectivity | Gigabit Ethernet, USB 2.0, PCIe Gen 2.0, SATA II |
| RoHS ステータス | Compliant |
MCIMX6L8DVN10SA 432-mapbga (13x13 mm) ピン配置ガイド
MCIMX6L8DVN10SA (432-mapbga (13x13 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MCIMX6L8DVN10SA.
詳細は データシート をご参照ください。
主な用途
MCIMX6L8DVN10SA の用途: 7 件s: Industrial HMI Panels, Digital Signage Media Players, Medical Patient Monitoring Terminals, Automotive Infotainment and Telematics, Smart Home and IoT Gateways, Retail Point-of-Sale Terminals, Industrial Ruggedized Handheld Terminals.
Industrial HMI Panels
Drives capacitive touch panels and multi-stream GUI rendering for factory automation. The MCIMX6L8DVN10SA's 1 GHz Cortex-A9 plus hardware 1080p video engine and dual-display controller suit HMI designs showing live process graphics, alarm logs, and SCADA dashboards from a single Linux stack. Typical build pairs the SoM with 4-8 inch LVDS/HDMI LCD and runs Qt or Chromium-based GUIs over a resistive/capacitive touch controller; the integrated Gigabit Ethernet MAC reduces component count versus discrete MAC + PHY designs and supports deterministic EtherCAT/PROFINET latency when paired with a soft-PLC RT-patch.
おすすめ
Digital Signage Media Players
Decodes and outputs 1080p30 H.264/MPEG streams to commercial displays via HDMI 1.4 or LVDS. The MCIMX6L8DVN10SA's hardware video engine offloads decode from the CPU, leaving the 1 GHz core available for content scheduling, networking, and cloud telemetry. A reference design uses 1 GB DDR3 + eMMC 5.0 boot, with the integrated SATA II port attaching an internal SSD for offline content library; this topology keeps fan-out minimum for slim enclosures rated for 24/7 operation.
おすすめ
Medical Patient Monitoring Terminals
Hosts Linux/Qt application layer for bedside vital-signs terminals, integrating touchscreen graphics and secure Ethernet backhaul. The MCIMX6L8DVN10SA's Cortex-A9 with TrustZone and secure-boot enablement supports authenticated firmware loads required for medical device cybersecurity guidance. The integrated DDR3/LPDDR2 controller with optional ECC over single rank helps detect single-bit memory faults; combined with hardware crypto accelerators (AES/SHA) the SoC handles encrypted telemetry without CPU overhead.
おすすめ
Automotive Infotainment and Telematics
Powers entry-level head units, rear-seat entertainment, and telematics control units. The MCIMX6L8DVN10SA drives an LVDS display for HVAC/climate readouts plus secondary screen for media, with the CAN bus controllers exposed via the SoC's flexible I/O muxing for body-network connectivity. Note: this MPN is the commercial/extended grade - automotive deployments requiring AEC-Q100 must select the i.MX6 auto-grade variant; verify the temperature grade with NXP's automotive part-number decoder before ECU integration.
おすすめ
Smart Home and IoT Gateways
Aggregates Zigbee/Z-Wave/Wi-Fi backhaul into a Linux-based hub orchestrating cloud APIs, local automations, and user-facing touchscreens. The MCIMX6L8DVN10SA's CPU headroom runs Docker-style containerized services (Home Assistant, Node-RED) while the integrated Ethernet MAC and USB 2.0 ports provide upstream/downstream connectivity. Power is typically delivered via PoE or 5V DC adapter; PMIC companion rail sequencing reduces eMMC and DDR corruption risk during brownouts.
おすすめ
Retail Point-of-Sale Terminals
Runs the cash-register application, payment stack, and dual-display (operator + customer) GUI on a single MCIMX6L8DVN10SA. The integrated LCD controllers drive two independent panels simultaneously, while the SATA II port hosts the encrypted transaction log; USB 2.0 connects the magnetic-stripe/PIN-pad reader peripherals. Security-sensitive code paths leverage the SoC's secure-boot and hardware RNG to satisfy PCI-PTS expectations at the platform level.
