MPC8271CVRMIBA - PowerQUICC II 266MHz MPU | NXP 516-BGA
N.º de pieza: MPC8271CVRMIBA ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $21.74 | $21,74 |
| 10 | $19.85 | $198,50 |
| 100 | $17.95 | $1.795,00 |
| 500 | $15.4 | $7.700,00 |
| 1.000 | $13.1 | $13.100,00 |
MPC8271CVRMIBA Descripción general
A microprocessor (MPU) is the central processing unit of an embedded system, executing operating systems, network stacks, and protocol code. The PowerQUICC II family sits in the broader taxonomy of: MPU -> embedded processor -> RISC processor -> communications processor -> networking SoC. The integrated CPM offloads DMA, HDLC, Ethernet, ATM, and serial peripherals from the core, enabling deterministic throughput without consuming CPU cycles.
Key features include 16 Kbytes of instruction cache and 16 Kbytes of data cache, a 32-bit PCI bridge, dual 10/100 Ethernet MACs, a 60x-compatible system bus, and DRAM/SDRAM memory controllers. The device operates from a 3.3 V I/O supply with a 1.5 V core voltage and supports industrial-grade temperatures from -40C to +105C.
The architecture combines a PowerPC G2_LE core with a CPM coprocessor interconnected via an internal 32-bit bus. This dual-engine design excels at packet processing because the CPM handles time-critical I/O while the core runs control-plane code. Hardware encryption and security acceleration are available on certain family members.
Typical applications include SOHO and SMB routers, integrated access devices, DSLAM line cards, wireless base-station controllers, and industrial protocol gateways. The integrated Ethernet MACs and PCI interface minimize external component count for compact networking designs.
When designing with this part, pay close attention to the 516-ball BGA routing and the multi-rail power sequencing (1.5 V core before 3.3 V I/O). Decoupling must follow NXP's reference design exactly to meet AC timing on the 60x bus.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives within the PowerQUICC II family, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MPC8271CVRMIBA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8271CVRMIBA (mismo factor de forma y huella) — difiere en Process Technology, Package, PCI Interface, Operating Temperature, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8271VRMIBA
✅ Sustitución directa✓ En stock
$53.4 / unidad
Ver hoja de datos →MPC8271ZQMIBA
✅ Sustitución directa✓ En stock
$12.85 / unidad
Ver hoja de datos →MPC8272CVRMIBA
✅ Sustitución directa✓ En stock
$62.8 / unidad
Ver hoja de datos →MPC8247CVRMIBA
✅ Sustitución directa✓ En stock
$19.95 / unidad
Ver hoja de datos →MPC8247CZQMIBA
✅ Sustitución directa✓ En stock
$21.45 / unidad
Ver hoja de datos →MPC8280VVQLDA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8271CVRMIBA Valores máximos y características eléctricas
| Core Processor | PowerPC G2_LE |
| Number of Cores | 1 Core, 32-Bit |
| Frecuencia de reloj máxima | 266 MHz |
| Co-Processor / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM, SDRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| USB | None (per datasheet) |
| Tensión de alimentación de funcionamiento | 3.3 V I/O, 1.5 V core |
| Process Technology | 0.13 µm HiP7 |
| Temperatura de funcionamiento | -40C to +105C |
| Encapsulado | 516-PBGA (TEBGA), 27x27 mm |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de MPC8271CVRMIBA 516-pbga (tebga), 27x27 mm
Configuración de pines para MPC8271CVRMIBA (encapsulado 516-pbga (tebga), 27x27 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8271CVRMIBA.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8271CVRMIBA es adecuado para 6 aplicacións: SOHO Router and Gateway, DSLAM Line Card, Wireless Base Station Controller, Industrial Protocol Gateway, VoIP Media Gateway, Network Attached Storage Controller.
SOHO Router and Gateway
The MPC8271CVRMIBA's two integrated 10/100 Ethernet MACs and CPM with offloaded HDLC/UART make it a strong fit for SOHO routers, integrated access devices, and residential gateways. The PowerPC G2_LE core runs the routing stack and management plane while the CPM handles NAT, firewall filtering, and WAN protocol termination in firmware. At 266 MHz the device can sustain line-rate processing for typical 100 Mbps WAN links, and the PCI bridge enables connection to a Wi-Fi SoC or DSP for voice. Compared with discrete router architectures, the integrated CPM cuts external component count, BOM cost, and PCB area. ROHS source (per NXP datasheet).
Recomendado
DSLAM Line Card
In DSLAM line cards the MPC8271CVRMIBA serves as the aggregation processor, terminating ATM or PTM traffic from many DSL channels and forwarding it upstream. The CPM's hardware HDLC controllers, ATM AAL segmentation, and multi-channel DMA enable deterministic per-channel processing without loading the G2_LE core. The 60x-compatible system bus connects to line-card framers, while the PCI bus attaches to upstream switch fabric. Industrial temperature range (-40C to +105C) supports central-office deployment. The 516-ball BGA package fits compact line-card form factors with high-density routing.
