MCIMX6Q7CVT08AE - i.MX 6Quad MPU 800MHz ARM Cortex-A9 | NXP
N.º de pieza: MCIMX6Q7CVT08AE ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $74.2 | $742,00 |
| 100 | $68.9 | $6.890,00 |
| 500 | $63.4 | $31.700,00 |
| 1.000 | $58.75 | $58.750,00 |
MCIMX6Q7CVT08AE Descripción general
An applications processor is a system-on-chip (SoC) that integrates one or more CPU cores with GPUs, memory controllers, multimedia accelerators, and a rich set of peripheral interfaces into a single device. The i.MX 6 family sits in the high-performance tier of NXP's MPU portfolio, spanning single-core (i.MX 6Solo), dual-core (i.MX 6Dual), and quad-core (i.MX 6Quad) variants all sharing the same heterogeneous multiprocessing architecture and pin compatibility within a given package class.
Key features of the MCIMX6Q7CVT08AE include a quad-core Cortex-A9 subsystem with NEON SIMD and VFPv3, hardware-accelerated 1080p video decode/encode via the VPU, a Vivante GC2000 GPU supporting OpenGL ES 3.0 and OpenCL, dual Gigabit Ethernet MACs, USB 2.0 with PHY, HDMI 1.4a transmitter, MIPI-DSI, and PCIe 2.0. The device also integrates a multi-channel audio codec interface, asynchronous sample rate converter, and enhanced write-through I-cache for predictable performance.
Architecturally, the i.MX 6Quad uses a 40 nm CMOS process with Smart Speed Technology to switch between independent power domains for the four Cortex-A9 cores, the GPU, and the peripherals. This dynamic voltage and frequency scaling (DVFS) allows the MPU to drop into low-power retention modes when CPU-bound tasks are idle, while keeping peripherals such as Ethernet active.
Typical applications include industrial HMI panels, automotive infotainment systems (when qualified under the AE suffix designation), home gateways, digital signage, medical imaging terminals, and smart appliances. The dual display capability through LVDS + HDMI or MIPI-DSI + LVDS makes it well-suited for multi-screen installations. When integrating this part, pay attention to PCB stack-up requirements for the 624-pin FCBGA: 0.8 mm ball pitch, microvia-in-pad recommended, with matched-impedance routing on DDR3 traces.
Alternativas directas para MCIMX6Q7CVT08AE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX6Q7CVT08AE (mismo factor de forma y huella) — difiere en Core Speed, Display Interfaces, Mounting Type, Package, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCIMX6Q7CVT08AC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6Q7CVT08AD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6D7CVT08AD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S7CVM08AD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6Q4AVT10AC
✅ Sustitución directa✓ En stock
$44.8 / unidad
Ver hoja de datos →MCIMX6Q7CVT08AE Valores máximos y características eléctricas
| Series | i.MX 6Quad |
| Core Processor | ARM Cortex-A9 |
| Number of Cores | 4 |
| Core Speed | 800 MHz |
| GPU | Vivante GC2000 (3D + 2D) |
| Encapsulado | 624-FCBGA, 0.8 mm pitch, 21 x 21 mm |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 1 MB unified |
| Process Technology | 40 nm CMOS |
| Temperatura de funcionamiento | Industrial: -40C to +105C (TJ) |
| DDR Interface | DDR3 / DDR3L / LPDDR2, 64-bit, up to 533 MHz |
| Ethernet | 2x 10/100/1000 Mbps MAC with IEEE 1588 |
| USB | 1x USB 2.0 OTG + 1x USB 2.0 host with integrated PHY |
| Display Interfaces | HDMI 1.4a, MIPI-DSI (2-lane), LVDS (2-ch, 24-bit) |
| PCIe | 1x PCIe 2.0 (x1 lane) |
| Video Acceleration | VPU (1080p60 decode + 1080p30 encode) |
| Tipo de montaje | Surface Mount, BGA |
| Estado RoHS | Compliant |
Guía de configuración de pines de MCIMX6Q7CVT08AE 624-fcbga, 0.8 mm pitch, 21 x 21 mm
Configuración de pines para MCIMX6Q7CVT08AE (encapsulado 624-fcbga, 0.8 mm pitch, 21 x 21 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX6Q7CVT08AE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX6Q7CVT08AE es adecuado para 6 aplicacións: Industrial HMI Control Panels, Automotive Infotainment Systems, Multi-Screen Digital Signage, Medical Imaging Terminals, Smart Home Gateways, Single-Board Computers (SBCs).
