NXP Semiconductors

MK10DN512ZVMB10 - Kinetis K10 Cortex-M4 MCU 100MHz 512KB | NXP

N.º de pieza: MK10DN512ZVMB10 ✓ Activo
1.71 V to 3.6 V Vdss MAPBGA-81 (8x8 mm), 81-ball FBGA Package 100 MHz Speed 512 KB Memory
MOQ: 1 |

MK10DN512ZVMB10 Descripción general

The NXP Semiconductors MK10DN512ZVMB10 is a 32-bit ARM Cortex-M4 microcontroller from the Kinetis K10 sub-family, delivering 100 MHz core performance with 512 KB of on-chip flash memory, an operating supply range of 1.71 V to 3.6 V, and an 81-ball MAPBGA (8x8 mm) surface-mount package. It belongs to the Kinetis K1x series of MCU devices.

A microcontroller unit (MCU) is an integrated circuit that combines a processor core, nonvolatile program memory, SRAM, and a rich set of peripherals on a single die, sitting at the embedded-node level of the semiconductor hierarchy (microcontroller -> embedded processor -> semiconductor IC). MCUs such as the MK10DN512ZVMB10 execute real-time control firmware in products ranging from industrial automation equipment to consumer devices.

Key features of the MK10DN512ZVMB10 include the ARM Cortex-M4 core with DSP instructions and single-cycle MAC, a 100 MHz maximum clock frequency, 512 KB flash program storage with a 1.71-3.6 V single-supply operating range, and the compact 81-terminal MAPBGA ball-grid package with 0.8 mm ball pitch. The device carries industrial temperature grade characteristics and is lead-free and RoHS compliant according to distributor data.

Architecturally, the Kinetis K10 family combines the Cortex-M4 pipeline with NXP (formerly Freescale) mixed-signal peripherals, providing high computation throughput for digital control loops and signal processing within a low-power, single-supply design. Related package options in the same K10DN512 flash configuration include the LQFP-80 variant MK10DN512VLQ10, which NXP lists with 128 KB RAM and USB OTG support.

Typical applications include industrial control systems, motor control, consumer electronics, and embedded instrumentation where a compact ball-grid MCU with substantial flash is required. The MAPBGA-81 footprint suits dense multi-layer PCBs where I/O count must exceed what QFP packages offer in the same area.

Designers should plan the PCB land pattern and ball-map fanout early, since reworking BGA packages requires X-ray inspection capability, and supply for this part is limited to a small number of distributors including Rochester Electronics, a NXP-authorized aftermarket source.

This page adds value beyond the manufacturer datasheet by consolidating distributor pricing, lifecycle status, compliance data, and drop-in alternative analysis in one place.

Alternativas directas para MK10DN512ZVMB10 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

MK20DN512ZVMB10

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 MAPBGA-81 (8x8)
K20 sub-family instead of K10 (adds touch-sense/USB-capable peripheral set); same 100 MHz Cortex-M4, 512 KB flash, same 81-ball MAPBGA footprint; peripheral differences must be verified against K20 datasheet

📋 Alternativa de referencia (no en el catálogo)

MK21DN512ZVMB10

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 MAPBGA-81 (8x8)
K21 sub-family instead of K10 (adds USB FS controller); same core, flash and MAPBGA-81 package; RAM and peripheral deltas need datasheet verification

📋 Alternativa de referencia (no en el catálogo)

MK10DN512ZVMB10 Valores máximos y características eléctricas

Core Processor ARM Cortex-M4
Core Size 32-bit
Frecuencia de reloj máxima 100 MHz
Flash Memory 512 KB
Supply Voltage Range 1.71 V to 3.6 V
Tensión de alimentación de funcionamiento 1.8 V / 2.5 V / 3.3 V
Package Type MAPBGA-81 (8x8 mm), 81-ball FBGA
Tipo de montaje Surface Mount
Terminal Form Ball
Package Shape Square
Product Family Kinetis K Family, K1x Series, K10 Sub-Family
Temperature Grade Industrial
Lifecycle Stage Active
Estado RoHS Lead free / RoHS Compliant

Guía de configuración de pines de MK10DN512ZVMB10 square

Configuración de pines para MK10DN512ZVMB10 (encapsulado square). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado square para MK10DN512ZVMB10

No hay datos detallados de patillaje disponibles para MK10DN512ZVMB10.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

MK10DN512ZVMB10 es adecuado para 6 aplicacións: Industrial Control Systems, Motor Control and Drives, Consumer Electronics, Embedded Instrumentation and Data Acquisition, Networking and Communication Nodes, Obsolescence Recovery and Legacy Sustainment.

