MPC8272CZQMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPN: MPC8272CZQMIBA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.79 | $48.79 |
| 10 | $46.5 | $465.00 |
| 100 | $44.2 | $4,420.00 |
| 250 | $42.1 | $10,525.00 |
| 500 | $40.05 | $20,025.00 |
MPC8272CZQMIBA Overview
Background knowledge: a PowerQUICC II processor is a Power-Architecture-based communications system-on-chip (SoC) that combines a general-purpose embedded CPU core with a dedicated RISC-based Communications Processor Module (CPM). The CPM offloads serial-channel, ATM, Fast Ethernet, HDLC, and encryption tasks from the main core, which is why the MPC82xx family became the de-facto choice for mid-range routers, DSLAM line cards, and industrial-control gateways in the 2000s. In the broader taxonomy it sits between classical microcontrollers and high-performance application processors, specializing in I/O-centric rather than compute-centric workloads.
Key features include a 266 MHz PowerPC G2_LE core with MMU and on-chip caches, hardware-accelerated SEC (Security Engine) for IPSec/SSL/TLS bulk encryption, a CPM that supports dual Fast Ethernet MACs plus a UTOPIA-II interface for ATM/PHY, integrated PCI 2.2 host/agent controller, USB 1.1, and a 60x-compatible external bus. The part is specified for the -40 to +105 °C industrial temperature range (the trailing "I" in the part number), which is unusual for a high-pin-count communications processor and signals its use in outdoor or industrial enclosures.
The device is built on a 0.13 µm CMOS process and runs from a 3.3 V I/O supply plus a 1.5–1.8 V internal core voltage, requiring a multi-rail power tree with sequencing. Memory interface includes a 64-bit 60x bus and a 32-bit local bus with SDRAM controller and up to eight banks, enabling direct glueless attachment of DDR-era SDRAM, Flash, and peripherals.
Typical applications include SME routers, xDSL line cards, industrial Ethernet gateways, factory-floor protocol converters, and wireless base-station control boards. The integrated SEC engine makes it well suited to VPN concentrators and IPSec-accelerated CPE equipment. Power designers must respect the multiple power rails and the high transient current of the 266 MHz core; a 4-layer PCB with dedicated power planes and bulk decoupling near each BGA row is strongly recommended.
Drop-in alternatives for MPC8272CZQMIBA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8272CZQMIBA (same form factor and footprint) — differing in Core Architecture, Data Bus Width, Integrated Peripherals, Operating Temperature, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8270VRMIBA
✅ Drop-In✓ In Stock
$95.75 / Unit
View Datasheet →MPC8270CVRMIBA
✅ Drop-In✓ In Stock
$88.75 / Unit
View Datasheet →MPC8272CZQMIBA Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC G2_LE |
| Core Family | PowerQUICC II (MPC82xx) |
| Core Frequency | 266 MHz |
| Data Bus Width | 32-bit |
| Instruction Set | Power Architecture (PowerPC) |
| Operating Supply Voltage (I/O) | 3.3 V |
| Internal Core Voltage | 1.5 V to 1.8 V |
| Package | 516-PBGA (TEPBGA, 27x27 mm) |
| Operating Temperature Range | -40 °C to +105 °C (industrial) |
| On-chip Connectivity | PCI 2.2, USB 1.1, UTOPIA-II, dual Fast Ethernet MACs (via CPM) |
| Communications Processor Module | Yes (CPM) |
| Hardware Security Engine (SEC) | Yes |
| External Bus | 60x bus + 32-bit local bus with SDRAM controller |
| Process Technology | 0.13 µm CMOS |
| Mounting Type | Surface Mount |
MPC8272CZQMIBA 516-pbga (tepbga, 27x27 mm) Pin Configuration Guide
Pin configuration for MPC8272CZQMIBA (516-pbga (tepbga, 27x27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8272CZQMIBA.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8272CZQMIBA is suitable for 6 applications: SME Router / Gateway SoC, xDSL / DSLAM Line Card Controller, Industrial Ethernet Gateway / Protocol Converter, VPN / IPSec Concentrator, Wireless Base Station Control Board, Imaging / Printer Controller Board.
SME Router / Gateway SoC
The MPC8272CZQMIBA's 266 MHz PowerPC G2_LE core plus integrated CPM and dual Fast Ethernet MACs make it well suited to small-and-medium-enterprise routers and integrated services gateways. Its on-chip PCI 2.2 interface lets designers add a wireless LAN mini-PCI module without an external bridge, while the SEC engine accelerates IPSec/SSL VPN tunnels for site-to-site links. A typical 100 Mbps WAN-to-LAN router uses one 10/100 MAC for WAN, the second MAC for LAN switching, and the UTOPIA-II port to a PHY for an optional ADSL/VDSL interface, all running from the same 3.3 V rail. Compared to a discrete CPU+ASIC approach, the MPC8272CZQMIBA shrinks BOM count and simplifies thermal design.
Recommended
xDSL / DSLAM Line Card Controller
In a DSLAM line card the MPC8272CZQMIBA acts as the aggregation and control CPU, offloading ATM cell processing to the CPM and connecting to line-driver PHYs through its UTOPIA-II interface at up to 155 Mbps. The hardware SEC engine handles per-subscriber IPSec tunnels required for business-grade DSL services, and the 516-PBGA 27x27 mm package fits the standard ATCA/AdvancedTCA line-card footprint. Designers typically pair the 8272 with an MPC8265/MPC8275 linecard companion or with external TDM switch fabrics. Industrial -40 to +105 °C grading means the card can be deployed in outdoor remote DSLAM cabinets without special thermal screening.
