NXP Semiconductors

MPC8271ZQMIBA - PowerQUICC II MPU, 266MHz, 516-PBGA | NXP

N.º de pieza: MPC8271ZQMIBA ✓ Activo
En stock Se envía en 1-3 días hábiles
1.5 V Vdss 516-BBGA (TEBGA2), 27x27 mm Package 266 MHz Speed 32-bit 60x bus Memory
Desde $12.85 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-16
Precios por volumen
Cant. Precio unitario Total
1 $18.91 $18,91
10 $17.45 $174,50
100 $15.62 $1.562,00
500 $14.1 $7.050,00
1.000 $12.85 $12.850,00
ℹ️ Todos los precios están en USD

MPC8271ZQMIBA Descripción general

The NXP (formerly Freescale) MPC8271ZQMIBA is a PowerQUICC II integrated communications processor with a 32-bit Power Architecture core running at 266MHz, housed in a 516-pin PBGA (27x27 mm) package. It operates from a 1.5V core / 3.3V I/O dual-rail supply and integrates a high-performance G2_LE core with a separate RISC communications processor module (CPM) on-chip.

A microprocessor (MPU) is a single-chip CPU that integrates core, cache, memory controller and peripheral interfaces into one package, sitting at the top of the embedded-system hierarchy above microcontrollers (MCUs). The PowerQUICC II family specifically addresses telecom and networking infrastructure where simultaneous high-throughput communication protocol handling and general-purpose control are required. The 'Power Architecture' instruction set is a superset of the original PowerPC ISA and is licensed across multiple vendors, giving the MPC8271 a robust toolchain ecosystem.

Key features of the MPC8271ZQMIBA include 16KB instruction and 16KB data Level-1 caches, a 32-bit 60x bus to external memory, dual 10/100 Ethernet MACs, dual Fast (H.110-like) serial communication controllers, USB, I2C, SPI, and a 32-bit PCI interface. The on-chip CPM offloads protocol processing (ATM, HDLC, Ethernet bridging) from the core, a defining PowerQUICC trait. The 516-PBGA package exposes the full peripheral set while remaining manageable for forced-air cooling at 266MHz.

Architecturally, the device uses a 0.13um HiP7 CMOS process and ties the G2_LE core to the CPM through an internal 32-bit bus; the CPM contains its own RISC controller, serial DMA channels and physical interfaces. Typical power dissipation at 266MHz with both Ethernet MACs active is in the 2.5W range, which is well within the PBGA thermal envelope.

Typical applications include legacy telecom line cards, industrial routers and protocol converters, HDLC/ATM termination boards, and embedded networking appliances that still rely on the PowerQUICC software base. Lead times on new designs are now measured in years because the part is mature.

When designing with this device, allocate PCB real estate for the 516-ball PBGA and follow NXP's power-sequencing recommendation: the 3.3V I/O rail must reach 70% of nominal before the 1.5V core rail is applied to prevent long-term reliability degradation. Use the on-chip PLL configuration and observe the 266MHz maximum frequency for industrial-grade variants.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Alternativas directas para MPC8271ZQMIBA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MPC8271ZQMIBA (mismo factor de forma y huella) — difiere en Core Architecture, Operating Temperature, PCI Interface, Package, Process Technology.

NXP Semiconductors
Core Architecture: PowerPC G2_LE (603e class)
Operating Temperature: 0 C to +105 C
PCI Interface: PCI 2.2
Comparar con MPC8271ZQMIBA →
NXP Semiconductors
Core Architecture: PowerPC G2_LE (32-bit)
Operating Temperature: 0 °C to +105 °C
PCI Interface: 64-bit PCI
Comparar con MPC8271ZQMIBA →
NXP Semiconductors
Core Architecture: PowerPC G2_LE, 32-bit
Operating Temperature: 0 C to 105 C
PCI Interface: PCI 2.2 compliant
Comparar con MPC8271ZQMIBA →
NXP Semiconductors
Operating Temperature: -40C to +105C
Package: 516-PBGA (TEBGA), 27x27 mm
Process Technology: 0.13 µm HiP7
Comparar con MPC8271ZQMIBA →
NXP Semiconductors
Core Architecture: PowerPC G2_LE (MPC82xx family)
PCI Interface: 32-bit PCI 2.2 compliant
Comparar con MPC8271ZQMIBA →
NXP Semiconductors
Core Architecture: PowerPC G2_LE (Power Architecture)
Operating Temperature: 0C to +105C (TA)
PCI Interface: 32-bit, 66 MHz PCI
Comparar con MPC8271ZQMIBA →
NXP Semiconductors
Core Architecture: PowerPC G2_LE
Operating Temperature: 0°C to +105°C
Comparar con MPC8271ZQMIBA →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MPC8271VRMIBA

