MPC8272CZQMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
N.º de pieza: MPC8272CZQMIBA ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $48.79 | $48,79 |
| 10 | $46.5 | $465,00 |
| 100 | $44.2 | $4.420,00 |
| 250 | $42.1 | $10.525,00 |
| 500 | $40.05 | $20.025,00 |
MPC8272CZQMIBA Descripción general
Background knowledge: a PowerQUICC II processor is a Power-Architecture-based communications system-on-chip (SoC) that combines a general-purpose embedded CPU core with a dedicated RISC-based Communications Processor Module (CPM). The CPM offloads serial-channel, ATM, Fast Ethernet, HDLC, and encryption tasks from the main core, which is why the MPC82xx family became the de-facto choice for mid-range routers, DSLAM line cards, and industrial-control gateways in the 2000s. In the broader taxonomy it sits between classical microcontrollers and high-performance application processors, specializing in I/O-centric rather than compute-centric workloads.
Key features include a 266 MHz PowerPC G2_LE core with MMU and on-chip caches, hardware-accelerated SEC (Security Engine) for IPSec/SSL/TLS bulk encryption, a CPM that supports dual Fast Ethernet MACs plus a UTOPIA-II interface for ATM/PHY, integrated PCI 2.2 host/agent controller, USB 1.1, and a 60x-compatible external bus. The part is specified for the -40 to +105 °C industrial temperature range (the trailing "I" in the part number), which is unusual for a high-pin-count communications processor and signals its use in outdoor or industrial enclosures.
The device is built on a 0.13 µm CMOS process and runs from a 3.3 V I/O supply plus a 1.5–1.8 V internal core voltage, requiring a multi-rail power tree with sequencing. Memory interface includes a 64-bit 60x bus and a 32-bit local bus with SDRAM controller and up to eight banks, enabling direct glueless attachment of DDR-era SDRAM, Flash, and peripherals.
Typical applications include SME routers, xDSL line cards, industrial Ethernet gateways, factory-floor protocol converters, and wireless base-station control boards. The integrated SEC engine makes it well suited to VPN concentrators and IPSec-accelerated CPE equipment. Power designers must respect the multiple power rails and the high transient current of the 266 MHz core; a 4-layer PCB with dedicated power planes and bulk decoupling near each BGA row is strongly recommended.
Alternativas directas para MPC8272CZQMIBA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8272CZQMIBA (mismo factor de forma y huella) — difiere en Core Architecture, Data Bus Width, Integrated Peripherals, Operating Temperature, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8270VRMIBA
✅ Sustitución directa✓ En stock
$95.75 / unidad
Ver hoja de datos →MPC8270CVRMIBA
✅ Sustitución directa✓ En stock
$88.75 / unidad
Ver hoja de datos →MPC8272CZQMIBA Valores máximos y características eléctricas
| Core Architecture | PowerPC G2_LE |
| Core Family | PowerQUICC II (MPC82xx) |
| Core Frequency | 266 MHz |
| Ancho del bus de datos | 32-bit |
| Instruction Set | Power Architecture (PowerPC) |
| Operating Supply Voltage (I/O) | 3.3 V |
| Internal Core Voltage | 1.5 V to 1.8 V |
| Encapsulado | 516-PBGA (TEPBGA, 27x27 mm) |
| Rango de temperatura de funcionamiento | -40 °C to +105 °C (industrial) |
| On-chip Connectivity | PCI 2.2, USB 1.1, UTOPIA-II, dual Fast Ethernet MACs (via CPM) |
| Communications Processor Module | Yes (CPM) |
| Hardware Security Engine (SEC) | Yes |
| External Bus | 60x bus + 32-bit local bus with SDRAM controller |
| Process Technology | 0.13 µm CMOS |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de MPC8272CZQMIBA 516-pbga (tepbga, 27x27 mm)
Configuración de pines para MPC8272CZQMIBA (encapsulado 516-pbga (tepbga, 27x27 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8272CZQMIBA.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8272CZQMIBA es adecuado para 6 aplicacións: SME Router / Gateway SoC, xDSL / DSLAM Line Card Controller, Industrial Ethernet Gateway / Protocol Converter, VPN / IPSec Concentrator, Wireless Base Station Control Board, Imaging / Printer Controller Board.
SME Router / Gateway SoC
The MPC8272CZQMIBA's 266 MHz PowerPC G2_LE core plus integrated CPM and dual Fast Ethernet MACs make it well suited to small-and-medium-enterprise routers and integrated services gateways. Its on-chip PCI 2.2 interface lets designers add a wireless LAN mini-PCI module without an external bridge, while the SEC engine accelerates IPSec/SSL VPN tunnels for site-to-site links. A typical 100 Mbps WAN-to-LAN router uses one 10/100 MAC for WAN, the second MAC for LAN switching, and the UTOPIA-II port to a PHY for an optional ADSL/VDSL interface, all running from the same 3.3 V rail. Compared to a discrete CPU+ASIC approach, the MPC8272CZQMIBA shrinks BOM count and simplifies thermal design.
Recomendado
xDSL / DSLAM Line Card Controller
In a DSLAM line card the MPC8272CZQMIBA acts as the aggregation and control CPU, offloading ATM cell processing to the CPM and connecting to line-driver PHYs through its UTOPIA-II interface at up to 155 Mbps. The hardware SEC engine handles per-subscriber IPSec tunnels required for business-grade DSL services, and the 516-PBGA 27x27 mm package fits the standard ATCA/AdvancedTCA line-card footprint. Designers typically pair the 8272 with an MPC8265/MPC8275 linecard companion or with external TDM switch fabrics. Industrial -40 to +105 °C grading means the card can be deployed in outdoor remote DSLAM cabinets without special thermal screening.
