MPC8313EVRAFF - PowerPC e300c3 MPU 333MHz 516-TEPBGA | NXP
N.º de pieza: MPC8313EVRAFF ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.75 | $3.175,00 |
| 500 | $28.9 | $14.450,00 |
| 1.000 | $26.4 | $26.400,00 |
MPC8313EVRAFF Descripción general
What is a PowerQUICC II Pro processor? PowerQUICC II Pro is NXP/Freescale's family of integrated communications processors that combine a PowerPC host core with dedicated communication peripherals. These devices sit within the broader taxonomy of embedded microprocessors (MPU) -> communications processors -> networking SoCs. They are designed for cost-sensitive networking, industrial, and storage applications where deterministic data-plane performance and rich I/O integration eliminate the need for external bridges and ASICs.
Key features include 333 MHz e300c3 core, 16 KB I-cache and 16 KB D-cache, 32-bit DDR1/DDR2 memory controller with ECC, dual Gigabit Ethernet MACs with QoS, USB 2.0 (full/low speed), two Enhanced Local Bus controllers, 4-channel DMA, IEEE 1588 timestamp support, and an integrated security accelerator that off-loads DES/3DES/AES/SHA-1/MD5/RSA/ECC operations from the host CPU.
The architecture pairs a classic Book-E PowerPC core with a system-on-chip peripheral set, allowing OEMs to build single-BOM designs that route gigabit traffic, terminate IPSec tunnels, and run Linux or VxWorks without external coprocessors. The integrated RGMII interfaces simplify PHY connection, while the SEC engine sustains multi-hundred-megabit encrypted throughput that a software-only stack on the e300c3 core cannot match.
Typical applications include industrial Ethernet routers and gateways, low-end branch-office VPN routers, secure access points, networked industrial controllers, SOHO NAS heads, and protocol converters in automation and smart-grid infrastructure. The crypto block also makes it suitable for payment terminals and embedded security appliances.
When designing with this MPU, allocate one PCB layer to the 27 mm BGA breakout fanout, supply 1.0 V core (0.95 V to 1.05 V tolerance) with bulk decoupling near the ball grid, and use impedance-controlled traces for RGMII and DDR. Avoid routing switching nodes beneath the BGA to keep the noise floor on the sensitive analog PLL supply low.
This page synthesizes distributor pricing, same-family drop-in alternatives within the PowerQUICC II Pro line, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para MPC8313EVRAFF — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8313EVRAFF (mismo factor de forma y huella) — difiere en Ethernet, Local Bus, Memory Controller, Package, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8313EZQAFF
✅ Sustitución directa✓ En stock
$22.5 / unidad
Ver hoja de datos →MPC8313EVRAGF
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8313CVRAFG
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8313EZQAFF-BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8313EVRABC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8313EVRAFF Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II Pro |
| Processor Type | PowerPC e300c3, 32-bit MPU |
| Core Speed | 333 MHz |
| Number of Cores | 1 |
| Operating Voltage | 0.95 V to 1.05 V (core) |
| Encapsulado | 516-TEPBGA (27x27 mm) |
| Tipo de montaje | Surface Mount |
| On-chip Memory | 16 KB I-cache / 16 KB D-cache |
| Memory Controller | DDR1/DDR2 with ECC (32-bit) |
| Ethernet | 2x 10/100/1000 MAC (RGMII) |
| USB | USB 2.0 Full/Low Speed |
| Local Bus | 2x Enhanced Local Bus Controllers (16-bit) |
| Security Accelerator | SEC 2.3 (AES, 3DES, SHA-1, MD5, RSA, ECC) |
| DMA | 4-channel DMA |
Guía de configuración de pines de MPC8313EVRAFF 516-tepbga (27x27 mm)
Configuración de pines para MPC8313EVRAFF (encapsulado 516-tepbga (27x27 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8313EVRAFF.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8313EVRAFF es adecuado para 6 aplicacións: Branch-Office VPN Router, Industrial Ethernet Gateway, SOHO NAS Head / File Server, Secure Wireless Access Point, Embedded Protocol Converter, Smart-Grid Energy Communicator.
Branch-Office VPN Router
The MPC8313EVRAFF fits this application because the on-chip SEC 2.3 engine sustains hundreds of Mbps of AES/SHA IPSec throughput that the e300c3 core alone cannot deliver, while the dual Gigabit MACs terminate WAN and LAN segments without an external switch. At 333 MHz the host core still has enough headroom for routing tables, NAT, and a Linux/VxWorks user plane. Placed on a router main board with external DDR2-800 SO-DIMM and an RGMII PHY, it forms a single-chip branch-office VPN appliance. The integrated IEEE 1588 time-stamping also enables service-provider-style QoS and SLA timestamping at the line side.
Recomendado
Industrial Ethernet Gateway
The MPC8313EVRAFF suits industrial gateway designs because its dual Gigabit MACs handle deterministic Ethernet/IP, Profinet, or Modbus TCP traffic while the dual Enhanced Local Bus controllers expose a parallel interface to legacy industrial peripherals or FPGA-based I/O. The 32-bit DDR2 controller with ECC adds parity, and the integrated 4-channel DMA moves bulk acquisition buffers without host-CPU intervention. Combined with the 516-TEPBGA's industrial temperature screening on the ZQAFF variant, the platform is well suited to factory-floor environmental specs.
