MPC8245LVV333D vs MPC8245LVV266D Comparación
Comparación detallada lado a lado de MPC8245LVV333D por NXP Semiconductors y MPC8245LVV266D por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D ObsoleteNXP Semiconductors
MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking
MPC8245LVV266D ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC8245LVV333D | MPC8245LVV266D |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,75 | $48,90 |
| Manufacturer | NXP USA Inc. (formerly Freescale / Motorola) | NXP USA Inc. |
| Product Category | Microprocessors (MPU) | — |
| Core Architecture | PowerPC 603e (Power Architecture technology) | — |
| Core Count | 1 | — |
| Ancho del bus de datos | 32-bit | — |
| Core Frequency | 333 MHz | — |
| Integrated Bridge | PCI bridge + memory controller | — |
| PCI Interface | PCI 2.2 compliant, 32-bit, up to 66 MHz | — |
| Memory Controller | 64-bit SDRAM (PC133), ROM/Flash interface | DDR SDRAM |
| Supply Voltage - Core | 2.0 V (L suffix, low-voltage core) | — |
| Supply Voltage - I/O | 3.3 V | — |
| Temperatura de funcionamiento | 0 C to +105 C (junction) | 0C to +105C (industrial, 'D' suffix) |
| Encapsulado / Carcasa | 352-TBGA (35x35 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | [DATA_NEEDED: rohs status not confirmed in verified web data] | RoHS compliant (lead-free) |
| Lead-Free / BGA Solder | [DATA_NEEDED: lead-free status not confirmed] | — |
| Part Family | — | PowerQUICC II (MPC82xx) |
| Processor Core | — | PowerPC MPC603e (32-bit Power Architecture) |
| Core Clock Speed | — | 266 MHz |
| Performance | — | 505.4 MIPS |
| Number of Cores | — | 1 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Core Voltage (Vcc) | — | 1.8 V |
| I/O Voltage | — | 3.3 V |
| Encapsulado | — | 352-TBGA (35x35 mm) |
| Packaging | — | Tray |
| Integrated PCI Bridge | — | Yes, 32-bit / 66 MHz PCI |
| Estado del ciclo de vida | — | End of Life (per NXP product page) |