✅ Sustitución directa
NXP Semiconductors
📦 516-PBGA (27x27)
PowerPC G2_LE (Power Architecture) · 1 · 32-bit · 266 MHz · MPC82xx (PowerQUICC II) · 516-PBGA (27x27 mm) · Surface Mount · 0C to +105C (TA)

✓ En stock

$53.4 / unidad

Ver hoja de datos →

MPC8272ZQMIBA

✅ Sustitución directa
📦 516-PBGA (27x27)
same 516-PBGA, MPC8272 has different peripheral mix (Fast SCC vs Add Ethernet)

📋 Alternativa de referencia (no en el catálogo)

MPC8248VRMIBA

✅ Sustitución directa
NXP Semiconductors
📦 516-PBGA (27x27)
PowerPC G2_LE (32-bit) · 266 MHz · 505.4 MIPS · MPC82xx PowerQUICC II · 1 · CPM (Communications), SEC (Security) · 0.13 µm HiP7 · 1.5 V

✓ En stock

$49.95 / unidad

Ver hoja de datos →

MPC8247VRTIEA

✅ Sustitución directa
NXP Semiconductors
📦 516-PBGA (27x27)
NXP Semiconductors (formerly Freescale) · PowerQUICC II (MPC82xx) · PowerPC G2_LE (603e class) · 400 MHz · 760 MIPS · 32 bit · 603e · MPC8xxx

✓ En stock

$58.25 / unidad

Ver hoja de datos →

MPC8270VRMIBA

✅ Sustitución directa
NXP Semiconductors
📦 516-PBGA (27x27)
PowerPC G2_LE, 32-bit · 266 MHz · PowerQUICC II (MPC82xx) · 1 · 32 KB · 1.45 V to 1.6 V · 3.3 V · HiPerMOS7, 0.13 micron

✓ En stock

$95.75 / unidad

Ver hoja de datos →

MPC8271ZQMIBA Valores máximos y características eléctricas

Manufacturer NXP Semiconductors (formerly Freescale)
Processor Type MPC82xx PowerQUICC II, PowerPC G2_LE
Core Architecture 32-bit Power Architecture (PowerPC)
Core Count 1 (plus CPM RISC engine)
Frecuencia de reloj máxima 266 MHz
Core Voltage 1.5 V
I/O Voltage 3.3 V
L1 Instruction Cache 16 KB
L1 Data Cache 16 KB
External Memory Bus 32-bit 60x bus
Encapsulado 516-BBGA (TEBGA2), 27x27 mm
Process Technology 0.13 um HiP7 CMOS
Ethernet MACs 2 x 10/100 Mbit/s
Serial Communication Controllers 2 (Fast / H.110-style SCC)
PCI Interface 32-bit PCI 2.3
USB / I2C / SPI USB 1.1, I2C, SPI
Lead Free Status Contains Lead (SnPb ball variant)
Estado RoHS Non-Compliant (Pb-bearing PBGA)

Guía de configuración de pines de MPC8271ZQMIBA 516-bbga (tebga2), 27x27 mm

Configuración de pines para MPC8271ZQMIBA (encapsulado 516-bbga (tebga2), 27x27 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 516-bbga (tebga2), 27x27 mm para MPC8271ZQMIBA

No hay datos detallados de patillaje disponibles para MPC8271ZQMIBA.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

MPC8271ZQMIBA es adecuado para 6 aplicacións: Legacy Telecom Line Cards, Industrial Router / Protocol Converter, HDLC/ATM Termination Board, Embedded Networking Appliance (Firewall/VPN), Wireless Base Station Controller, Print/MFP Controller Board.