Recomendado
Wireless Base Station Controller
The MPC8271CVRMIBA's CPM excels at managing the high-volume, time-deterministic serial traffic typical of GSM/UMTS base-station controllers. RISC firmware in the CPM terminates Abis/Iub links, performs multiplexing, and forwards payload over the PCI bus to baseband cards. The PowerPC core runs OAM, configuration, and synchronization stacks. Industrial temperature range ensures operation in outdoor or uncontrolled-cabinet deployments. ROHS source (per NXP product environmental page).
Recomendado
Industrial Protocol Gateway
For industrial protocol conversion (Modbus, Profibus, CAN, EtherCAT), the MPC8271CVRMIBA provides deterministic serial I/O through the CPM and Linux OS support on the G2_LE core. The CPM's UART, HDLC, SPI, and I2C controllers handle multiple field-bus channels simultaneously, while the core runs the protocol-conversion application. The industrial temperature range (-40C to +105C) and BGA package suit DIN-rail or wall-mounted industrial gateways. The PCI bus enables expansion cards for additional field-bus interfaces.
Recomendado
VoIP Media Gateway
The MPC8271CVRMIBA's CPM with ATM, HDLC, and time-division-multiplexed serial controllers suits VoIP media gateways that need to bridge TDM PSTN circuits to packet networks. The G2_LE core runs RTP/RTCP, SIP signaling, and DSP control, while the CPM handles TDM framing, echo-canceller coordination, and ATM adaptation. The PCI bus hosts DSP cards for voice compression, and the Ethernet MACs uplink to IP backhaul. ROHS source (per NXP datasheet).
Recomendado
Network Attached Storage Controller
The MPC8271CVRMIBA can serve as a controller for small/medium NAS appliances, with the PowerPC G2_LE core running a lightweight NAS OS and the PCI bus connecting to SATA or SCSI host adapters. The two integrated Ethernet MACs support link aggregation and bonding for higher throughput. The CPM's serial channels support front-panel displays and management interfaces. Compared to microcontroller-based NAS solutions, the PowerQUICC II offers multi-tasking headroom and proven network-stack support.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8271CVRMIBA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8271VRMIBA | MPC8271ZQMIBA | MPC8272CVRMIBA | MPC8247CVRMIBA |
|---|---|---|---|---|---|
| Package | 516-PBGA (TEBGA) 27x27 mm | 516-PBGA (TEBGA) 27x27 mm - same | 516-PBGA (TEBGA) 27x27 mm - same | 516-PBGA (TEBGA) 27x27 mm - same | 516-PBGA (TEBGA) 27x27 mm - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Hardware Encryption | No | No | No | Yes (AES/3DES/SHA/Kasumi) | No |
| CPM | Yes (full) | Yes | Yes | Yes | Yes (reduced) |
| PCI Interface | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI |
Diferenciadores clave
- Integrated dual Ethernet MACs in a single 516-ball BGA (frente a MPC8247CVRMIBA)
- No hardware encryption engine keeps cost lower (frente a MPC8272CVRMIBA)
- 266 MHz speed grade optimizes cost/performance (frente a MPC8271ZQMIBA)
Notas de diseño
The MPC8271CVRMIBA requires two supply rails: 1.5 V for the core and 3.3 V for I/O. Power sequencing must bring the 1.5 V core rail up before the 3.3 V I/O rail to prevent latch-up. Decoupling follows NXP's reference design: place 0.1 µF X7R ceramics close to each power pin near the BGA, with bulk 22 µF tantalums on each rail within 1 inch of the package. Use a low-impedance ground via array under the BGA thermal pad.
The 516-ball TEBGA at 1.0 mm pitch requires a 4-layer or 6-layer PCB with microvias for BGA escape. Route the 60x system bus and DDR memory interface with matched-length pairs (target ±50 mil) and 50 Ω controlled impedance per NXP's hardware specifications. Maintain a continuous ground reference plane under the BGA and avoid signal routing across plane splits on the top layer.
Estimated: at 1.5 V core and 266 MHz, the MPC8271CVRMIBA dissipates approximately 2-3 W worst case with full CPM activity. With a typical BGA thermal pad theta_JA of 15-20 C/W on a 6-layer PCB, junction rise is 30-60 C above ambient. For sealed enclosures above 60 C ambient, attach a small heatsink or thermal pad to the top of the package and provide airflow. Verify thermal in-system with measured Tj under worst-case workload.
Do not assume all MPC82xx family members are pin-compatible across all variants - only the listed drop-in equivalents share the same 516-ball TEBGA footprint. The MPC8271 differs from MPC8250 in CPM microcode and bus width; verify before substituting. Also ensure your boot ROM and reset configuration pins match the chosen variant's POR defaults.
Información de cumplimiento
RoHS compliance per distributor parametric data. Lead-free TEBGA ball finish per NXP product environmental page. Halogen-free status not explicitly listed in retrieved data. AEC-Q100 not applicable for communications MPU.