Recomendado
Industrial Ethernet Gateway / Protocol Converter
Factory-floor protocol converters often need to bridge legacy fieldbuses (Modbus, PROFIBUS, DeviceNet) to Ethernet/IP while surviving -40 to +105 °C ambient temperatures, which is exactly the operating envelope of the MPC8272CZQMIBA. The CPM's serial-channel controllers support multiple UART/SPI/HDLC channels simultaneously for slave-side fieldbus interfaces, while the dual 10/100 Ethernet MACs and PCI host port drive the Ethernet/IP uplink. The integrated SEC engine enables secure remote management tunnels without a separate crypto ASIC. In a typical DIN-rail gateway design the 8272 is paired with a small DDR SDRAM, NAND Flash, and an external PHY, drawing roughly 4 W from the 3.3 V rail.
Recomendado
VPN / IPSec Concentrator
The MPC8272CZQMIBA's dedicated SEC (Security Engine) accelerates DES, 3DES, AES, and SHA/MD5 bulk-data operations for IPSec and SSL/TLS tunnels, offloading the G2_LE core from per-packet crypto work. In a small-office VPN concentrator the 8272 typically sustains 50-100 Mbps of AES-128 throughput depending on packet size - more than enough for branch-office site-to-site tunnels. The part's PCI host port allows a hardware crypto accelerator card to be added for higher throughput tiers. The 516-PBGA package is footprint-compatible across the 8270/8271/8272 family, so a VPN SKU can be populated with different speed grades on the same PCB.
Recomendado
Wireless Base Station Control Board
In GSM/UMTS small-cell base stations the MPC8272CZQMIBA functions as the control-plane processor, handling Layer-2 signalling, O&M, and backhaul encryption while baseband processing is done on a co-processor. The CPM's multi-channel HDLC controllers and UTOPIA-II interface are well matched to Abis/Iub framing requirements, and the SEC engine secures backhaul traffic. The industrial -40 to +105 °C temperature range lets the same board be deployed in outdoor pico-cell enclosures. Designers typically place the 8272 alongside 64-128 MB of DDR SDRAM, boot Flash, and a backhaul Ethernet PHY.
Recomendado
Imaging / Printer Controller Board
Office multifunction printers and high-end industrial printers need a controller that can drive a parallel engine bus, USB host/device, and an external page-description-language ASIC. The MPC8272CZQMIBA's PCI host port connects to an engine ASIC, its USB 1.1 host connects to Wi-Fi/Bluetooth dongles, and its CPM-driven serial channels manage the operator panel and scan subsystems. The 266 MHz G2_LE core easily runs a real-time OS plus a PostScript/PDF rasterizer pipeline at modest page rates. The industrial temperature grade is overkill for office deployment but lets the same controller board be re-used in ruggedized industrial printers and kiosks.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8272CZQMIBA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8270VRMIBA | MPC8270CVRMIBA |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (TEPBGA, 27x27 mm) | 516-PBGA (TEPBGA, 27x27 mm) - same | 516-PBGA (TEPBGA, 27x27 mm) - same |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Core Frequency | 266 MHz | 200 MHz (-25%) | 200 MHz (-25%) |
| SEC Hardware Security Engine | Yes | No / limited | No / limited |
| CPM (Communications Processor Module) | Yes, full CPM | Yes, reduced CPM channels | Yes, reduced CPM channels |
| Integrated Ethernet MACs | 2 (Fast Ethernet via CPM) | 2 | 2 |
| PCI 2.2 Host/Agent | Yes | Yes | Yes |
| USB 1.1 | Yes | Yes | Yes |
| Operating Temperature Range | -40 °C to +105 °C (industrial) | -40 °C to +105 °C | -40 °C to +105 °C |
| Lifecycle Status | EOL | EOL | EOL |
Diferenciadores clave
- Highest core frequency in the MPC8272 family (266 MHz) (frente a MPC8270VRMIBA)
- Integrated SEC hardware security engine (frente a MPC8270VRMIBA)
- Full dual Fast Ethernet + UTOPIA-II integration (frente a MPC8270CVRMIBA)
Notas de diseño
Estimated: at full 266 MHz activity with 1.5 V core and 3.3 V I/O rails, expect roughly 3-6 W of dissipation in the MPC8272CZQMIBA; design a 4-layer PCB with continuous power planes on the inner layers and place 10 µF bulk + 0.1 µF ceramic decoupling pairs adjacent to each VDD/VCC ball row. Use a sequenced 1.5 V core / 2.5 V / 3.3 V I/O power-up order per the NXP datasheet to avoid I/O latch-up.
Estimated: at 4 W dissipation and a 516-BGA with θJA near 18-22 °C/W, junction temperature rise above ambient is ~75-90 °C - the industrial +105 °C rating leaves only ~10-15 °C of headroom without airflow. Provide a minimum 100x100 mm copper pad array or a small clip-on heatsink; verify with a thermal probe in the worst-case corner of the BGA.
Use a 1.0 mm-pitch BGA land pattern with non-solder-mask-defined (NSMD) pads for reliable 516-ball attachment. Route the 60x bus on inner layers with length-matched ±150 mils, and place four 0.01 µF decoupling caps symmetrically around the BGA corners to suppress simultaneous-switching noise on the data bus.
The MPC8272CZQMIBA is in NXP EOL status - do not start a new design without consulting the published PCN. The trailing 'I' in the part number is the industrial temperature flag; misreading it as 'I = internal' has caused engineers to order commercial-temperature parts that fail outdoor qualification.
Información de cumplimiento
Lifecycle is EOL per NXP product page; full material declaration (RoHS, REACH, lead-free, halogen-free) not present in the verified snippet set - confirm directly with NXP customer support before a regulated-market shipment.
