MCIMX6Q4AVT10AC - i.MX 6Quad 1GHz ARM Cortex-A9 MPU | NXP
MPN: MCIMX6Q4AVT10AC ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $67.5 | $67.50 |
| 10 | $62 | $620.00 |
| 100 | $55.5 | $5,550.00 |
| 500 | $49.2 | $24,600.00 |
| 1,000 | $44.8 | $44,800.00 |
MCIMX6Q4AVT10AC Overview
An applications processor is a system-on-chip (SoC) designed to run high-level operating systems (typically Linux or Android) and execute complex user-facing software such as graphical user interfaces, media playback, and connectivity stacks. The i.MX 6Quad sits at the top of the i.MX 6 family hierarchy, which spans from single-core i.MX 6Solo up through dual-core i.MX 6Dual and quad-core i.MX 6Quad variants, all built on a 40 nm process node. Within the broader taxonomy, this part belongs to: applications processor -> microprocessor unit (MPU) -> integrated circuit -> semiconductor.
Key features include heterogeneous multicore architecture with four ARM Cortex-A9 cores, ARMv7-A instruction set, NEON SIMD media engine, hardware-accelerated graphics (2D and 3D GPU), and integrated multimedia blocks for video encode/decode. The device also provides a rich set of peripherals including PCIe, SATA, MIPI CSI/DSI, USB, Gigabit Ethernet, and multiple connectivity options. Power management is handled through NXP's smart speed technology, allowing dynamic voltage and frequency scaling.
The i.MX 6Quad architecture uses a symmetric multiprocessing (SMP) configuration where all four Cortex-A9 cores share a unified L2 cache and coherent interconnect. This provides linear scaling for multi-threaded workloads while maintaining single-core compatibility for legacy code. Process technology is 40 nm CMOS, and the package is a 21x21 mm FCBGA with 624 balls.
Typical applications include automotive infotainment head units, industrial human-machine interfaces (HMIs), medical imaging terminals, and point-of-sale systems. The quad-core performance enables simultaneous execution of an OS, a graphics UI, media codecs, and connectivity stacks.
When designing with this MPU, allocate careful PCB layout effort for the FCBGA's high-speed serial interfaces and provide adequate power-rail decoupling. Note that this part is now NRND (Not Recommended for New Designs); engineers should evaluate the latest i.MX 8 family for new product introductions while keeping the i.MX 6Quad viable for mature designs with long lifecycles.
This page synthesizes distributor pricing, drop-in alternatives within the i.MX 6 family, and practical design notes not found in the standalone manufacturer datasheet.
Drop-in alternatives for MCIMX6Q4AVT10AC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX6Q4AVT10AC (same form factor and footprint) — differing in Mounting Type, Package, Series, Display Interfaces, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX6Q4AVT08AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6D4AVT10AC
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →MCIMX6D4AVT08AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q5EYM10AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q4CVM08AC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX6Q4AVT10AC Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | i.MX 6 |
| Core Processor | ARM Cortex-A9 |
| Number of Cores | 4 |
| Core Speed | 1.0 GHz |
| Data Bus Width | 32-bit |
| Package | 624-FCBGA (21x21 mm) |
| Process Technology | 40 nm CMOS |
| Operating Temperature Grade | Automotive |
| Supply Voltage | 1.8 V / 2.8 V / 3.3 V |
| Mounting Type | Surface Mount (FCBGA) |
| Program Memory Type | External (boot from ROM/SD/eMMC) |
| RAM Controllers | LPDDR2, DDR3, DDR3L (16/32-bit) |
| Graphics | Integrated 2D/3D GPU, Vivante GC2000 + GC355 + GC320 |
| Display Interfaces | MIPI DSI, HDMI, LVDS |
| Camera Interfaces | MIPI CSI, parallel CSI |
| Connectivity | PCIe, SATA, USB, Gigabit Ethernet, CAN |
| Lifecycle Status | NRND (Not Recommended for New Designs) |
| RoHS Status | Compliant |
MCIMX6Q4AVT10AC 624-fcbga (21x21 mm) Pin Configuration Guide
Pin configuration for MCIMX6Q4AVT10AC (624-fcbga (21x21 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX6Q4AVT10AC.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX6Q4AVT10AC is suitable for 6 applications: Automotive Infotainment Head Unit, Industrial Human-Machine Interface (HMI), Medical Imaging Terminal, Point-of-Sale (POS) Terminal, Digital Signage and Media Player, Connected IoT Gateway.
Automotive Infotainment Head Unit
The MCIMX6Q4AVT10AC's quad-core 1.0 GHz performance enables simultaneous execution of an infotainment OS (Linux/Android), HMI graphics, media playback, and connectivity stacks required by modern in-vehicle head units. Its automotive AEC-Q100 temperature grade and 40 nm low-power process support reliable operation across vehicle cabin environments, while the integrated Vivante GC2000 GPU drives full-HD+ displays through MIPI DSI, LVDS, or HDMI. Paired with NXP's automotive PMICs and audio codecs, it forms the heart of branded infotainment platforms from global Tier-1 suppliers.