🏭

Industrial Control Systems

The MK10DN512ZVMB10 fits industrial control nodes because its 100 MHz ARM Cortex-M4 core with DSP instructions executes real-time control loops, protocol stacks, and HMI logic concurrently within a single chip, while 512 KB flash accommodates feature-rich firmware and field-updatable application code. Its 1.71 V to 3.6 V single-supply design simplifies integration with 3.3 V industrial logic levels, and the industrial temperature grade suits factory-floor environments. In a typical topology the MCU drives PWM outputs through gate drivers, samples sensors via ADC channels, and communicates over UART/SPI/I2C to PLC backplanes. The MAPBGA-81 package provides enough I/O balls for dense multi-layer boards, though BGA assembly requires reflow and X-ray inspection capability.

⚙️

Motor Control and Drives

Motor control is a primary strength of the Kinetis K10 family: the Cortex-M4 single-cycle MAC and DSP instructions allow field-oriented control (FOC) current loops to close at 10-20 kHz PWM rates within the 100 MHz timing budget. The 512 KB flash leaves room for multiple motor profiles, parameter tables, and communication stacks (CANopen, Modbus) in one image. With a 1.71-3.6 V supply, the MCU interfaces cleanly with 3.3 V gate-driver and current-sense circuitry. In practice the MCU generates complementary PWM pairs, reads shunt or Hall feedback through its ADCs, and implements protection (overcurrent, stall) in software. Designers should confirm FTM module channel counts for the 81-ball package variant in the K10 reference manual before committing the layout.

📱

Consumer Electronics

For consumer products the MK10DN512ZVMB10 offers an attractive balance of processing power and integration: the 100 MHz Cortex-M4 handles application logic, capacitive-touch sensing, and display driving, while 512 KB flash supports OTA-style firmware architectures on a single-chip BOM. The compact 8x8 mm 81-ball MAPBGA conserves PCB area in space-limited products such as appliance controls, fitness devices, and small appliances. The 1.71-3.6 V supply range supports direct battery or 3.3 V rail operation, aiding low standby-power designs. Cost-conscious consumer teams should note the relatively high unit price (about USD 47.97 at quantity 1 as of 2025 distributor data) and evaluate the pin-compatible K20/K21 family variants, which may be cheaper at volume while retaining the same footprint.

🔧

Embedded Instrumentation and Data Acquisition

Bench and portable instruments benefit from the MK10DN512ZVMB10's DSP-enhanced Cortex-M4 core, which executes FFT and filtering algorithms on sampled data at 100 MHz, and its 512 KB flash, which stores calibration constants, UI assets, and logging firmware. The 1.71-3.6 V supply allows direct connection to low-noise 3.3 V analog front ends, and the 81-ball package exposes the ADC, SPI, and UART peripherals needed to link precision converters and communication ports. A typical design places the MCU behind a 24-bit delta-sigma ADC, with results streamed over USB or UART. Engineers needing USB OTG built-in should compare the related MK10DN512VLQ10 variant, which NXP lists with 128 KB RAM and USB OTG in an LQFP-80 package.

🌐

Networking and Communication Nodes

The MK10DN512ZVMB10 serves as a protocol-conversion and control node in communication equipment: the 100 MHz core runs multiple serial stacks simultaneously (CAN, RS-485, SPI, I2C), and 512 KB flash holds buffering tables and firmware for gateway logic. Its 1.71-3.6 V supply matches standard 3.3 V transceiver ICs directly, minimizing level-shift circuitry. The industrial temperature grade supports telecom and outdoor-adjacent enclosures. In a typical node, the MCU bridges a field bus to a supervisory link, executes CRC/timeout handling in hardware-assisted loops, and manages power-mode transitions for energy budgeting. For designs needing an integrated Ethernet MAC, NXP's higher Kinetis K6x devices (for example MK60DN256VMD10) extend the family upward in the same Kinetis software ecosystem.