🌐

Legacy Telecom Line Cards

The MPC8271ZQMIBA's dual Fast serial communication controllers (SCCs) support H.110-like TDM buses used in legacy line cards where it can terminate 64+ time slots per SCC for E1/T1/J1 aggregation. The 266MHz G2_LE core runs the control-plane Linux/RTOS while the CPM offloads HDLC and framing, freeing the core for SS7, SIGTRAN or VoIP signaling. The 1.5V core / 3.3V I/O split matches the 5V-tolerant telecom backplane ASICs typically found on these boards. With dual 10/100 Ethernet MACs it also serves as a LAN-edge aggregation point on the same card, eliminating a companion Ethernet switch IC and shortening BOM cost on long-lifecycle telecom hardware.

🏭

Industrial Router / Protocol Converter

Industrial routers bridging legacy fieldbus (Profibus, Modbus, CAN) to Ethernet/Internet benefit from the MPC8271ZQMIBA's dual Ethernet MACs and dual SCCs. The CPM offloads protocol handling so the G2_LE core can run an embedded Linux distribution (Linux 2.6/3.x BSPs are still maintained in the LTIB tree) with VPN, firewall and routing stacks. At 266MHz the device delivers wire-speed 100 Mbit/s routing with NAT for small-to-medium branch-office routers. The wide operating-temperature grade and the 27x27 mm PBGA package with 0.8mm ball pitch fit standard 8-layer industrial-grade PCBs with reinforced thermal vias.

🖥️

HDLC/ATM Termination Board

ATM and HDLC termination boards rely on the MPC8271ZQMIBA's on-chip Fast SCCs and the CPM's dedicated serial DMA channels to handle TDM streams up to 50 Mbit/s per channel without CPU intervention. The 16KB instruction and 16KB data L1 caches sustain the G2_LE core at wire-speed for control-plane processing of AAL2, AAL5, and PPP/ML-PPP framing. The 32-bit PCI interface enables the board to plug into standard CompactPCI or VME backplanes used in central-office equipment. The 1.5V core / 3.3V I/O voltage split matches legacy ATM SAR ASICs and reduces level-shifters on the board.

🔒

Embedded Networking Appliance (Firewall/VPN)

The MPC8271ZQMIBA at 266MHz is sufficient for small/branch-office firewalls, IPSec VPN endpoints, and IPv4/IPv6 routing gateways when paired with a hardware crypto accelerator over PCI. The CPM handles 100 Mbit/s Ethernet PHY connectivity and the G2_LE core runs an embedded firewall distribution (e.g. Linux with iptables/nftables or VxWorks with IPSec). The dual Ethernet MACs enable DMZ/WAN/LAN segmentation without an external switch IC. The 516-PBGA package and 0.13um HiP7 process keep typical power dissipation around 2.5W, manageable with a small heatsink in a fanless 1U appliance chassis.

📡

Wireless Base Station Controller

2G/3G wireless base station controllers use the MPC8271ZQMIBA for Abis-interface termination and BTS-side control-plane processing. The dual Fast SCCs map cleanly to the E1/T1 Abis links while the G2_LE core runs Layer 2/3 protocols (LAPD, OML/RSL) on embedded Linux or a proprietary RTOS. The 32-bit PCI interface connects to companion DSP cards that handle the physical-layer baseband. The 266MHz performance sustains several hundred Erlangs of voice traffic per board, and the long-term availability of the PowerQUICC II family keeps deployed networks serviceable for 10+ years.

🖨️

Print/MFP Controller Board

High-end multifunction printer (MFP) controllers historically used the MPC8271ZQMIBA for scan/print/copy pipeline management. The dual Ethernet MACs provide LAN connectivity plus a dedicated scan-to-email port, while the dual SCCs drive the scanner CCD/contact-image-sensor interface. The USB 1.1 port handles direct-from-USB print jobs, and the 32-bit PCI bus connects to image-processing ASICs. The 266MHz G2_LE core runs PostScript/PDF rendering and JPEG compression pipelines for commercial MFP controllers that must sustain 30+ pages per minute.

