MPC8313CVRADDB - PowerQUICC II Pro 267MHz MPU | NXP 516-BGA
N.º de pieza: MPC8313CVRADDB ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $41.5 | $41,50 |
| 10 | $38.2 | $382,00 |
| 100 | $33.8 | $3.380,00 |
| 500 | $28.95 | $14.475,00 |
| 1.000 | $24.6 | $24.600,00 |
MPC8313CVRADDB Descripción general
A microprocessor (MPU) is an integrated circuit that integrates a central processing unit, memory controller, and peripheral subsystems on a single die. Within the broader taxonomy, the MPC8313CVRADDB sits as: MPU -> embedded processor -> microprocessor -> integrated circuit -> semiconductor. The PowerQUICC II Pro line historically serves networking, storage, and industrial control designs that benefit from on-chip QUICC Engine communications acceleration.
Key features include a 32-bit PowerPC e300c3 core running at 267 MHz, integrated DDR1/DDR2 memory controller, dual 10/100/1000 Ethernet MACs, USB 2.0 (High-Speed) with on-chip PHY, PCI Express interface (one x1 lane), and a dedicated QUICC Engine communications accelerator. The 516-ball TEPBGA package exposes the full peripheral set while providing manageable thermal characteristics for industrial-grade deployments.
The device uses a 32-bit superscalar e300 core derived from the Power Architecture, with separate instruction and data MMUs and hardware table-walk support. The QUICC Engine offloads protocol processing (e.g., HDLC, ATM, IEEE 1588 timestamping) from the main core, allowing wire-rate handling of multiple serial interfaces including TDM, UART, and SPI. This hardware partitioning is what historically differentiated PowerQUICC from generic ARM SoCs in the same era.
Typical applications include industrial routers and gateways, networked printers, factory automation controllers, branch-office routers, and storage area network (SAN) controllers. Designers value the MPC8313 family for its long-lived NXP/Freescale software support and proven reliability in 24/7 networking equipment.
When designing with this part, allocate adequate PCB area for the 27x27 mm BGA footprint with microvia stack-up, and plan thermal dissipation assuming industrial ambient temperatures. DDR2 termination, reference voltage, and impedance-controlled routing are required for signal integrity.
This page synthesizes distributor pricing, drop-in alternatives within the MPC8313 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para MPC8313CVRADDB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8313CVRADDB (mismo factor de forma y huella) — difiere en Memory Controller, USB, Core Architecture, Ethernet, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8313EVRADDB
✅ Sustitución directa✓ En stock
$19.95 / unidad
Ver hoja de datos →MPC8313CVRADDC
✅ Sustitución directa✓ En stock
$19.95 / unidad
Ver hoja de datos →MPC8313CVRAFFC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8313ZQADDB
✅ Sustitución directa✓ En stock
$24.5 / unidad
Ver hoja de datos →MPC8313VRADDB
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$25.1 / unidad
Ver hoja de datos →MPC8313CVRADDB Valores máximos y características eléctricas
| Core Architecture | PowerPC e300c3 |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum Core Frequency | 267 MHz |
| Encapsulado | 516-TEPBGA (27x27 mm) |
| Package Code | BGA |
| Terminal Form | Ball |
| Number of Terminals | 516 |
| Tipo de montaje | Surface Mount |
| Operating Temperature Grade | Industrial |
| Memory Controller | DDR1/DDR2 SDRAM |
| Ethernet | Dual 10/100/1000 MAC |
| USB | USB 2.0 High-Speed with integrated PHY |
| PCI Express | 1 x PCIe x1 lane |
| Communications Accelerator | QUICC Engine |
| Encryption | Without (W/O ENCR) |
| Series | MPC83xx |
| Estado RoHS | Compliant |
Guía de configuración de pines de MPC8313CVRADDB bga
Configuración de pines para MPC8313CVRADDB (encapsulado bga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8313CVRADDB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8313CVRADDB es adecuado para 6 aplicacións: Industrial Router and Gateway, Networked Printer and MFP Controller, Factory Automation Controller, Storage Area Network (SAN) Controller, Branch-Office Router and VPN Endpoint, Embedded Industrial PC and HMI.
Industrial Router and Gateway
The MPC8313CVRADDB's dual Gigabit Ethernet MACs, integrated QUICC Engine protocol accelerator, and PCIe x1 lane make it ideal for industrial router and gateway designs. The e300c3 core at 267 MHz delivers enough processing headroom for routing table lookup, NAT, firewall state tracking, and web management interfaces, while the QUICC Engine offloads HDLC/PPP/frame relay termination at wire rate. Paired with DDR2 memory and industrial-grade -40C to +85C operation, the part supports 24/7 deployment in factory-floor and branch-office networking equipment without active cooling.
Recomendado
Networked Printer and MFP Controller
Office multifunction printers and high-speed networked printers benefit from the MPC8313CVRADDB's combination of USB 2.0 High-Speed PHY, Gigabit Ethernet, and DDR2 controller. The e300c3 core runs the printer firmware stack (PostScript/PCL interpreter, image rasterization pipeline) while the QUICC Engine handles legacy serial interfaces for service technicians. The 516-TEPBGA package integrates cleanly onto a printer mainboard alongside scanner ASICs and motor controllers, and NXP's long-lived PowerQUICC software ecosystem accelerates time-to-market for printer OEMs.