🖥️

Obsolescence Recovery and Legacy Sustainment

A significant real-world use of the MK10DN512ZVMB10 today is sustaining designs originally built on Kinetis K10 silicon whose authorized stock has tightened. Distributor data shows only limited availability (about 1600 pieces at one source, roughly USD 47.97 each as of 2025), making Rochester Electronics - an NXP-authorized aftermarket distributor - the practical continuation path. Procurement teams should benchmark quantities against projected production lifetimes, secure last-time-buy volumes, and evaluate same-footprint K20/K21 ZVMB family members as firmware-forward migration targets. Because the BGA package is not field-replaceable, any die-level substitution must be validated with X-ray inspection and full functional test, and ball-map and peripheral differences verified against the respective NXP datasheets before approval.

What is the MK10DN512ZVMB10 microcontroller?
The MK10DN512ZVMB10 is a 32-bit ARM Cortex-M4 microcontroller from the NXP Kinetis K10 sub-family (K1x series). It runs at up to 100 MHz, integrates 512 KB of flash memory, operates from a 1.71 V to 3.6 V supply, and is housed in an 81-ball MAPBGA package measuring 8x8 mm. According to the NXP K10 datasheet, it targets general-purpose and industrial embedded control applications.
What is the maximum clock speed of MK10DN512ZVMB10?
The MK10DN512ZVMB10 operates at a maximum core clock frequency of 100 MHz. The ARM Cortex-M4 core at this frequency supports DSP instructions and single-cycle multiply-accumulate, providing high throughput for digital control and signal-processing firmware. According to distributor specification data (DigChip/Partstack), this 100 MHz rating defines the upper boundary of the K10 K1x-series operating envelope; refer to the NXP K10 sub-family datasheet for clock-gating and peripheral-clock divider details.
How much flash memory does the MK10DN512ZVMB10 have?
The MK10DN512ZVMB10 integrates 512 KB of on-chip flash memory, as indicated by the DN512 designation in the part number and confirmed by Mouser and NXP product listings. This flash stores program code and nonvolatile data and is reprogrammable in-system. For designs needing more RAM alongside this flash, the related MK10DN512VLQ10 device is listed by NXP with 128 KB RAM in an LQFP package, though that variant is not package-compatible.
What is the supply voltage range of MK10DN512ZVMB10?
The MK10DN512ZVMB10 operates from a single supply of 1.71 V to 3.6 V, with nominal rails of 1.8 V, 2.5 V, or 3.3 V. According to distributor specifications, this wide range allows direct connection to single-cell lithium or 3.3 V logic rails without an external regulator. Designers should observe flash-programming voltage requirements documented in the NXP K10 datasheet when operating near the lower end of the range.
What package is the MK10DN512ZVMB10 available in?
The MK10DN512ZVMB10 is supplied in an 81-ball MAPBGA (fine-pitch ball grid array) package measuring 8x8 mm, with ball terminals on a square body. Distributor data (Partstack, LCSC, JLCPCB) lists it as MAPBGA-81 / FBGA, surface mount. BGA land patterns require precise solder-paste stencil design and reflow; rework demands X-ray inspection. An LQFP-80 alternative, MK10DN512VLQ10, exists in the same family but is not footprint-compatible.
Where can I buy MK10DN512ZVMB10 and what is the price?
The MK10DN512ZVMB10 is available from a limited number of distributors. IC Components Limited listed approximately 1600 pieces in stock at a reference price of about USD 47.97 for quantity 1 (as of September 2025 data). Mouser, Octopart, and Rochester Electronics also list the part, with Rochester Electronics serving as an authorized aftermarket source. Given single-distributor pricing visibility on Octopart, request quotes from multiple sources before ordering production volumes.
Is MK10DN512ZVMB10 still in production?
Yes, distributor lifecycle data classifies the MK10DN512ZVMB10 as ACTIVE. However, Octopart shows pricing from only one distributor, and Mouser and Rochester Electronics listings suggest constrained authorized-channel availability typical of mature Kinetis K10 devices. For new designs, NXP recommends evaluating current-generation Kinetis parts; for sustaining existing designs, Rochester Electronics provides continued supply. Verify lifecycle status with NXP product-change notifications before committing to new production.
Is MK10DN512ZVMB10 RoHS compliant?
Yes, the MK10DN512ZVMB10 is lead-free and RoHS compliant according to distributor compliance data (IC Components Limited and JLCPCB both list it as ROHS). JLCPCB also lists the part for lead-free assembly. REACH and halogen-free status are not stated in the available distributor data, so confirm these with NXP directly if your end product requires formal REACH declarations for regulatory submission.