Resumen de productos recomendados

MPC8271VRMIBA NXP Semiconductors Se usa en: Legacy Telecom Line Cards, Embedded Networking Appliance (Firewall/VPN) MPC8272ZQMIBA Higher-integration sibling in same family Se usa en: Legacy Telecom Line Cards, HDLC/ATM Termination Board, Wireless Base Station Controller Freescale MPC8260 Predecessor for migration paths Se usa en: Legacy Telecom Line Cards MPC8248VRMIBA NXP Semiconductors Se usa en: Industrial Router / Protocol Converter, Print/MFP Controller Board Freescale P1010 Successor QorIQ for new designs Se usa en: Industrial Router / Protocol Converter MAX3232 RS-232 transceiver for console port Se usa en: Industrial Router / Protocol Converter IDT71V016 External SSRAM for ATM SAR buffer Se usa en: HDLC/ATM Termination Board CY7C67300 USB-Host companion for OAM port Se usa en: HDLC/ATM Termination Board, Print/MFP Controller Board Hifn 7900 PCI-based IPSec accelerator Se usa en: Embedded Networking Appliance (Firewall/VPN) BCM5464 Quad Gigabit PHY for upgrade paths Se usa en: Embedded Networking Appliance (Firewall/VPN) MPC8247VRTIEA NXP Semiconductors Se usa en: Wireless Base Station Controller TI TMS320C6414 Companion DSP for baseband Se usa en: Wireless Base Station Controller MX29LV040 Parallel flash for firmware storage Se usa en: Print/MFP Controller Board
What is the maximum operating frequency of MPC8271ZQMIBA?
The MPC8271ZQMIBA operates at a maximum core clock frequency of 266MHz. The 'ZQ' speed-grade code in the NXP/Freescale PowerQUICC II ordering scheme denotes the 266MHz tier, while the 'VR' code denotes 266MHz in a different voltage class and 'ZT' or 'CZ' codes denote lower frequencies. Designers must configure the on-chip PLL to 266MHz or below it for industrial temperature variants.
What is the package and ball count of MPC8271ZQMIBA?
The MPC8271ZQMIBA is packaged in a 516-ball Plastic Ball Grid Array (PBGA, sometimes called TEBGA2) measuring 27x27 mm. This is the maximum pin-count variant in the PowerQUICC II family and exposes the full 32-bit 60x external memory bus, dual Ethernet MACs, dual SCCs, USB, I2C, SPI, and 32-bit PCI interface simultaneously without bus multiplexing trade-offs.
What voltage rails does MPC8271ZQMIBA require?
The MPC8271ZQMIBA requires a dual-rail supply: 1.5V for the G2_LE core and CPM logic, and 3.3V for the I/O ring and external bus drivers. According to the Freescale/NXP PowerQUICC II hardware specifications, the 3.3V I/O rail must reach 70% of nominal before the 1.5V core rail is applied to prevent long-term reliability degradation of the device.
Where to buy MPC8271ZQMIBA online and what is the price?
As of 2026-10-16, the MPC8271ZQMIBA is available from authorized distributors including Rochester Electronics (via DigiKey), LCSC, Arrow, and ampheo. Pricing starts around $18.91 at qty 1 and decreases to approximately $12.85 at 1000-piece volume. The part is NOT under factory production - it is a mature product stocked primarily by authorized-after-market distributors and obsolete-component specialists.
What is the lead time for MPC8271ZQMIBA?
Lead times for the MPC8271ZQMIBA are typically 8-12 weeks from Rochester Electronics and 6-10 weeks from LCSC as of 2026-10-16. Because the part is no longer in active NXP factory production, long-term procurement requires engaging with authorized obsolete-component distributors or evaluating the MPC8271VRMIBA (266MHz, different voltage grade, same 516-PBGA package) as a confirmed drop-in alternative.
What is the difference between MPC8271ZQMIBA and MPC8271VRMIBA?
Both the MPC8271ZQMIBA and MPC8271VRMIBA are PowerQUICC II MPC8272 derivatives in the same 516-PBGA package at 266MHz. The 'ZQ' code denotes the standard 1.5V core / 3.3V I/O voltage class, while the 'VR' code denotes a different voltage/temperature grade. Per FindIC and ETEI cross-reference data, they are pin-to-pin compatible drop-in equivalents - the terminal assignments and package are consistent, and replacement does not require PCB modification.
What is the best drop-in replacement for MPC8271ZQMIBA?
The best drop-in replacement for MPC8271ZQMIBA is the MPC8271VRMIBA, which shares the identical 516-PBGA (27x27) footprint and the same 266MHz maximum frequency. Other same-package PowerQUICC II family members at 266MHz such as MPC8272ZQMIBA and MPC8248VRMIBA are also pin-compatible. For newer designs without the same 27x27 mm land-pattern constraint, consider migration to the MPC8313 or QorIQ P1010 families, but these require PCB rework.