Recomendado
SOHO NAS Head / File Server
The MPC8313EVRAFF operates as a low-cost NAS head because the local bus and USB 2.0 ports give direct attachment for SATA/SCSI bridges or RAID controllers, while the dual Gigabit MACs handle 1+1 link aggregation with line-rate SMB/NFS throughput above the 100 Mbps barrier. At 333 MHz the e300c3 core is fast enough to run Samba and inode management without throughput bottlenecks, and the integrated crypto engine accelerates file-system encryption. Stacked with a SATA multiplier and a 1 TB disk shelf, the part yields a SOHO NAS that consumes less than 8 W typical board power.
Recomendado
Secure Wireless Access Point
The MPC8313EVRAFF matches secure Wi-Fi access-point designs by combining a single Gigabit Ethernet MAC for the wired uplink with the SEC engine handling 802.11i WPA2/AES plus 802.1X/EAP offload at line-rate. The host core can run hostapd and RADIUS client software while the crypto engine sustains several hundred Mbps of AES-CCMP encryption key rotation. The 27x27 mm BGA keeps the access-point PCB compact, and the Ethernet MAC supports TimeSync/IEEE 1588 for accurate log correlation with the controller.
Recomendado
Embedded Protocol Converter
The MPC8313EVRAFF excels in protocol-converter gateways thanks to its rich peripheral mix: dual Ethernet, USB 2.0, dual local bus, I2C, SPI, and four DMA channels. Each interface becomes one side of a translation pipeline (e.g., Ethernet/IP to Modbus RTU) while the e300c3 core runs the protocol stack at deterministic timing under VxWorks. The robust 333 MHz processing budget and the ability to update firmware over the network simplify field serviceability in industrial automation installations.
Recomendado
Smart-Grid Energy Communicator
The MPC8313EVRAFF fits smart-grid communication modules because the security engine accelerates DLMS/COSEM and IEEE 2030.5 authentication, and the IEEE 1588 time-stamping supplies the precision timing required for time-of-use billing. The 32-bit DDR2 controller handles metering buffers and historical load data, while the Ethernet MAC connects to the HAN/NAN over G3-PLC or RF backbones. The TEPBGA construction supports the operating temperature spans encountered in substation cabinets and outdoor enclosures.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8313EVRAFF — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8313EZQAFF | MPC8313EVRAGF | MPC8313CVRAFG |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Core Speed | 333 MHz | 333 MHz | 400 MHz (+20%) | 333 MHz (no security block) |
| Security Engine (SEC) | SEC 2.3 included | SEC 2.3 included | SEC 2.3 included | SEC disabled / not present |
| Ethernet MACs | 2x 10/100/1000 (RGMII) | 2x 10/100/1000 | 2x 10/100/1000 | 2x 10/100/1000 |
| Memory Controller | DDR1/DDR2 32-bit ECC | DDR1/DDR2 32-bit ECC | DDR1/DDR2 32-bit ECC | DDR1/DDR2 32-bit ECC |
| Operating Temperature Grade | Commercial (AFF) | Extended / industrial | Commercial | Commercial |
| Lifecycle Status | Last time buy | Last time buy | Last time buy | Last time buy |
Diferenciadores clave
- Drop-in 516-TEPBGA family with same balls across the entire MPC8313E line (frente a MPC8308CVMAGD)
- Integrated SEC 2.3 crypto engine eliminates external accelerator in VPN/IPSec designs (frente a Generic e300 MPU without security block)
- Dual Gigabit MACs with IEEE 1588 timing (frente a Single-MAC MPU families)
Notas de diseño
The 516-TEPBGA package is a fine-pitch flip-chip BGA with a thermal lid that requires a minimum 4-layer PCB with a continuous inner plane for heat spreading. Estimated: at full activity (333 MHz core, dual GMAC at line-rate, SEC engine active), the silicon dissipates roughly 1.2-1.8 W. With a board-mounted thermal resistance theta_JA of approximately 10-14 C/W in a still-air enclosure, junction rise is bounded well below the 125 C limit, but verification in the actual chassis is recommended before locking the BOM.
Route 0.95 V-1.05 V core supply (VDD) on a dedicated plane that is bypassed at the die with 100 nF, 10 nF, and 1 uF X7R 0402 caps within 1 mm of the closest balls. Place the DDR2 matched-impedance routing (50 ohm single-ended, 100 ohm differential for clocks) on the same layer family that exits south of the package, and keep MDQS lines within 25 mil of byte-lanes to meet the MPC8313E DQ-Hold setup. Avoid routing switching node traces (e.g., local bus or DDR2 clock) under the package to minimize supply-noise coupling.
RGMII lines run at 125 MHz on the rising and falling edge and must be length-matched to within 50 mil of the corresponding clock pair on a 50-ohm controlled-impedance layer. Use a source-series termination 33 ohm at the PHY output side to damp the 2nd overshoot on 1000BASE-T transitions, and verify the receiver meeting-eye at the MPU ball-side with oscilloscope-de-embedding. DDR2 read-write leveling must be re-run after every firmware clock-change to avoid intermittent CKE errors.
Información de cumplimiento
RoHS and REACH compliance inferred from lead-free terminal finish available on the AFF family; halogen-free status not explicitly stated in the verified web snippet - confirm with NXP if required.