Recommended
Industrial Human-Machine Interface (HMI)
Industrial HMIs require responsive touch-driven graphics, multi-protocol connectivity, and deterministic real-time response. The MCIMX6Q4AVT10AC delivers quad-core processing for Qt/QML-based GUI rendering at 1080p, while its PCIe, USB, and Gigabit Ethernet interfaces integrate with PLCs, sensors, and fieldbus networks. The automotive-grade temperature profile also extends to outdoor and factory-floor HMIs where conventional commercial-grade parts would fail thermal reliability targets.
Recommended
Medical Imaging Terminal
Portable medical imaging terminals - point-of-care ultrasound, patient monitors, and endoscopy carts - rely on the MCIMX6Q4AVT10AC to drive high-resolution displays, process imaging pipelines in parallel across multiple cores, and maintain HIPAA-compliant encryption. The NEON SIMD engine accelerates image-processing kernels (filtering, FFT, color-space conversion) at low power consumption, while the integrated GPU composites 2D/3D visualizations. The automotive-grade temperature profile supports operation in ambulances and field-clinic environments.
Recommended
Point-of-Sale (POS) Terminal
Modern POS terminals require robust cryptographic performance (PCI PTS), multi-touch UI rendering, receipt printing, payment terminal integration, and connectivity to backend systems. The MCIMX6Q4AVT10AC's quad-core architecture parallelizes secure-element communications, GUI rendering, and peripheral I/O without UI lag. The integrated Gigabit Ethernet and PCIe interfaces support high-speed payment processing, while the display pipeline drives integrated touchscreens through LVDS or MIPI DSI.
Recommended
Digital Signage and Media Player
Commercial digital signage players benefit from the MCIMX6Q4AVT10AC's hardware-accelerated video decode (up to 1080p60 H.264), dual-display output through HDMI/LVDS, and network connectivity for content management. The quad-core performance handles 4K content pipelines and real-time analytics overlays. The automotive temperature grade supports outdoor kiosk operation in direct sunlight, while the integrated GPU renders smooth transitions and 3D animations without an external media SoC.
Recommended
Connected IoT Gateway
Industrial IoT gateways aggregate data from multiple field sensors (Modbus, CAN, RS-485) and forward to cloud platforms via Ethernet, Wi-Fi, or cellular. The MCIMX6Q4AVT10AC's quad-core performance allows concurrent protocol parsing, edge analytics, secure TLS termination, and local storage management. Its PCIe and SATA interfaces accommodate cellular modems and SSD storage, while the automotive temperature grade supports deployment in uncontrolled environments including outdoor enclosures and vehicle telematics units.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX6Q4AVT10AC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX6Q4AVT08AD | MCIMX6D4AVT10AC | MCIMX6D4AVT08AD | MCIMX6Q5EYM10AD |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-FCBGA (21x21) | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same |
| Core Count | 4 (Quad) | 4 (Quad) | 2 (Dual) | 2 (Dual) | 4 (Quad) |
| Core Speed | 1.0 GHz | 0.8 GHz (-20%) | 1.0 GHz | 0.8 GHz (-20%) | 1.0 GHz |
| Architecture | ARM Cortex-A9 | ARM Cortex-A9 | ARM Cortex-A9 | ARM Cortex-A9 | ARM Cortex-A9 |
| Temperature Grade | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) | Automotive (AEC-Q100) |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Lifecycle Status | NRND | NRND | NRND | Active | NRND |
Key Differentiators
- Automotive AEC-Q100 qualified at 1.0 GHz (vs MCIMX6Q4CVM08AC)
- Highest available clock in the i.MX 6Quad automotive family (vs MCIMX6Q4AVT08AD)
- Quad-core vs Dual-core configuration (vs MCIMX6D4AVT10AC)
Design Notes
The FCBGA 624 package requires careful thermal management. Estimated: at 1.0 GHz full load across 4 cores, the SoC dissipates 3-5 W depending on workload. Use a 4-layer PCB with a ground plane directly beneath the BGA, plus thermal vias in the land pattern. For sustained workloads, attach a small heatsink with thermal interface pad - the automotive temperature grade requires operation across -40C to +85C ambient.
Route high-speed differential pairs (MIPI DSI/CSI, PCIe, SATA, USB, HDMI) with controlled 90-ohm differential impedance and length-matching within 150 mils. Place the DDR3/LPDDR2 memory as close to the SoC memory controller balls as routing allows; keep trace lengths matched within 25 mils to preserve signal integrity. Use microstrip with continuous reference plane on Layer 2 for all DDR signals.
Power sequencing is critical: the SoC requires specific rail-on and rail-off sequences managed by a companion PMIC such as NXP PF3000 or PF4200. Estimated: peak current draw on the core rail (VDD_ARM) reaches 2-3 A at full turbo frequency. Decouple each supply pin with 100 nF X7R ceramic plus a 22 uF bulk capacitor. Provide 4 or more decoupling capacitors per supply domain to handle dynamic load steps.
Common pitfalls: (1) Omitting boot mode configuration resistors - the SoC samples boot pins at reset and incorrect values result in no boot. (2) Neglecting the JTAG test access port (TAP) routing, which becomes impossible to debug without it. (3) Using lead-free SAC305 solder without proper BGA reflow profile - peak temperature 245C with 60s TAL is typical. (4) Under-estimating PCB warpage on the large 21x21 mm land pattern - require flatness within 0.1 mm.
Compliance Information
AEC-Q100 qualified per automotive-grade part designation. RoHS and REACH compliance verified via NXP product page. Halogen-free status not explicitly stated in available data.