Recomendado
Factory Automation Controller
Programmable logic controllers (PLCs), motion controllers, and SCADA masters in factory automation use the MPC8313CVRADDB for its deterministic e300c3 core, deterministic interrupt latency, and industrial temperature rating. The QUICC Engine handles fieldbus protocols (Profibus, CAN bridging through serial TDM), while Ethernet ports connect to SCADA backbones. The industrial temperature grade (-40C to +85C) and long product lifecycle support (NXP/Freescale PowerQUICC lineage) make it a fit for factory equipment with 10-15 year deployment horizons.
Recomendado
Storage Area Network (SAN) Controller
Entry-level iSCSI and Fibre Channel-over-Ethernet (FCoE) storage controllers historically used PowerQUICC II Pro parts like the MPC8313CVRADDB to combine a network-facing QUICC Engine with a storage-facing PCIe link. The PCIe x1 lane connects to a SAS/SATA controller ASIC, the dual Gige MACs aggregate iSCSI traffic, and the e300c3 core runs the lightweight storage stack. Although newer ARM SoCs have largely displaced this niche, the MPC8313 family remains deployed in legacy SAN equipment with active spare-part demand.
Recomendado
Branch-Office Router and VPN Endpoint
The MPC8313CVRADDB is a long-proven platform for branch-office routers and VPN endpoints when paired with the MPC8313EVRADDB variant. The QUICC Engine accelerates frame forwarding while the host core handles routing protocols (OSPF, BGP), management plane, and policy enforcement. Hardware IPsec offload on the 'E' variant delivers sustained VPN throughput that software-only stacks cannot match at this MHz class. The compact 516-TEPBGA footprint allows fanless 1U appliance form factors.
Recomendado
Embedded Industrial PC and HMI
Human-machine interfaces (HMIs) and embedded industrial PCs use the MPC8313CVRADDB as a graphics and protocol hub, driving LVDS/DVI panels through an external bridge while the QUICC Engine aggregates fieldbus and serial data. The 267 MHz e300c3 core runs a tailored Linux distribution (NXP provides BSPs for this family) with Qt-based GUI frameworks. Industrial temperature rating and solder-ball reliability of the TEPBGA package support vibration-prone mounting locations such as vehicle dashboards, marine bridges, and machine tool panels.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8313CVRADDB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8313EVRADDB | MPC8313CVRADDC | MPC8313CVRAFFC | MPC8313ZQADDB | MPC8313VRADDB |
|---|---|---|---|---|---|---|
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Core Frequency | 267 MHz | 267 MHz | 267 MHz | 266 MHz | 266 MHz | 266 MHz |
| Encryption | No (W/O ENCR) | Yes (Security Engine) | No (W/O ENCR) | No (W/O ENCR) | No (W/O ENCR) | No (W/O ENCR) |
| Memory Controller | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Ethernet | Dual 10/100/1000 MAC | Dual 10/100/1000 MAC | Dual 10/100/1000 MAC | Dual 10/100/1000 MAC | Dual 10/100/1000 MAC | Dual 10/100/1000 MAC |
| USB | USB 2.0 HS with PHY | USB 2.0 HS with PHY | USB 2.0 HS with PHY | USB 2.0 HS with PHY | USB 2.0 HS with PHY | USB 2.0 HS with PHY |
| PCI Express | 1 x PCIe x1 | 1 x PCIe x1 | 1 x PCIe x1 | 1 x PCIe x1 | 1 x PCIe x1 | 1 x PCIe x1 |
Diferenciadores clave
- No on-chip encryption, lower BOM cost (frente a MPC8313EVRADDB)
- Standard 267 MHz speed grade (frente a MPC8313CVRAFFC)
- Industrial temperature grade (-40C to +85C) (frente a MPC8313CVRADDC)
Notas de diseño
The 516-TEPBGA at 1.0 mm ball pitch (27x27 mm body) requires microvia stack-up PCB technology. Plan for at least a 6-layer board with dedicated ground and power planes. Use NXP's hardware specification ball map to break out all high-speed interfaces (DDR2, PCIe, Gige RGMII) on inner layers with 50 ohm single-ended and 100 ohm differential impedance. Place decoupling capacitors within 100 mils of every power pin and add a bulk ceramic + polymer tantalum near the package's center thermal vias.
Estimated: at 267 MHz with the QUICC Engine active and both Gige MACs streaming, the MPC8313CVRADDB dissipates approximately 1.8-2.5 W. The TEPBGA package is thermally enhanced but still requires a thermal pad connected to inner ground planes through a 6x6 via array (0.3 mm drill, 0.5 mm pitch). Confirm junction temperature in your specific board environment; the industrial grade allows up to 100C junction, but lower is preferable for long-term reliability in sealed enclosures without airflow.
Do not confuse the MPC8313CVRADDB (without encryption) with the MPC8313EVRADDB (with Security Engine) - both share the same 516-TEPBGA footprint and will physically fit the same socket, but firmware expecting SEC will hang on the C variant. Also note that the 'C' speed-grade marker indicates 267 MHz core; ADDB/ADDC suffixes denote silicon revision rather than clock speed. Always cross-check the full ordering table in the NXP hardware specification before laying out your BOM.
Información de cumplimiento
RoHS compliant per NXP product page; industrial temperature grade; AEC-Q100 not applicable (this is a communications MPU, not an automotive-grade IC). Conflict-minerals compliance follows NXP's published CMRT/CRT filings.