Industrial HMI Control Panels
The MCIMX6Q7CVT08AE delivers four Cortex-A9 cores at 800 MHz and a Vivante GC2000 GPU, providing the throughput required for Qt/QML-based industrial touchscreens. Its dual-display support via HDMI plus LVDS allows one panel for status and another for diagnostics. The 40 nm process and industrial temperature grade make the part reliable at -40C to +105C junction. NXP's PF0100 PMIC plus the MCIMX6Q7CVT08AE produces a compact HMI subsystem with proven long-term software support through the i.MX 6 BSP, reducing certification cost for IEC 61131-2 industrial systems.
Recomendado
Automotive Infotainment Systems
The MCIMX6Q7CVT08AE quad-core layout excels at running instrument-cluster graphics alongside rear-seat entertainment off the same SoC, with hardware VPU handling 1080p decode in parallel. Its hardware-accelerated Vivante GC2000 GPU meets the rendering requirements for Apple CarPlay-class overlays. Combined with AEC-Q100 PMIC support and industry-leading long-term BSP commitments, the part reduces manufacturer support costs for vehicles with 10+ year lifecycles. For full automotive-grade AEC-Q100 qualification the related MCIMX6Q4AVT10AC variant should be evaluated.
Recomendado
Multi-Screen Digital Signage
With HDMI 1.4a plus dual-channel LVDS plus MIPI-DSI, the MCIMX6Q7CVT08AE can drive three independent displays from a single SoC - useful for multi-screen retail signage and transit information boards. The integrated GC2000 shader pipeline handles modest 3D animation while the VPU decodes H.264 streams from local storage or network. The 64-bit DDR3 controller feeds the display FIFOs without tearing, and the industrial temperature rating suits outdoor kiosks. The platform's long BSP support aligns with 7-10 year digital signage field lifecycles.
Recomendado
Medical Imaging Terminals
The MCIMX6Q7CVT08AE enables medical modality terminals such as ultrasound carts and patient monitors by combining quad-core Cortex-A9 performance with deterministic PCIe 2.0 attachment to FPGAs or ultrasound front-ends. Its support for LPDDR2 with ECC mode facilitates the data integrity many medical devices require. The hardware VPU accelerates review-loop encoding at 1080p, while dedicated LVDS port drives high-resolution grayscale panels. NXP's long-term BSP commitment reduces the regulatory burden of medical software updates over the 10+ year device lifespan.
Recomendado
Smart Home Gateways
The MCIMX6Q7CVT08AE's dual Gigabit Ethernet MACs with IEEE 1588 hardware timestamping suit it for residential gateways bridging Thread, ZigBee, and Wi-Fi radios into the home router fabric. The VPU handles IP-camera stream aggregation without consuming the application cores, and the Cortex-A9 SIMD acceleration accelerates AES-128 for VPN tunnels. The industrial temperature range supports unventilated gateways placed in utility closets. NXP's validated Linux BSP reduces integration time for new radio protocols entering the home.
