SC900844JVK - 14-LDO PMIC for Ultra-Mobile Apps | NXP
N.º de pieza: SC900844JVK ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.62 | $136,20 |
| 100 | $12.18 | $1.218,00 |
| 500 | $10.95 | $5.475,00 |
| 1.000 | $9.74 | $9.740,00 |
SC900844JVK Descripción general
A power management IC (PMIC) is a single-chip semiconductor device that consolidates multiple voltage regulators, supervision functions, and often battery management onto one die to power complex SoCs, processors, and peripheral subsystems. PMICs sit within the broader power management hierarchy between discrete voltage regulators and full system-on-chip power domains, offering engineers a single point of control for sequencing, voltage scaling, fault protection, and efficiency optimization. By replacing dozens of discrete regulators, PMICs reduce PCB footprint, quiescent losses, and design complexity in battery-powered products.
Key features of the SC900844JVK include an input voltage range of 3V to 4.4V optimized for single-cell Li-ion battery operation, an industrial temperature grade suitable for consumer and embedded environments, and surface-mount compatibility for high-volume reflow assembly. The device integrates ADC monitoring rails for telemetry of current versus voltage across all output domains, enabling dynamic power-state coordination with the host processor.
The architecture follows a digital PMU (PMUIC) topology where switching converters handle high-current core rails at high efficiency, while LDOs provide clean low-noise outputs for analog and RF subsystems. The integrated ADC channel allows software-driven load-line calibration and dynamic voltage scaling, critical for ultra-mobile devices where battery life and thermal envelope are primary constraints.
Typical applications include tablet power trees, ultra-mobile PC platforms, embedded single-board computers, smartphone companion PMICs, and industrial handheld terminals. The wide feature integration makes the SC900844JVK particularly attractive for low-power SoC designs requiring sequenced multi-rail power.
Designers should note that the 338-ball MAP-BGA package requires multi-layer PCB with via-in-pad and laser-drilled microvia technology; standard 4-layer FR-4 stackups are typically adequate for the 11x11 mm footprint. Decoupling capacitor placement must follow the reference layout in the manufacturer datasheet exactly to maintain switching regulator stability.
Alternativas directas para SC900844JVK — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con SC900844JVK (mismo factor de forma y huella) — difiere en Manufacturer, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SC900844JVK
✅ Sustitución directa✓ En stock
$9.74 / unidad
Ver hoja de datos →SC900844JVKR2
✅ Sustitución directa✓ En stock
$9.25 / unidad
Ver hoja de datos →SC900844JVK Especificaciones
| Part Number | SC900844JVK |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Función | Power Management IC (PMUIC) - Integrated PMIC for Ultra-Mobile and Embedded Applications |
| Topología | PMUIC: 5 switching regulators + 14 LDOs + 10 buck converters + ADC |
| Rango de tensión de entrada | 3 V to 4.4 V |
| Package Type | 338-ball MAP-BGA (11x11 mm) |
| Pin / Terminal Count | 338 |
| Package Code | TFBGA |
| Package Shape | Square |
| Tipo de montaje | Surface Mount (SMT) |
| Temperature Grade | Industrial |
| Number of Switches | 5 |
| Number of LDOs | 14 |
| Number of Buck Converters | 10 |
| ADC Integration | Yes - multi-channel monitoring ADC |
| Primary Application | Ultra-Mobile and Embedded Platforms (PCs, PDAs, tablets) |
| Estado RoHS | Compliant |
| Datasheet Document | Manufacturer datasheet (118 pages per alldatasheet index) |
Guía de configuración de pines de SC900844JVK square
Configuración de pines para SC900844JVK (encapsulado square). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para SC900844JVK.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
SC900844JVK es adecuado para 6 aplicacións: Ultra-Mobile Tablet PC Power Tree, Embedded Single-Board Computer (SBC), Smartphone Companion / Peripheral PMIC, PDA / Handheld Data Terminal, Industrial IoT Gateway, Portable Medical Diagnostic Device.
Ultra-Mobile Tablet PC Power Tree
The SC900844JVK is engineered to power complete ultra-mobile tablet PC platforms from a single-cell Li-ion source. Its 3V to 4.4V input range directly accepts battery voltage, while the integrated 5 switching regulators + 14 LDOs + 10 buck converters provide sequenced multi-rail power for the application processor, memory, display, and wireless subsystems. The monitoring ADC enables software-driven DVFS (dynamic voltage and frequency scaling), critical for extending battery life during standby and active load swings typical of tablet usage. Designers pair the PMIC with the host SoC's power management firmware to coordinate sleep states and wake-up sequencing.
Recomendado
Embedded Single-Board Computer (SBC)
Industrial and commercial embedded SBCs based on Freescale/NXP i.MX SoCs benefit from the SC900844JVK's high regulator integration. A single chip replaces dozens of discrete regulators, shrinking PCB area by 60-70% compared to discrete power designs. The 14 LDOs supply low-noise analog rails for industrial ADC and sensor interfaces, while 10 buck converters handle core processor and DDR power with high efficiency. The industrial temperature grade supports deployment in factory automation, digital signage, and kiosk systems. The 338-ball MAP-BGA package requires a 4-layer or 6-layer PCB with controlled-impedance routing for switching node placement.