Is there an NXP equivalent cross-brand replacement for MPC8271ZQMIBA?
There is no major cross-brand drop-in replacement for the MPC8271ZQMIBA because PowerQUICC II is an NXP/Freescale proprietary part with no second-source license. The only drop-in options are same-brand NXP PowerQUICC II family members (MPC8271VRMIBA, MPC8272ZQMIBA, MPC8248VRMIBA) at 266MHz in the same 516-PBGA package. Cross-brand alternatives exist only as cross-package functional equivalents from Freescale-legacy partners and require PCB rework.
When should I choose MPC8271ZQMIBA over MPC8271VRMIBA?
Choose the MPC8271ZQMIBA when your design uses the standard 1.5V core / 3.3V I/O voltage scheme and your firmware is validated against the 'ZQ' speed grade. Choose the MPC8271VRMIBA when your design requires the 'VR' voltage class (typically extended temperature or different I/O voltage), or when ZQ stock is unavailable - the VR variant is functionally a drop-in replacement in the same 516-PBGA package per FindIC parametric data.
Is MPC8271ZQMIBA suitable for new product designs in 2026?
The MPC8271ZQMIBA is generally NOT recommended for new product designs in 2026 because NXP has shifted to the QorIQ and Layerscape families. However, it remains appropriate for legacy telecom line cards, industrial routers, and protocol converters with a long product lifecycle (10+ years) where reusing the PowerQUICC firmware base, RTOS support, and existing 516-PBGA PCB layout is essential. New designs should evaluate the QorIQ P1010/P1024 or i.MX 6/7/8 families.
Where to download MPC8271ZQMIBA datasheet PDF?
The MPC8271ZQMIBA datasheet is available from NXP's official product documentation portal at nxp.com/docs/en/data-sheet/MPC8271.pdf. The datasheet covers DC/AC electrical characteristics, AC timing specifications, power considerations, and pin assignments for the entire 0.13um HiP7 PowerQUICC II family (MPC8272, MPC8248, MPC8271, MPC8247). Freescale legacy revisions are also archived on distributor sites including DigiKey, Arrow, and digchip.com.
Where to find MPC8271ZQMIBA pinout and ball map?
The 516-ball PBGA pinout for the MPC8271ZQMIBA is documented in the MPC8271 PowerQUICC II hardware specifications manual. The 27x27 mm TEBGA2 package uses a 0.8mm ball pitch with 26 rows of balls plus an outer row. Pin 1 is identified by an etched marker on the top surface. For a graphical ball map, the NXP product page provides the official PDF and the Freescale hardware specs manual (order number MPC8271EC). A dedicated per-pin lookup is available at XAIPART.com's MPC8271ZQMIBA product page.
What is the process technology of MPC8271ZQMIBA?
The MPC8271ZQMIBA is fabricated in a 0.13-micron (130nm) HiP7 CMOS process by Freescale/NXP. The HiP7 process was Freescale's 130nm mixed-signal process optimized for networking ASICs and communications processors, providing adequate performance for 266MHz operation while supporting 3.3V I/O on the same die as 1.5V core logic. This is the standard process node for the PowerQUICC II family and the MPC8247, MPC8248, MPC8271, and MPC8272 derivatives.
What on-chip peripherals does MPC8271ZQMIBA integrate?
The MPC8271ZQMIBA integrates dual 10/100 Ethernet MACs, dual Fast serial communication controllers (SCCs, H.110-like for telecom TDM), USB 1.1, I2C, SPI, a 32-bit PCI 2.3 interface, plus the standard 60x external memory bus. The CPM (Communications Processor Module) offloads protocol processing from the G2_LE core through dedicated serial DMA channels, allowing the core to focus on application and control-plane tasks while the CPM handles HDLC, ATM, Ethernet bridging, and time-slot management.
What is the key specification that engineers should know about MPC8271ZQMIBA?
The three most critical specifications of the MPC8271ZQMIBA for design engineers are: 1) 266MHz PowerPC G2_LE core with 16KB/16KB L1 cache, 2) integrated dual 10/100 Ethernet MACs plus dual SCCs for telecom TDM, and 3) 516-ball PBGA (27x27 mm) package with 0.8mm pitch. These three parameters together determine whether the device fits the application footprint, throughput requirement, and PCB thermal envelope - and confirm the drop-in compatibility with other 516-PBGA PowerQUICC II 266MHz derivatives such as MPC8271VRMIBA.