Recomendado
Single-Board Computers (SBCs)
The MCIMX6Q7CVT08AE powers industrial ARM-based SBCs for prototyping and OEM embedded systems, leveraging the i.MX SABRE reference platform for immediate bring-up. Engineers benefit from the abundant Linux and Yocto documentation, plus community mainlining that keeps new kernel features working. The 624-FCBGA package challenges hobbyists but rewards production designs with NXP-grade reliability. Pairing the SoC with a discrete DDR3 SODIMM and PCIe-based Wi-Fi yields a flexible SBC that scales from kiosk to router applications.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX6Q7CVT08AE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX6Q7CVT08AC | MCIMX6Q7CVT08AD | MCIMX6D7CVT08AD | MCIMX6S7CVM08AD | MCIMX6Q4AVT10AC |
|---|---|---|---|---|---|---|
| Package | 624-FCBGA, 0.8 mm pitch | 624-FCBGA, 0.8 mm pitch - same | 624-FCBGA, 0.8 mm pitch - same | 624-FCBGA, 0.8 mm pitch - same | 624-FCBGA, 0.8 mm pitch - same | 624-FCBGA, 0.8 mm pitch - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Quad-core ARM Cortex-A9 | Quad-core ARM Cortex-A9 | Quad-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Single-core ARM Cortex-A9 | Quad-core ARM Cortex-A9 |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 1.0 GHz (option) |
| GPU | Vivante GC2000 | Vivante GC2000 | Vivante GC2000 | Vivante GC2000 | Vivante GC880 | Vivante GC2000 |
| Temperature Grade | Industrial (-40C to +105C) | Commercial (0C to +95C) | Industrial | Industrial | Commercial | Automotive Grade 3 |
| AEC-Q100 | Not qualified | Not qualified | Not qualified | Not qualified | Not qualified | Qualified |
| Approx Unit Price (USD) | 78.50 | 72.00 | 78.50 | 62.00 | 42.00 | 85.00 |
Diferenciadores clave
- Same silicon, lower temperature grade at lower cost (frente a MCIMX6Q7CVT08AC)
- Quad-core delivers 2x throughput vs dual-core (frente a MCIMX6D7CVT08AD)
- Automotive-grade certification unlocks in-vehicle use (frente a MCIMX6Q4AVT10AC)
- GC2000 vs GC880 GPU option (frente a MCIMX6S7CVM08AD)
Notas de diseño
The MCIMX6Q7CVT08AE uses a 624-FCBGA package at 0.8 mm ball pitch. NXP Hardware Development Guide recommends an 8-layer PCB with microvia-in-pad technology, 0.4 mm via drill, and 1.0 mm via pad for the BGA breakouts. Matched 50 ohm and 100 ohm differential traces are required on DDR3 lines; failure to maintain impedance will cause DDR3 training to fail at boot.
Estimated thermal dissipation: at full quad-core load the MCIMX6Q7CVT08AE consumes approximately 3 W. The 624-FCBGA package has a theta_JB of around 2 C/W, so a 25 x 25 mm thermal ground pad on the top layer plus a small 15 x 15 mm heatsink keeps junction rise under 30C above ambient. Industrial-grade design should target max junction of 105C with derating; use MC34712 thermal sensor to monitor.
The MCIMX6Q7CVT08AE requires a multi-rail PMIC such as NXP's PF0100 or PF3000 to supply the 1.0 V core, 1.35 V DDR3, 1.8 V LDO, and 3.3 V I/O voltages with proper sequencing. The core rail must ramp up before the DDR rail; reverse sequencing can latch-up the I/O. Add 10 uF ceramic + 22 uF bulk decoupling on each rail near the MPU pins.
Do not pull BOOT_MODE pins HIGH during early bring-up without confirming oscillator-stable state, or the MPU may enter USB serial downloader instead of booting from NAND/eMMC. Many design teams find boot-mode confusion the most common early-ramp-up issue. Verify the 24 MHz crystal meets NXP's 50 ppm stability requirement before debugging further.
MIPI-DSI and HDMI traces must maintain 100 ohm differential impedance and length-matching within 0.13 mm to pass TCON training. Add common-mode chokes on both DSI lanes near the connector. For LVDS, route each pair on the same layer without plane splits and keep total length below 200 mm to stay within clock recovery margins.
Información de cumplimiento
RoHS and REACH compliant per NXP product declarations. Industrial-grade (E suffix), not automotive-grade - choose MCIMX6Q4AVT10AC for AEC-Q100 projects. Halogen-free per NXP environmental compliance datasheet.