Recommended
Industrial Ethernet Gateway / Protocol Converter
Factory-floor protocol converters often need to bridge legacy fieldbuses (Modbus, PROFIBUS, DeviceNet) to Ethernet/IP while surviving -40 to +105 °C ambient temperatures, which is exactly the operating envelope of the MPC8272CZQMIBA. The CPM's serial-channel controllers support multiple UART/SPI/HDLC channels simultaneously for slave-side fieldbus interfaces, while the dual 10/100 Ethernet MACs and PCI host port drive the Ethernet/IP uplink. The integrated SEC engine enables secure remote management tunnels without a separate crypto ASIC. In a typical DIN-rail gateway design the 8272 is paired with a small DDR SDRAM, NAND Flash, and an external PHY, drawing roughly 4 W from the 3.3 V rail.
Recommended
VPN / IPSec Concentrator
The MPC8272CZQMIBA's dedicated SEC (Security Engine) accelerates DES, 3DES, AES, and SHA/MD5 bulk-data operations for IPSec and SSL/TLS tunnels, offloading the G2_LE core from per-packet crypto work. In a small-office VPN concentrator the 8272 typically sustains 50-100 Mbps of AES-128 throughput depending on packet size - more than enough for branch-office site-to-site tunnels. The part's PCI host port allows a hardware crypto accelerator card to be added for higher throughput tiers. The 516-PBGA package is footprint-compatible across the 8270/8271/8272 family, so a VPN SKU can be populated with different speed grades on the same PCB.
Recommended
Wireless Base Station Control Board
In GSM/UMTS small-cell base stations the MPC8272CZQMIBA functions as the control-plane processor, handling Layer-2 signalling, O&M, and backhaul encryption while baseband processing is done on a co-processor. The CPM's multi-channel HDLC controllers and UTOPIA-II interface are well matched to Abis/Iub framing requirements, and the SEC engine secures backhaul traffic. The industrial -40 to +105 °C temperature range lets the same board be deployed in outdoor pico-cell enclosures. Designers typically place the 8272 alongside 64-128 MB of DDR SDRAM, boot Flash, and a backhaul Ethernet PHY.
Recommended
Imaging / Printer Controller Board
Office multifunction printers and high-end industrial printers need a controller that can drive a parallel engine bus, USB host/device, and an external page-description-language ASIC. The MPC8272CZQMIBA's PCI host port connects to an engine ASIC, its USB 1.1 host connects to Wi-Fi/Bluetooth dongles, and its CPM-driven serial channels manage the operator panel and scan subsystems. The 266 MHz G2_LE core easily runs a real-time OS plus a PostScript/PDF rasterizer pipeline at modest page rates. The industrial temperature grade is overkill for office deployment but lets the same controller board be re-used in ruggedized industrial printers and kiosks.
Recommended
Recommended Products Summary
Engineering reference data for MPC8272CZQMIBA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8270VRMIBA | MPC8270CVRMIBA |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (TEPBGA, 27x27 mm) | 516-PBGA (TEPBGA, 27x27 mm) - same | 516-PBGA (TEPBGA, 27x27 mm) - same |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE | PowerPC G2_LE |
| Core Frequency | 266 MHz | 200 MHz (-25%) | 200 MHz (-25%) |
| SEC Hardware Security Engine | Yes | No / limited | No / limited |
| CPM (Communications Processor Module) | Yes, full CPM | Yes, reduced CPM channels | Yes, reduced CPM channels |
| Integrated Ethernet MACs | 2 (Fast Ethernet via CPM) | 2 | 2 |
| PCI 2.2 Host/Agent | Yes | Yes | Yes |
| USB 1.1 | Yes | Yes | Yes |
| Operating Temperature Range | -40 °C to +105 °C (industrial) | -40 °C to +105 °C | -40 °C to +105 °C |
| Lifecycle Status | EOL | EOL | EOL |
Key Differentiators
- Highest core frequency in the MPC8272 family (266 MHz) (vs MPC8270VRMIBA)
- Integrated SEC hardware security engine (vs MPC8270VRMIBA)
- Full dual Fast Ethernet + UTOPIA-II integration (vs MPC8270CVRMIBA)
Design Notes
Estimated: at full 266 MHz activity with 1.5 V core and 3.3 V I/O rails, expect roughly 3-6 W of dissipation in the MPC8272CZQMIBA; design a 4-layer PCB with continuous power planes on the inner layers and place 10 µF bulk + 0.1 µF ceramic decoupling pairs adjacent to each VDD/VCC ball row. Use a sequenced 1.5 V core / 2.5 V / 3.3 V I/O power-up order per the NXP datasheet to avoid I/O latch-up.
Estimated: at 4 W dissipation and a 516-BGA with θJA near 18-22 °C/W, junction temperature rise above ambient is ~75-90 °C - the industrial +105 °C rating leaves only ~10-15 °C of headroom without airflow. Provide a minimum 100x100 mm copper pad array or a small clip-on heatsink; verify with a thermal probe in the worst-case corner of the BGA.
Use a 1.0 mm-pitch BGA land pattern with non-solder-mask-defined (NSMD) pads for reliable 516-ball attachment. Route the 60x bus on inner layers with length-matched ±150 mils, and place four 0.01 µF decoupling caps symmetrically around the BGA corners to suppress simultaneous-switching noise on the data bus.
The MPC8272CZQMIBA is in NXP EOL status - do not start a new design without consulting the published PCN. The trailing 'I' in the part number is the industrial temperature flag; misreading it as 'I = internal' has caused engineers to order commercial-temperature parts that fail outdoor qualification.
Compliance Information
Lifecycle is EOL per NXP product page; full material declaration (RoHS, REACH, lead-free, halogen-free) not present in the verified snippet set - confirm directly with NXP customer support before a regulated-market shipment.