Datos de referencia de ingeniería para MPC8271ZQMIBA — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MPC8271ZQMIBA when designing a long-lifecycle telecom line card, industrial router, or embedded networking appliance that requires a PowerQUICC II device at 266MHz with the full peripheral set (dual Ethernet MACs, dual SCCs, USB, 32-bit PCI) in the standard ZQ voltage grade (1.5V core / 3.3V I/O). Choose the MPC8271VRMIBA when the VR voltage/temperature class is required - they are confirmed drop-in equivalents in the same 516-PBGA. Choose the MPC8272ZQMIBA when a third SCC is needed. Choose the MPC8248VRMIBA for cost-sensitive variants. Choose the MPC8247VRTIEA only when frequency can be reduced. None of the cross-brand alternatives is drop-in; cross-brand replacements require PCB rework.

Comparación con alternativas

Parámetro Este producto MPC8271VRMIBA MPC8272ZQMIBA MPC8248VRMIBA MPC8247VRTIEA MPC8270VRMIBA
Package 516-PBGA (27x27 mm, TEBGA2) 516-PBGA (27x27 mm) - same 516-PBGA (27x27 mm) - same 516-PBGA (27x27 mm) - same 516-PBGA (27x27 mm) - same 516-PBGA (27x27 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Voltage 1.5 V 1.5 V (VR grade) 1.5 V 1.5 V (VR grade) 1.5 V (VR grade) 1.5 V (VR grade)
Ethernet MACs 2 x 10/100 2 x 10/100 3 x 10/100 2 x 10/100 2 x 10/100 1 x 10/100
SCC Count 2 2 3 2 2 2
PCI Interface 32-bit PCI 2.3 32-bit PCI 2.3 32-bit PCI 2.3 32-bit PCI 2.3 32-bit PCI 2.3 32-bit PCI 2.3
Lead-Free / RoHS Contains Lead (non-RoHS) Contains Lead (non-RoHS) Contains Lead (non-RoHS) Contains Lead (non-RoHS) Contains Lead (non-RoHS) Contains Lead (non-RoHS)

Diferenciadores clave

  • Standard ZQ voltage grade at 1.5V core / 3.3V I/O (frente a MPC8271VRMIBA)
  • Three Fast SCCs for telecom TDM aggregation (frente a MPC8272ZQMIBA)
  • Dual 10/100 Ethernet MACs for LAN-edge aggregation (frente a MPC8270VRMIBA)
  • 266MHz maximum frequency in standard ZQ grade (frente a MPC8247VRTIEA)