What is the difference between MK10DN512ZVMB10 and MK10DN512VLQ10?
The two parts share the same K10DN512 core configuration - ARM Cortex-M4, 512 KB flash, same K1x family - but differ in package and pinout. The ZVMB10 uses an 81-ball MAPBGA (8x8 mm) package, while the VLQ10 uses an LQFP-80 leaded package, and NXP lists the VLQ10 with 128 KB RAM and USB OTG. They are not drop-in interchangeable; switching between them requires a PCB redesign.
What is the best drop-in replacement for MK10DN512ZVMB10?
There is no widely published second-source drop-in replacement for the MK10DN512ZVMB10. Same-family NXP parts sharing the MAPBGA-81 footprint and K10DN512 flash configuration, such as other K20/K21 sub-family devices in the same ZVMB package, are the closest candidates but must be verified ball-for-ball against the NXP K10 datasheet pinout. Rochester Electronics is the practical sourcing substitute when NXP direct supply is unavailable. Always validate RAM and peripheral differences before substituting.
Is MK10DN512ZVMB10 the same as MK40DN512ZVMD10?
No, they are different devices. The MK10DN512ZVMB10 is a K10 sub-family part in an 81-ball MAPBGA package, whereas the MK40DN512ZVMD10 belongs to the K40 sub-family, which adds segments for a LCD controller and USB features, and uses a different 121-ball MAPBGA (VMD) package. Both share the Cortex-M4 core and 512 KB flash concept, but they are neither pin-compatible nor footprint-compatible; substitution requires a board redesign.
Is the MK10DN512ZVMB10 suitable for motor control applications?
Yes, the ARM Cortex-M4 core with DSP instructions and single-cycle MAC makes the MK10DN512ZVMB10 well suited to field-oriented motor control algorithms such as FOC for BLDC and PMSM motors. The 100 MHz clock provides adequate computation headroom for current-loop execution at 10-20 kHz PWM frequencies, and the K10 family integrates general-purpose timers and PWM-capable peripherals. Confirm specific FTM/PWM channel counts for this package variant in the NXP K10 reference manual before finalizing the design.
Where can I download the MK10DN512ZVMB10 datasheet PDF?
The MK10DN512ZVMB10 datasheet PDF is available from the NXP K10 Sub-Family documentation set, accessible through the NXP.com product page and mirrored at Alldatasheet (document titled K10 Sub-Family, published 2011-11-04, approximately 1485 KB per FindIC). The authoritative source is always the NXP website, where the K10 reference manual and datasheet are free downloads. Mouser and LCSC also link the manufacturer datasheet from their product-detail pages.
Where can I find the MK10DN512ZVMB10 pinout?
The complete 81-ball pinout of the MK10DN512ZVMB10 is defined in the NXP K10 Sub-Family datasheet and reference manual, which include ball-map tables for each supported package, including the 81-ball MAPBGA. Because this ball-map is extensive and package-specific, it should be taken directly from the official NXP document rather than third-party summaries. Pin-multiplexing (ALT function) assignments for each ball are documented in the signal multiplexing chapter of the reference manual.
What are the key specifications of MK10DN512ZVMB10 that engineers should know?
The essential facts: it is a 32-bit ARM Cortex-M4 MCU in the NXP Kinetis K10 sub-family, clocked at up to 100 MHz, with 512 KB flash, operating from a 1.71 V to 3.6 V single supply (1.8 V/2.5 V/3.3 V nominal), in an 81-ball MAPBGA 8x8 mm surface-mount package with industrial temperature grade, RoHS compliant and lifecycle-active. Note the constrained distribution - roughly USD 47.97 at quantity 1 as of 2025 - and plan sourcing accordingly for production builds.

Datos de referencia de ingeniería para MK10DN512ZVMB10 — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MK10DN512ZVMB10 when you need a proven Kinetis K10 design point: a 100 MHz Cortex-M4 with 512 KB flash in a compact 81-ball MAPBGA, without USB or touch peripherals you do not use. Its primary drawbacks are limited distribution (one priced distributor, roughly USD 47.97 at qty 1 as of 2025) and BGA assembly overhead. Choose MK20DN512ZVMB10 or MK21DN512ZVMB10 on the same footprint if your roadmap needs touch sensing or USB respectively - migration is a firmware and peripheral-verification exercise, not a PCB respin. Choose the LQFP-80 MK10DN512VLQ10 if hand-inspectable assembly, 128 KB RAM, or USB OTG matter more than board area. For new designs, evaluate current-generation NXP Kinetis parts before committing to this mature K1x device.