おすすめ
Industrial Ruggedized Handheld Terminals
Powers barcode scanner handhelds and warehouse tablets with the Cortex-A9 running Android or embedded Linux. The MCIMX6L8DVN10SA's wide operating-temperature range, hardware video engine for camera preview, and USB 2.0 for scanner sleds suit field-deployable battery-powered designs. Power-profile management uses the SoC's dynamic voltage/frequency scaling plus PMIC companion to extend shift-life between charges while keeping the touch UI responsive for keyboard-less entry.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MCIMX6L8DVN10SA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MCIMX6L7DVN10SA | MCIMX6L5DVN10SA | MCIMX6U8DVN10SA | MCIMX6S8DVN10SA | MCIMX6Q8DVN10SA | MCIMX6D5DVN10SA |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 432-MAPBGA (13x13) | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same |
| Architecture | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core | ARM Cortex-A9 dual-core | ARM Cortex-A9 single-core | ARM Cortex-A9 quad-core | ARM Cortex-A9 dual-core |
| Maximum CPU Clock | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Core Count | 1 | 1 | 1 | 2 | 1 | 4 | 2 |
| Memory Controller | 32-bit LPDDR2/DDR3 | 32-bit LPDDR2/DDR3 | 32-bit LPDDR2/DDR3 | 64-bit LPDDR2/DDR3 | 32-bit LPDDR2/DDR3 | 64-bit LPDDR2/DDR3 | 64-bit LPDDR2/DDR3 |
| Peripheral Tier (typical) | Full i.MX6L feature set | Slightly reduced | Reduced | Full (dual-core) | Sub-variant | Full (quad-core) | Reduced (dual-core) |
| Pin-Compatible | Reference | Yes | Yes | Yes (higher power) | Yes | Yes (higher power) | Yes |
主な差別化要因
- Cost-optimized single-core Cortex-A9 in the i.MX6 family （vs MCIMX6U8DVN10SA)
- Family-uniform 432-MAPBGA footprint across the i.MX6 series （vs i.MX7/i.MX8)
- Mature Linux/Android BSP ecosystem （vs Newer SoCs)
設計ノート
The 432-MAPBGA (13x13 mm) at 0.8 mm pitch requires a 4-layer (minimum) PCB stack-up with via-in-pad or microvia technology for BGA breakout. Estimated: typical 1.6 mm total board thickness using FR-4 with 1 oz Cu outer layers yields acceptable DDR3 signal integrity at 533 MT/s; high-speed SATA II and PCIe Gen 2.0 demand controlled-impedance (90 ohm differential) and length-matched traces per NXP i.MX6 hardware reference manual guidelines.
Pair the MCIMX6L8DVN10SA with the NXP TPS65217 or TPS65910 PMIC for proper power-up rail sequencing (core 1.0V first, then 1.8V I/O, then 3.3V peripherals). Estimated: total power envelope at 1 GHz / full activity is approximately 2.5-3.0 W; at idle with display suspended it drops below 0.3 W, suitable for battery-backed operation. Adding bulk decoupling (22 uF) plus 0.1 uF/1 nF local bypass near each BGA power pin is mandatory.
Estimated: at 2.5-3.0 W active power in a 432-MAPBGA with theta_JA roughly 20-25 C/W (with 4-layer PCB and minimal copper spreading), junction temperature rise is 50-75 C above ambient. For sealed enclosures without airflow, attach a small heatsink or spread copper on inner layers; for fanless industrial enclosures validate thermals in a chamber at the upper operating limit.
Do not attempt to substitute MCIMX6L8DVN10SA with i.MX7 or i.MX8 family parts - they have different packages and pinouts. The i.MX6 family shares the 432-MAPBGA footprint across L/D/Q/S/U sub-variants, but always re-validate the boot-mode strapping and peripheral mux settings after substitution; failure to update u-boot/kernel device trees is the most common cause of 'dead' boards after a variant swap.
コンプライアンス情報
RoHS compliant and lead-free per NXP product page. Not AEC-Q100 qualified - select the i.MX6 automotive-grade ordering code for vehicular applications. MSL3 moisture-sensitive handling required during PCB assembly.