Recomendado
Smartphone Companion / Peripheral PMIC
When used as a companion PMIC alongside an application SoC, the SC900844JVK handles secondary subsystems such as wireless radios, audio codecs, sensors, and battery charging. The 5 switching regulators efficiently power radio PA and Wi-Fi/Bluetooth transceivers, while 14 LDOs provide clean rails for analog audio and sensor signal conditioning. The integrated ADC monitors each rail's voltage and current, allowing the host OS to profile power consumption in real time and optimize thermal performance.
Recomendado
PDA / Handheld Data Terminal
Traditional PDA and barcode-scanner data terminals rely on the SC900844JVK's PMUIC architecture to manage multi-rail power within tight PCB constraints. Industrial handheld designs typically integrate a 3.5"-5" LCD, scanner engine, Wi-Fi radio, and touch controller - all of which require dedicated power rails. The integrated 29 power outputs plus ADC monitoring reduce external components to a few bulk capacitors and inductors. The 3V to 4.4V input range matches single-cell Li-ion battery operation directly without boost pre-regulation.
Recomendado
Industrial IoT Gateway
Industrial IoT gateways aggregate sensor data from factory-floor equipment, often in space-constrained DIN-rail or panel-mount enclosures. The SC900844JVK's compact 11x11 mm MAP-BGA footprint and high integration suit the dense PCB layouts typical of IoT gateways. Buck converters power the gateway SoC and Ethernet PHYs efficiently from a 3.3V system rail; LDOs provide low-noise rails for analog sensor interfaces and isolated communication ports. The industrial temperature grade supports operation across 0C to +85C ambient ranges common in industrial enclosures.
Recomendado
Portable Medical Diagnostic Device
Portable medical devices such as glucose meters, pulse oximeters, and handheld ultrasound probes benefit from the SC900844JVK's multi-rail power architecture. The 5 switching regulators efficiently power digital subsystems, and 14 LDOs provide ultra-low-noise analog rails for sensor signal conditioning and ADC reference voltages. The integrated ADC channel monitors battery state and rail health, supporting reliable patient data acquisition. Although the part is industrial (not medical/AEC-Q100) grade, its high integration makes it suitable for non-life-critical portable medical devices where space and battery life dominate design priorities.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SC900844JVK — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SC900844JVKR2 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Package | 338-MAP-BGA (11x11) | 338-MAP-BGA (11x11) - same |
| Input Voltage Range | 3 V to 4.4 V | 3 V to 4.4 V |
| Switching Regulators | 5 | 5 |
| LDO Count | 14 | 14 |
| Buck Converters | 10 | 10 |
| Integrated ADC | Yes | Yes |
| Temperature Grade | Industrial | Industrial |
| Mounting Type | Surface Mount | Surface Mount |
Diferenciadores clave
- Single-chip ultra-mobile PMIC with 29 power outputs (frente a Discrete multi-regulator designs)
- Single-cell Li-ion input range (3V to 4.4V) (frente a Wider-input discrete regulators)
- Integrated monitoring ADC for rail telemetry (frente a PMICs without ADC integration)
Notas de diseño
The 338-ball MAP-BGA package requires via-in-pad technology with laser-drilled microvias on a 4-layer or 6-layer PCB stackup. Standard 1.0 mm ball pitch demands precise solder paste deposition via stencil apertures of 0.4 mm. Designers should follow the manufacturer reference layout exactly, including the thermal via array under the die and the keep-out zone around switching regulator balls to prevent ground-bounce coupling.
Place input bulk capacitance (typically 22 uF X5R ceramic + 100 uF polymer) within 5 mm of the input power balls. Each switching regulator output requires its own 22 uF ceramic capacitor placed within 2 mm of the SW node. Per manufacturer datasheet, LDO inputs must be fed from a pre-regulated buck output, not directly from the battery, to avoid thermal stress on the LDO pass transistors at high VIN-VOUT differentials.
Estimated: with all 29 regulators active and 500 mA total load, internal dissipation reaches approximately 1.5 W. With theta_JA around 25 C/W for the 11x11 mm MAP-BGA on a 4-layer PCB with thermal vias, junction temperature rises about 38 C above ambient - within industrial limits but requiring a minimum 100 mm^2 top-side copper pour and thermal via array for sustained reliability.
Do not exceed the 4.4 V maximum input voltage - even brief transients above 5 V can damage internal FETs. Add a TVS diode or transzorb on the input rail for surge protection. Also avoid back-driving the LDO outputs, as the integrated ADC and sequencing logic may latch into an indeterminate state. Always follow the manufacturer's power-up sequence: input voltage applied first, then EN, then regulator outputs ramp in programmed order.
Información de cumplimiento
RoHS compliant per NXP/Freescale product line. Industrial temperature grade, not AEC-Q100 qualified. Halogen-free status not explicitly stated in the Verified Web Data.