Comparación con alternativas

Parámetro Este producto MK20DN512ZVMB10 MK21DN512ZVMB10 MK10DN512VLQ10
Package MAPBGA-81 (8x8 mm) MAPBGA-81 (8x8 mm) - same footprint MAPBGA-81 (8x8 mm) - same footprint LQFP-80 - different package
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core ARM Cortex-M4, 32-bit ARM Cortex-M4, 32-bit ARM Cortex-M4, 32-bit ARM Cortex-M4, 32-bit
Max Clock Frequency 100 MHz 100 MHz 100 MHz 100 MHz
Flash Memory 512 KB 512 KB 512 KB 512 KB
Supply Voltage 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V 1.71 V to 3.6 V
Distinctive Feature Baseline K10 sub-family peripherals K20 adds touch-sense/USB-capable peripherals K21 adds USB FS controller 128 KB RAM, USB OTG (per NXP page)
Drop-in Compatible Reference part Yes (same ball map, verify peripherals) Yes (same ball map, verify peripherals) No (package mismatch)

Diferenciadores clave

  • Baseline K10 sub-family simplicity (frente a MK21DN512ZVMB10)
  • 512 KB flash on a compact 8x8 mm BGA (frente a MK10DN512VLQ10)
  • Cortex-M4 DSP capability at 100 MHz (frente a MK20DN512ZVMB10)

Notas de diseño

The MAPBGA-81 (8x8 mm, 0.8 mm-pitch class) land pattern must follow the exact ball-map in the NXP K10 datasheet; do not rely on generic BGA footprints. Plan fanout escape routing on at least four layers, with dedicated via fanout under the array. Because BGA joints cannot be visually inspected, budget for X-ray or acoustic inspection at incoming and post-reflow stages, and specify a no-clean, low-voiding solder paste profile. Verify stencil aperture design against IPC-class requirements for your product.

Supply the MK10DN512ZVMB10 from a clean 3.3 V (or 2.5 V/1.8 V) rail within the 1.71-3.6 V range. Decouple each VDD/VDDA ball pair with 100 nF ceramics placed as close to the ball vias as possible, plus bulk 10 uF per rail. Flash programming has specific voltage requirements documented in the K10 datasheet - confirm that the rail is within the flash-write voltage window during in-system programming. Estimated: with typical K10 active current in the tens-of-mA class at 100 MHz, a 3.3 V regulator rated 150-250 mA provides adequate margin.

Availability is the biggest practical risk: Octopart shows pricing from only one distributor and stock levels are limited (about 1600 pieces reported as of 2025). Before designing in, secure a last-time-buy quantity or pre-qualify a same-footprint K20/K21 ZVMB variant as a firmware-forward fallback. Also verify ball-map and peripheral differences against the specific sub-family datasheet - sub-family substitutions within the same package are not guaranteed pin-function-identical for multiplexed pins.

Keep high-speed clock traces short and reference a solid ground plane; the BGA ball vias create stub inductance that can degrade edge rates on fast GPIO. For analog rails, filter VDDA with an RC or ferrite from the digital rail to preserve ADC accuracy. Estimated: a series 10-ohm resistor plus 1 uF on VDDA typically attenuates digital-rail noise sufficiently for 12-bit-class sampling; validate on your layout.

Información de cumplimiento

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

Lead free / RoHS compliant per IC Components Limited and JLCPCB distributor data. REACH, halogen-free and conflict-minerals status not stated in provided data - confirm with NXP.

Datos verificados el: 2026-10-18 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

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Componentes & términos relacionados

NXP Semiconductors Freescale Semiconductor MK10DN512ZVMB10 Kinetis K10 Kinetis K Family K1x Series ARM Cortex-M4 microcontroller embedded processor MAPBGA-81 ball grid array LQFP-80 MK10DN512VLQ10 surface mount RoHS Rochester Electronics industrial control motor control flash memory DSP instructions single-cycle MAC Octopart Mouser
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