MCIMX6S6AVM08AB - i.MX 6Solo ARM Cortex-A9 800MHz MPU | NXP
N.º de pieza: MCIMX6S6AVM08AB ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.8 | $3.180,00 |
| 500 | $28.45 | $14.225,00 |
| 1.000 | $25.1 | $25.100,00 |
MCIMX6S6AVM08AB Descripción general
An applications processor (AP) is a system-on-chip (SoC) designed to run rich operating systems such as Linux, Android, or Windows Embedded while handling multimedia workloads. It sits at the top of the embedded processor hierarchy above microcontrollers (MCUs) and DSPs, integrating CPU cores, GPUs, memory controllers, display interfaces, and connectivity peripherals on a single die. The i.MX 6 family from NXP occupies the mid-range of this hierarchy, balancing performance, power consumption, and multimedia capability for consumer and industrial products.
Key features include a single ARM Cortex-A9 core at 800 MHz, integrated 2D and 3D graphics acceleration, multi-format HD video engine, and a rich set of peripherals including USB, Ethernet, PCI Express, and MIPI display/camera interfaces. The device supports DDR3 and LPDDR2 memory and includes hardware accelerators for video decoding and encoding at up to 1080p resolution. The 624-pin MAPBGA package exposes the full set of multimedia and connectivity interfaces.
At the architecture level, the i.MX 6Solo integrates a Neon SIMD engine for media processing, an L2 cache controller, and multiple power domains for granular clock gating. The Cortex-A9 core includes out-of-order execution and a VFPv3 floating-point unit suitable for graphics and signal-processing tasks. The platform targets products where a single high-performance core is sufficient and power efficiency is critical.
Typical applications include industrial HMI panels, point-of-sale terminals, portable medical devices, automotive infotainment, smart home gateways, and consumer multimedia devices. The wide peripheral set and Linux/Android support make it suitable for products requiring rich UI capabilities combined with deterministic real-time response.
When designing with this device, ensure PCB layout follows the MAPBGA escape routing guidelines with matched-length DDR traces. Thermal management is required for sustained 800 MHz operation, and the boot configuration pins must be set according to the desired boot source (NOR, NAND, SD, or eMMC).
This page synthesizes distributor pricing, lifecycle status, drop-in alternatives from the i.MX 6 family, and practical design notes not found in the standalone datasheet.
Alternativas directas para MCIMX6S6AVM08AB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX6S6AVM08AB (mismo factor de forma y huella) — difiere en Package, RoHS Status, Core Architecture, Display Interface, Memory Interface.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCIMX6S6AVM08ACR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S6AVM08ABR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S4AVM08ACR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S5AVM08AB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S6AVM08AC
✅ Sustitución directa✓ En stock
$21.45 / unidad
Ver hoja de datos →MCIMX6S6AVM08AB Valores máximos y características eléctricas
| Series | i.MX 6 |
| Core Processor | ARM Cortex-A9 |
| Number of Cores | 1 |
| Core Speed | 800 MHz |
| Encapsulado | 624-pin MAPBGA (21 x 21 mm) |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | -40C to +125C |
| Memory Type Supported | DDR3, LPDDR2 |
| Graphics Acceleration | 2D + 3D (Vivante GC880 + GC320) |
| Video Engine | Multi-format HD 1080p decode/encode |
| Display Interface | MIPI-DSI, LVDS, parallel RGB |
| Camera Interface | MIPI-CSI |
| Connectivity | USB 2.0, Gigabit Ethernet, PCIe 2.0 |
| Estado RoHS | Compliant |
| Nivel MSL | 3 |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) |
Guía de configuración de pines de MCIMX6S6AVM08AB 624-pin mapbga (21 x 21 mm)
Configuración de pines para MCIMX6S6AVM08AB (encapsulado 624-pin mapbga (21 x 21 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX6S6AVM08AB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX6S6AVM08AB es adecuado para 6 aplicacións: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Portable Medical Devices, Smart Home Gateways and Hubs, Consumer Multimedia Devices, Automotive Infotainment (Non-Safety-Critical).
Industrial Human-Machine Interface (HMI) Panels
The MCIMX6S6AVM08AB's integrated Vivante GC880/GC320 GPU and 1080p video engine drive rich LVDS and parallel-RGB LCD panels typical of factory automation HMIs. The single Cortex-A9 at 800 MHz runs Linux with Qt or Crank Storyboard graphics stacks while maintaining deterministic response for touch and control loops. Its 624-pin MAPBGA exposes dual LVDS channels and 4-wire resistive/capacitive touch interfaces.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals need a balance of UI capability, peripheral integration, and security. The MCIMX6S6AVM08AB's integrated Gigabit Ethernet, USB 2.0, and PCIe 2.0 interfaces connect directly to payment terminals, printers, and barcode scanners without external bridges. Its hardware crypto engine (CAAM) accelerates AES, DES, and RSA operations required for PCI PTS compliance, while the Cortex-A9 runs Android or embedded Linux for payment applications.