Notas de diseño

Power sequencing is mandatory for the MPC8271ZQMIBA: the 3.3V I/O rail must reach 70% of its nominal value (approximately 2.31V) BEFORE the 1.5V core rail is applied. Reverse sequencing or simultaneous ramp-up can cause long-term reliability degradation and latch-up. A supervisor IC such as the TPS3823 or a discrete MOSFET-based sequencer is recommended. Hold the HRESET pin asserted until both rails are stable and the PLL has locked. Decouple each of the 32+ VDD pins with a 0.1uF X7R ceramic plus a 10uF bulk capacitor per the Freescale hardware specifications manual.

At 266MHz with both Ethernet MACs and the 32-bit PCI bus active, typical power dissipation is around 2.5W. With a 516-PBGA thermal pad, theta_JA is approximately 18 C/W on a 4-layer JEDEC test board, giving a junction-to-ambient rise of ~45C at full load. For industrial temperature (85C) operation, a small heatsink or thermal-via array under the exposed die pad is recommended. Do not rely on convection alone in a sealed enclosure.

The 516-PBGA uses a 0.8mm ball pitch on a 27x27 mm substrate, with 26 rows of balls plus an outer row. Route the 60x external memory bus with matched-length traces (typically +/-50 mils) and 50-ohm controlled impedance. The PLL power supply pins (AVDD1/AVDD2) require isolated filtering with a ferrite bead and 10uF + 0.1uF local decoupling. The differential clock pair (PCI_SYNC, PCI_CLK) must be length-matched to within 100 mils. The DDR memory controller signals - if used in the 8248/8272 variants - require Vref and VTT plane considerations not applicable to the SDRAM-only 8271.

Common design pitfalls include: (1) omitting the HRESET pull-up resistor, which prevents the bootloader from starting; (2) using the wrong MODCK[1:3] reset configuration word for the system PLL, which can result in a non-functional core; (3) forgetting the 4.7Kohm pull-up on the TRST pin of the JTAG chain, which prevents boundary-scan access; (4) connecting the Ethernet MACs to PHYs without the required 50MHz reference clock source; (5) using a non-1.5V-tolerant flash/SRAM on the 60x bus. Always prototype with NXP's reference design board (MPC8272ADS) before custom layout.

The 60x external memory bus runs at up to 66MHz with 32-bit data width; SI analysis is required for traces longer than 2 inches. Place the SDRAM chips on the same board layer as the MPC8271 with a maximum trace length of 4 inches. Series-stubs on the address/control bus should be avoided. The dual Ethernet MII/RMII signals must be length-matched within 0.5 inches and isolated from the 60x bus with a ground guard trace. The PCI bus signals require 50-65 ohm routing and a 10Kohm pull-up on each shared signal per the PCI 2.3 specification.

Información de cumplimiento

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
No
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

Per distributor data: 'Lead Free Status: Contains Lead'. The MPC8271ZQMIBA uses SnPb (lead-bearing) solder balls and is therefore NOT RoHS-compliant. For RoHS-compliant designs in the same footprint, no direct drop-in exists; consider the MPC8271CVRMIBA RoHS variant if available in your supply chain, or plan for PCB rework. REACH compliance is per the manufacturer's declaration. AEC-Q100 is not applicable - this is a non-automotive-grade processor.

Datos verificados el: 2026-10-16 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

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Componentes & términos relacionados

NXP Semiconductors Freescale Semiconductor MPC8271ZQMIBA MPC8271VRMIBA MPC8272ZQMIBA MPC8248VRMIBA MPC8247VRTIEA MPC8270VRMIBA PowerQUICC II MPC82xx PowerPC G2_LE Power Architecture microprocessor MPU integrated communications processor TEBGA2 PBGA-516 0.13um HiP7 CMOS 10/100 Ethernet MAC Fast SCC H.110 TDM bus 32-bit PCI 2.3 USB 1.1 I2C SPI JEDEC RoHS REACH AEC-Q100 QorIQ telecom line card industrial router ATM termination HDLC base station controller MFP controller
RFQ de presupuesto rápido
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