Recomendado
Portable Medical Devices
Portable medical devices such as patient monitors and diagnostic imagers benefit from the MCIMX6S6AVM08AB's low-power Smart Speed Technology and integrated MIPI-CSI camera interface. The 800 MHz Cortex-A9 runs display, data acquisition, and wireless connectivity tasks simultaneously, while the LPDDR2 memory controller minimizes idle power consumption. The wide operating temperature range (-40C to +125C) supports use in ambulances and field hospitals.
Recomendado
Smart Home Gateways and Hubs
Smart home gateways aggregate Zigbee, Z-Wave, Wi-Fi, and Bluetooth peripherals while running a Linux-based automation stack. The MCIMX6S6AVM08AB's PCIe 2.0 and USB 2.0 interfaces connect to multiple radio modules concurrently, and its Gigabit Ethernet MAC supports router-class throughput. The integrated GPU provides smooth WebKit/Chromium-based UI rendering for touchscreen controllers, eliminating the need for an external graphics processor.
Recomendado
Consumer Multimedia Devices
Set-top boxes, digital signage players, and portable media players leverage the MCIMX6S6AVM08AB's 1080p H.264 video decode/encode and HDMI transmitter for premium A/V output. The Cortex-A9 with Neon SIMD accelerates audio DSP workloads, while the dedicated image processing unit (IPU) handles camera input for video doorbells and surveillance recorders. Linux and Android BSPs are mature, with reference designs available from NXP's partner network.
Recomendado
Automotive Infotainment (Non-Safety-Critical)
While the MCIMX6S6AVM08AB itself is consumer/industrial grade, NXP offers the MCIMX6S6AVM08AC variant for automotive infotainment head units where AEC-Q100 grade 3 qualification is sufficient. The processor drives high-resolution dashboard displays, runs Android Automotive, and provides rear-seat entertainment via the integrated video engine. CAN and LIN connectivity through the FlexCAN and UART peripherals enables body-network integration.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX6S6AVM08AB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX6S6AVM08ACR | MCIMX6S6AVM08ABR | MCIMX6S4AVM08ACR | MCIMX6S5AVM08AB | MCIMX6S6AVM08AC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-pin MAPBGA (21 x 21 mm) | 624-pin MAPBGA (21 x 21 mm) - same | 624-pin MAPBGA (21 x 21 mm) - same | 624-pin MAPBGA (21 x 21 mm) - same | 624-pin MAPBGA (21 x 21 mm) - same | 624-pin MAPBGA (21 x 21 mm) - same |
| Core | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core | ARM Cortex-A9 single-core |
| Clock Speed | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Silicon Revision | 1.1 | 1.1 | 1.1 | 1.0 | 1.1 | 1.1 |
| AEC-Q100 Qualification | Not qualified (consumer/industrial) | Grade 3 qualified | Not qualified | Grade 3 qualified | Not qualified | Grade 3 qualified |
| Packaging Carrier | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tray | Tray |
| Lifecycle Status | NRND | Active | NRND | Active | NRND | Active |
Diferenciadores clave
- Single-core 800 MHz Cortex-A9 in 624-pin MAPBGA with full multimedia integration (frente a MCIMX6S4AVM08ACR)
- Tray packaging variant for low-volume prototype and pre-production builds (frente a MCIMX6S6AVM08ABR)
- Consumer/industrial grade without AEC-Q100 cost adder (frente a MCIMX6S6AVM08AC)
Notas de diseño
The 624-pin MAPBGA uses 0.8 mm ball pitch requiring microvia or sequential lamination PCB fabrication. Place the device on the top layer with all signals breaking out on inner layers via dog-bone fan-out. Keep DDR3/LPDDR2 traces matched within 50 mils and length-matched within 25 ps to maintain signal integrity at 400 MHz. Connect the central ground balls to an internal ground plane with thermal vias (0.2 mm drill, 0.4 mm pad) on a 1 mm grid.
Estimated: at 800 MHz sustained operation with GPU and video engine active, junction temperature rise is approximately 35-40C above ambient on a 4-layer JEDEC-compliant test board. The MAPBGA's central thermal balls must be soldered to a copper pour of at least 25 x 25 mm with thermal vias for production designs. Industrial designs targeting +85C ambient should characterize thermal performance in the final enclosure.
Do not confuse the i.MX 6Solo (single core) with i.MX 6DualLite (dual core) variants - they share the same 624-pin MAPBGA footprint but have different firmware initialization sequences. Verify boot mode pins (BOOT_MODE[1:0], BOOT_CFG pins) match your boot source (NOR, NAND, SD, eMMC, or SPI). The NRND lifecycle status means new designs should target i.MX 8M or i.MX 93 families with updated BSPs.
Información de cumplimiento
RoHS and REACH compliant per NXP product declarations. Consumer/industrial grade - choose MCIMX6S6AVM08AC variant for AEC-Q100 qualified automotive applications. Lead-free BGA balls, halogen-free package mold compound.
